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STM32F103C6T6

STMicroelectronics

STM32F103C6T6 by STMicroelectronics

STM32F103C6T6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M3 CPU, 48 terminals, and 10240 bytes of RAM. It operates at up to 16 MHz, suitable for industrial applications requiring high-speed processing and ADC/DMA capabilities. With a compact size of 7x7 mm and low profile design, it's ideal for space-constrained projects.

Median Price

$2.444

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

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$2.444

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Digiode

USA . 3,663 parts In-Stock

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Vyrian

USA . 3,346 parts In-Stock

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Anansix

USA . 1,469 parts In-Stock

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Bristol Electronics

USA . 65 parts In-Stock

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Atlantic Semiconductor

USA . 65 parts In-Stock

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ComSIT Distribution GmbH

Germany . 21 parts In-Stock

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Microfarads

USA . 10 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 5,002 parts In-Stock

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$2.444

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-

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$2.395

5,002

$2.444

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$2.395

Argo Parts USA

USA . 1,716 parts In-Stock

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$2.444

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1,716

$2.444

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AZTECH Wire

Italy . 721 parts In-Stock

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$6.166

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721

$6.166

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Ampacity Inc.

Singapore . 1,377 parts In-Stock

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$7.000

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1,377

$7.000

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Semicontronic

India . 822 parts In-Stock

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$8.000

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$7.800

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$7.760

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822

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$7.760

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Microchip USA

USA . 143 parts In-Stock

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$17.879

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Aztec Data Supply Inc.

USA . 2,433 parts In-Stock

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$37.350

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$37.350

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IDEA Electronic Components Group

UK . 717 parts In-Stock

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$78.764

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$70.888

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$78.764

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Corohmni

South Africa . 934 parts In-Stock

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$83.135

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934

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$88.677

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$84.243

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$84.243

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$88.677

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MKK Technologies

India . 102 parts In-Stock

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$148.110

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DigiPath Technology Company

USA . 102 parts In-Stock

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$148.110

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Lixinc

USA . 9,839 parts In-Stock

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Vigor

Singapore . 5,247 parts In-Stock

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RC Electronics

USA . 4,500 parts In-Stock

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Corphita

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A-Z Elektronik GmbH

Germany . 1,466 parts In-Stock

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Kepictronics

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Parana Technologies

USA . 576 parts In-Stock

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Robosynatics

Brazil . 150 parts In-Stock

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Lucentia Tech

USA . 150 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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iodParts Technologies Inc.

India . 21 parts In-Stock

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Overview

Unlock the limitless potential of your projects with the STM32F103C6T6 by STMicroelectronics. Crafted with precision and expertise, this microcontroller offers unrivaled quality and reliability. Ideal for a wide range of applications, this product provides customers with the value they deserve. Experience the benefits of advanced technology, high performance, and seamless integration. Trust in STMicroelectronics to deliver innovation at its finest. Elevate your designs with the STM32F103C6T6 and discover a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller, making it suitable for various applications.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options, ensuring reliable operation within the specified range.

Bit Size: 32

With a 32-bit size, this microcontroller can handle complex computations and processes efficiently.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages (2.5V and 3.3V) enables compatibility with various systems and devices.

CPU Family: CORTEX-M3

The CORTEX-M3 CPU family offers high performance and energy efficiency, making this microcontroller suitable for demanding applications.

RAM Bytes: 10240

With 10240 bytes of RAM, this microcontroller can efficiently handle data storage and processing requirements.

Maximum Clock Frequency: 16 MHz

A high maximum clock frequency of 16 MHz allows for fast operation and responsiveness in real-time applications.

ROM Programmability: FLASH

The use of FLASH ROM allows for easy programming and reprogramming of the microcontroller, enhancing flexibility and ease of use.

Technical Specifications

Microcontrollers STM32F103C6T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

37

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

10240

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM32F103C6T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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