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STM32F103R6T6

STMicroelectronics

STM32F103R6T6 by STMicroelectronics

STM32F103R6T6 by STMicroelectronics is a 32-bit microcontroller with a max clock frequency of 16 MHz. It features 16-channel, 12-bit analog-to-digital converters and offers connectivity options such as CAN, I2C, IRDA, LIN, SPI, UART, and USART. This microcontroller is commonly used in industrial applications due to its temperature grade and low profile package style.

Median Price

$3.398

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

RS (Exports)

UK . 797 parts In-Stock

1+ parts

$3.398

100+ parts

$4.349

1k+ parts

-

10k+ parts

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797

$3.398

$4.349

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,119 parts In-Stock

1+ parts

$3.228

100+ parts

-

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3,119

$3.228

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Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$3.485

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-

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150

$3.485

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Vyrian

USA . 2,351 parts In-Stock

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2,351

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Anansix

USA . 2,073 parts In-Stock

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2,073

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Bristol Electronics

USA . 70 parts In-Stock

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70

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Distributors (Availability)

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Ampacity Inc.

Singapore . 422 parts In-Stock

1+ parts

$2.890

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-

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422

$2.890

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Corphita

USA . 1,884 parts In-Stock

1+ parts

$3.058

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1,884

$3.058

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Continental Prestige Electronics

USA . 6,565 parts In-Stock

1+ parts

$3.485

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$3.415

6,565

$3.485

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$3.415

Argo Parts USA

USA . 1,836 parts In-Stock

1+ parts

$3.485

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1,836

$3.485

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$3.485

100+ parts

-

1k+ parts

$3.311

10k+ parts

$3.241

1,000

$3.485

-

$3.311

$3.241

AZTECH Wire

Italy . 422 parts In-Stock

1+ parts

$12.597

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422

$12.597

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Microchip USA

USA . 128 parts In-Stock

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$24.659

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128

$24.659

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IDEA Electronic Components Group

UK . 2,378 parts In-Stock

1+ parts

$74.999

100+ parts

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$67.499

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2,378

$74.999

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$67.499

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MKK Technologies

India . 506 parts In-Stock

1+ parts

$141.031

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506

$141.031

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DigiPath Technology Company

USA . 506 parts In-Stock

1+ parts

$141.031

100+ parts

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506

$141.031

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Vigor

Singapore . 9,629 parts In-Stock

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9,629

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Lixinc

USA . 5,334 parts In-Stock

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5,334

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Parana Technologies

USA . 694 parts In-Stock

1+ parts

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100+ parts

$89.673

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694

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$89.673

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Overview

Discover the STM32F103R6T6 microcontroller by STMicroelectronics, a high-quality solution that offers exceptional value and benefits to customers. With its advanced technology and powerful features, this microcontroller is perfect for a wide range of applications. From industrial automation to consumer electronics, the STM32F103R6T6 delivers reliable performance and seamless connectivity. Trust in the renowned expertise of STMicroelectronics, a leading manufacturer known for their commitment to excellence. Upgrade your projects with ease using the STM32F103R6T6 and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes this microcontroller lightweight and durable, making it suitable for portable and rugged applications.

Surface Mount: YES

This microcontroller is surface mountable, allowing for easy integration onto PCBs and reducing overall system size.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller can efficiently operate within a wide range of power supply configurations.

Package Shape: SQUARE

The square package shape of this microcontroller provides a compact form factor, enabling easy placement and space-saving on PCB designs.

Bit Size: 32

With a bit size of 32, this microcontroller offers high computational capabilities, allowing for complex tasks and processing-intensive applications.

Power Supplies (V): 2.5/3.3

The availability of multiple power supply options (2.5 V/3.3 V) ensures compatibility with various power sources, providing flexibility in system design.

No. of Terminals: 64

This microcontroller features 64 terminals, allowing for effective connectivity and interfacing with external components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style of this microcontroller enhances thermal dissipation and enables dense PCB layout, making it suitable for space-constrained applications.

Minimum Supply Voltage: 2 V

With a minimum supply voltage of 2 V, this microcontroller offers energy efficiency and can operate in low-power environments.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C ensures reliable performance even in harsh industrial environments.

CPU Family: CORTEX-M3

Based on the Cortex-M3 CPU family, this microcontroller provides efficient processing capabilities and supports a wide range of software development tools and libraries.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this microcontroller can withstand extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish ensures reliable electrical connections and resistance against corrosion, making this microcontroller suitable for long-term operation.

