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STM32F103R4T6A

STMicroelectronics

STM32F103R4T6A by STMicroelectronics

STM32F103R4T6A by STMicroelectronics is a 32-bit microcontroller with 64 terminals, operating at up to 16 MHz. It features 6144 bytes of RAM, ADC and DMA channels, and Flash ROM programmability. Ideal for industrial applications requiring a powerful yet compact solution with a wide temperature range from -40°C to 85°C.

Median Price

$4.635

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 513 parts In-Stock

1+ parts

$5.610

100+ parts

$3.961

1k+ parts

$3.289

10k+ parts

$3.144

513

$5.610

$3.961

$3.289

$3.144

Verical

USA . 579 parts In-Stock

1+ parts

-

100+ parts

$3.660

1k+ parts

$3.021

10k+ parts

$2.956

579

-

$3.660

$3.021

$2.956

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 33 parts In-Stock

1+ parts

$3.582

100+ parts

-

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-

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33

$3.582

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Digiode

USA . 2,241 parts In-Stock

1+ parts

$5.330

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2,241

$5.330

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Vyrian

USA . 6,568 parts In-Stock

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6,568

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Anansix

USA . 1,918 parts In-Stock

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1,918

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ComSIT Distribution GmbH

Germany . 383 parts In-Stock

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383

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ComSIT USA

USA . 383 parts In-Stock

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383

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ACDS - Activité Composants Distribution Service

France . 5 parts In-Stock

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 749 parts In-Stock

1+ parts

$3.050

100+ parts

$2.974

1k+ parts

$2.958

10k+ parts

-

749

$3.050

$2.974

$2.958

-

Ampacity Inc.

Singapore . 712 parts In-Stock

1+ parts

$3.050

100+ parts

-

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712

$3.050

-

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Continental Prestige Electronics

USA . 3,540 parts In-Stock

1+ parts

$3.582

100+ parts

-

1k+ parts

-

10k+ parts

$3.511

3,540

$3.582

-

-

$3.511

Argo Parts USA

USA . 806 parts In-Stock

1+ parts

$3.582

100+ parts

-

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-

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806

$3.582

-

-

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Corphita

USA . 582 parts In-Stock

1+ parts

$5.049

100+ parts

-

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582

$5.049

-

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Vigor

Singapore . 4,806 parts In-Stock

1+ parts

$5.340

100+ parts

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4,806

$5.340

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Microchip USA

USA . 1,241 parts In-Stock

1+ parts

$25.150

100+ parts

$25.150

1k+ parts

$25.150

10k+ parts

$25.150

1,241

$25.150

$25.150

$25.150

$25.150

Aztec Data Supply Inc.

USA . 4,818 parts In-Stock

1+ parts

$37.250

100+ parts

-

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4,818

$37.250

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Corohmni

South Africa . 3 parts In-Stock

1+ parts

$52.781

100+ parts

-

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-

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3

$52.781

-

-

-

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$55.453

100+ parts

$52.680

1k+ parts

$52.680

10k+ parts

-

2,500

$55.453

$52.680

$52.680

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IDEA Electronic Components Group

UK . 283 parts In-Stock

1+ parts

$66.195

100+ parts

-

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$59.575

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283

$66.195

-

$59.575

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MKK Technologies

India . 1,038 parts In-Stock

1+ parts

$124.475

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-

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1,038

$124.475

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DigiPath Technology Company

USA . 1,038 parts In-Stock

1+ parts

$124.475

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1,038

$124.475

-

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QUARKTWIN TECHNOLOGY LTD

USA . 16,628 parts In-Stock

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16,628

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Lixinc

USA . 5,956 parts In-Stock

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5,956

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Perfect Parts

USA . 3,739 parts In-Stock

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3,739

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Parana Technologies

USA . 536 parts In-Stock

1+ parts

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100+ parts

$79.146

1k+ parts

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536

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$79.146

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Cyclops Electronics Ltd (Excess)

UK . 5 parts In-Stock

1+ parts

-

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5

-

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-

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Overview

Unlock endless possibilities with the STM32F103R4T6A microcontroller by STMicroelectronics. Boasting top-notch quality and cutting-edge technology, this device offers a wide range of applications in various industries. From IoT devices to consumer electronics, this versatile microcontroller delivers unmatched performance and efficiency. Experience seamless integration, high-speed processing, and reliable operation with the STM32F103R4T6A. Stay ahead of the curve and revolutionize your projects with this powerful solution from STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost.

Maximum Supply Voltage: 3.6 V

A higher maximum supply voltage allows for more flexibility in power supply options.

Package Shape: SQUARE

The square shape of the package provides a compact footprint, ideal for space-constrained designs.

Bit Size: 32

A 32-bit architecture enables high-performance computing and processing capabilities.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages offers compatibility with various systems and peripherals.

No. of Terminals: 64

Having 64 terminals allows for a greater number of I/O connections and peripheral interfaces.

Package Style (Meter): FLATPACK

The flatpack package style offers a low-profile design and efficient heat dissipation.

Minimum Supply Voltage: 2 V

A low minimum supply voltage ensures energy efficiency and extends battery life.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes this microcontroller suitable for industrial applications with harsh environmental conditions.

CPU Family: CORTEX-M3

The Cortex-M3 architecture provides high performance and energy efficiency for embedded applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows for reliable operation in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish ensures good conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

Built-in analog-to-digital converter channels enable the microcontroller to interface with analog sensors and peripherals.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency and reduce CPU workload.

Terminal Position: QUAD

Quad terminal positioning facilitates easy PCB layout and assembly.

ROM Words: 16384

The large ROM capacity allows for storing firmware and program code for complex applications.

Width: 10 mm

Compact width dimensions enable space-efficient PCB layout designs.

Maximum Clock Frequency: 16 MHz

A high clock frequency enables fast data processing and real-time operation.

Maximum Time At Peak Reflow Temperature (s): 30

This specifies the maximum reflow time for soldering, ensuring optimal manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures reliable solder joint formation during manufacturing.

Length: 10 mm

Compact length dimensions enable space-efficient PCB layout designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in challenging environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

A RISC-based microcontroller design provides high performance and energy efficiency for embedded applications.

RAM Bytes: 6144

The generous RAM capacity allows for efficient data storage and processing in memory-intensive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable operation.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and ensure secure connections on the PCB.

Maximum Supply Current: 45 mA

The low maximum supply current consumption contributes to energy efficiency and extended battery life.

Nominal Supply Voltage: 3.3 V

Stable 3.3V nominal supply voltage ensures consistent and reliable operation of the microcontroller.

PWM Channels: YES

Pulse Width Modulation channels enable precise control of analog outputs for motor control and power regulation.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications to the firmware and program code.

Terminal Pitch: 0.5 mm

Fine terminal pitch facilitates high-density PCB designs and compact layouts.

Moisture Sensitivity Level (MSL): 3

MSL Level 3 indicates that the microcontroller is sensitive to moisture and requires proper handling during PCB assembly.

Speed: 72 rpm

The specified speed parameter may be related to a particular peripheral or processing task of the microcontroller.

No. of I/O Lines: 51

51 I/O lines provide ample connectivity options for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers STM32F103R4T6A attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

51

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

6144

ROM Words:

16384

ROM Programmability:

FLASH

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

45 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

STM32F103R4T6A Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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