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STM32F103T6U6

STMicroelectronics

STM32F103T6U6 by STMicroelectronics

STM32F103T6U6 microcontroller from STMicroelectronics features a 32-bit Cortex-M3 CPU, operates at up to 16 MHz, and supports multiple connectivity options like CAN and I2C. With a supply voltage range of 2-3.6 V, it's ideal for industrial applications. Its compact design includes 36 terminals and integrated ADC channels for versatile use.

Median Price

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Lifecycle Status

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3

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1k+

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Digiode

USA . 2,491 parts In-Stock

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Vyrian

USA . 2,443 parts In-Stock

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Anansix

USA . 334 parts In-Stock

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334

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AZTECH Wire

Italy . 422 parts In-Stock

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$16.960

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422

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Microchip USA

USA . 446 parts In-Stock

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$22.753

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446

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IDEA Electronic Components Group

UK . 1,102 parts In-Stock

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$35.135

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$31.621

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MKK Technologies

India . 1,168 parts In-Stock

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$66.069

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DigiPath Technology Company

USA . 1,168 parts In-Stock

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$66.069

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QUARKTWIN TECHNOLOGY LTD

USA . 27,129 parts In-Stock

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Vigor

Singapore . 3,055 parts In-Stock

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Corphita

USA . 1,108 parts In-Stock

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Parana Technologies

USA . 560 parts In-Stock

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iodParts Technologies Inc.

India . 194 parts In-Stock

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Overview

Unlock your project’s potential with the STM32F103T6U6 from STMicroelectronics, a leader in high-quality microcontrollers. Designed for versatility, this powerful 32-bit device excels in industrial applications, ensuring reliable performance even in extreme environments. Enjoy seamless connectivity options and efficient processing capabilities that make development faster and easier. Elevate your designs with STMicroelectronics’ trusted technology, delivering unmatched value and innovation.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for easy integration into compact electronic designs, making it suitable for a variety of applications.

Maximum Supply Voltage: 3.6 V

This voltage range ensures compatibility with various power supply configurations for efficient operation.

Package Shape: SQUARE

The square package shape optimizes layout and space utilization on PCBs, facilitating denser circuit designs.

Bit Size: 32

A 32-bit architecture enhances processing capability, allowing for more complex algorithms and faster performance.

Power Supplies (V): 2.5/3.3

Support for multiple supply voltages adds flexibility in power management for diverse applications.

No. of Terminals: 36

With 36 terminals, it provides ample I/O options for connecting various components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The very thin profile and heat sink compatibility make it suitable for compact designs while ensuring thermal management.

Minimum Supply Voltage: 2 V

A low minimum supply voltage allows for operation in battery-powered devices, extending their lifespan.

Maximum Operating Temperature: 105 °C

High operating temperature rating ensures reliability in demanding industrial environments.

CPU Family: CORTEX-M3

Being part of the Cortex-M3 family enables efficient low-power performance alongside advanced processing capabilities.

Minimum Operating Temperature: -40 °C

The wide temperature range makes this microcontroller suitable for extreme environments, enhancing its versatility.

Terminal Finish: MATTE TIN

The matte tin terminal finish ensures better solderability and enhanced reliability in connections.

ADC Channels: YES

Includes ADC channels for efficient analog signal processing, making it suitable for sensor applications.

DMA Channels: YES

Direct Memory Access (DMA) channels help improve data transfer efficiency, freeing up CPU resources for other tasks.

Terminal Position: QUAD

Quad terminal positioning facilitates easier and more effective routing on PCB layouts.

ROM Words: 32768

A sizable ROM allows for complex firmware and application code, expanding the microcontroller's capabilities.

Maximum Seated Height: 1 mm

The low seated height supports compact design aesthetics and space-saving measures.

Width: 6 mm

A compact width allows for placement in tight spaces, suitable for handheld and portable devices.

Peripherals: DMA(7), TIMER(6)

Multiple peripheral features enhance functional versatility, allowing for more complex applications and processing tasks.

Maximum Clock Frequency: 16 MHz

A clock frequency of 16 MHz provides a good balance between power efficiency and performance for many applications.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures compatibility with standard soldering processes, ensuring reliable assembly.

Peak Reflow Temperature °C: 260

The microcontroller's durability at high temperatures ensures it can withstand modern manufacturing processes.

Length: 6 mm

The compact length is beneficial for designs where space is critical, enhancing the overall design efficiency.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates reliability and performance stability in challenging environments.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it provides efficient processing capabilities, making it ideal for time-sensitive applications.

RAM Bytes: 10240

Ample RAM supports more complex processing tasks and data storage, enhancing application performance.

Technology: CMOS

The use of CMOS technology ensures low power consumption and heat generation, making it suitable for energy-efficient designs.

Terminal Form: NO LEAD

No-lead terminals reduce footprint and are ideal for modern PCB assembly techniques like surface mount technology.

Analog To Digital Converters: 10-Ch 12-Bit

High-resolution ADCs provide accurate data sampling from analog sensors, enhancing application precision.

Maximum Supply Current: 50 mA

A maximum supply current of 50 mA ensures that the microcontroller can support multiple connected components.

Nominal Supply Voltage: 3.3 V

Operational at 3.3 V ensures compatibility with a vast array of sensors and peripherals.

PWM Channels: YES

PWM capabilities allow for a variety of control applications, including motor control and signal modulation.

Connectivity: CAN, I2C, IRDA, LIN, SPI, UART, USART(2)

Versatile connectivity options make it suitable for a wide range of applications in automotive, industrial, and consumer electronics.

ROM Programmability: FLASH

FLASH programmability allows for easy firmware updates and customization of applications post-manufacturing.

Terminal Pitch: 0.5 mm

The fine pitch design is suitable for high-density PCBs where space is a premium.

Moisture Sensitivity Level (MSL): 3

An MSL rating of 3 indicates adequate handling precautions are necessary, ensuring reliability for long-term applications.

Speed: 72 rpm

Provides a sufficient processing speed for a variety of tasks, balancing performance and power consumption for optimal operation.

On Chip Program ROM Width: 8

An 8-bit ROM width allows for efficient data manipulation, ideal for embedded applications.

No. of I/O Lines: 26

With 26 I/O lines, it can handle numerous external devices, offering flexibility in system design.

Technical Specifications

Microcontrollers STM32F103T6U6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N36

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

26

No. of Terminals:

36

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC36,.25SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

10240

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, IRDA, LIN, SPI, UART, USART(2)

Peripherals:

DMA(7), TIMER(6)

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

STM32F103T6U6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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