ADC Channels: YES

The presence of ADC channels allows for analog signal acquisition, enabling the microcontroller to interface with sensors and capture real-world data accurately.

DMA Channels: YES

With DMA channels, this microcontroller can efficiently transfer data between peripherals and memory without CPU involvement, enhancing overall system performance.

Terminal Position: QUAD

The quad terminal position provides a stable mechanical connection and simplifies PCB assembly, contributing to a reliable and robust system design.

ROM Words: 32768

With a ROM capacity of 32768 words, this microcontroller offers sufficient non-volatile memory for storing program code, enabling complex firmware implementation.

Maximum Seated Height: 1.6 mm

The low seated height of 1.6 mm makes this microcontroller suitable for space-constrained applications where component height is critical.

Width: 10 mm

With a width of 10 mm, this microcontroller offers a compact form factor, facilitating placement on PCBs with tight space constraints.

Peripherals: DMA(7), TIMER(6)

The presence of 7 DMA and 6 TIMER peripherals enhances system capabilities and allows for efficient data transfer and precise timing control.

Maximum Clock Frequency: 16 MHz

With a maximum clock frequency of 16 MHz, this microcontroller offers fast and responsive processing, enabling real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

The microcontroller has a maximum time of 30 seconds at peak reflow temperature, ensuring reliable solder connections during assembly processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for proper solder melting and component attachment, ensuring robust solder joints.

Length: 10 mm

With a length of 10 mm, this microcontroller offers a compact footprint that optimizes PCB space, enabling miniaturized and space-saving designs.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this microcontroller exhibits reliable performance and can withstand extended temperature ranges and harsh environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a microcontroller with RISC architecture, this device is well-suited for embedded systems, providing efficient execution of instructions and minimal power consumption.

RAM Bytes: 10240

The generous RAM capacity of 10240 bytes enables the microcontroller to efficiently store and manipulate data during runtime, facilitating complex algorithms and multitasking.

Technology: CMOS

Utilizing CMOS technology, this microcontroller offers low power consumption, high noise immunity, and superior integration capabilities, making it an ideal choice for energy-efficient designs.

Terminal Form: GULL WING

The gull wing terminal form provides strong mechanical stability and simplifies the soldering process, ensuring reliable connections and ease of manufacturing.

Analog To Digital Convertors: 16-Ch 12-Bit

Equipped with 16-channel 12-bit ADCs, this microcontroller can accurately digitize multiple analog signals simultaneously, enabling precise measurement and control applications.

Maximum Supply Current: 50 mA

With a maximum supply current of 50 mA, this microcontroller operates efficiently within stringent power budgets, making it suitable for low-power and battery-powered devices.

Nominal Supply Voltage: 3.3 V

The 3.3 V nominal supply voltage offers compatibility with standard power sources and ensures consistent electrical performance across a wide range of applications.

PWM Channels: YES

The presence of PWM channels allows for precise control of analog outputs, making this microcontroller suitable for applications requiring accurate voltage or current modulation.

Connectivity: CAN, I2C, IRDA, LIN, SPI, UART, USART(2)

With support for multiple communication interfaces, including CAN, I2C, IRDA, LIN, SPI, UART, and USART, this microcontroller offers versatile connectivity options for seamless integration with various peripherals and networks.

ROM Programmability: FLASH

The use of flash memory technology for ROM programmability provides flexibility, allowing for easy firmware updates and customization without requiring specialized programming equipment.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5 mm, this microcontroller facilitates fine-pitch PCB layouts, saving space and enabling high-density designs.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this microcontroller can withstand exposure to moderate moisture levels during storage and assembly processes.

Speed: 72 rpm

The microcontroller operates at a maximum speed of 72 rotations per minute (rpm), allowing for precise motor control and motion management in various applications.

On Chip Program ROM Width: 8

The on-chip program ROM width of 8 bits enables efficient storage and execution of program code, contributing to optimized memory utilization and faster program execution.

No. of I/O Lines: 51

With 51 I/O lines, this microcontroller provides ample connectivity options for interfacing with external components and peripherals, enhancing system versatility and expandability.

Technical Specifications

Microcontrollers STM32F103R6T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

51

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

10240

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, IRDA, LIN, SPI, UART, USART(2)

Peripherals:

DMA(7), TIMER(6)

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

STM32F103R6T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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