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STM32F102C4T6ATR

STMicroelectronics

STM32F102C4T6ATR by STMicroelectronics

STM32F102C4T6ATR microcontroller from STMicroelectronics features a 32-bit Cortex-M3 CPU, operates at a max voltage of 3.6V, and includes 37 I/O lines. With industrial-grade temp range (-40 °C to 85°C), it's ideal for embedded applications. Its low-profile design ensures efficient space utilization.

Median Price

$3.184

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,066 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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4,066

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Digiode

USA . 2,078 parts In-Stock

1+ parts

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-

1k+ parts

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2,078

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Anansix

USA . 1,815 parts In-Stock

1+ parts

-

100+ parts

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-

1,815

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-

-

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IBS Electronics

USA . 1,275 parts In-Stock

1+ parts

-

100+ parts

$3.184

1k+ parts

$3.071

10k+ parts

$3.324

1,275

-

$3.184

$3.071

$3.324

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 5,000 parts In-Stock

1+ parts

$2.370

100+ parts

-

1k+ parts

-

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-

5,000

$2.370

-

-

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AZTECH Wire

Italy . 704 parts In-Stock

1+ parts

$10.510

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-

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-

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-

704

$10.510

-

-

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IDEA Electronic Components Group

UK . 664 parts In-Stock

1+ parts

$21.460

100+ parts

-

1k+ parts

$19.314

10k+ parts

-

664

$21.460

-

$19.314

-

MKK Technologies

India . 1,867 parts In-Stock

1+ parts

$40.354

100+ parts

-

1k+ parts

-

10k+ parts

-

1,867

$40.354

-

-

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DigiPath Technology Company

USA . 1,867 parts In-Stock

1+ parts

$40.354

100+ parts

-

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1,867

$40.354

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QUARKTWIN TECHNOLOGY LTD

USA . 29,599 parts In-Stock

1+ parts

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29,599

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Parana Technologies

USA . 711 parts In-Stock

1+ parts

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$25.659

1k+ parts

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711

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$25.659

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Corphita

USA . 599 parts In-Stock

1+ parts

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599

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Overview

Elevate your projects with the STM32F102C4T6ATR from STMicroelectronics, a leader in high-quality microcontrollers renowned for innovation. This versatile 32-bit MCU combines low power consumption with robust performance, perfect for industrial automation, automotive applications, and IoT devices. Benefit from its reliability and extensive support resources to streamline development, reduce costs, and ensure seamless integration into your next cutting-edge solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body provides excellent protection against environmental factors, making the microcontroller suitable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient use of space on PCBs, enabling compact designs in modern electronics.

Maximum Supply Voltage: 3.6 V

This voltage range is compatible with many existing power supply systems, making it versatile for a wide range of applications.

Package Shape: SQUARE

Square package shape offers a symmetrical layout, which aids in uniform thermal management and ease of mounting on PCBs.

Bit Size: 32

The 32-bit architecture allows for more complex computations and better performance, making it suitable for advanced applications.

Power Supplies: 2.5/3.3 V

Supports two common voltage levels, ensuring compatibility with various embedded systems and enhancing integration flexibility.

No. of Terminals: 48

A higher number of terminals provides greater connectivity options, allowing for more peripherals and functions to be integrated.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

This package style is ideal for space-constrained applications, allowing for efficient layout and reduced overall height.

Minimum Supply Voltage: 2 V

Low minimum supply voltage reduces power consumption, making it suitable for battery-operated devices and energy-efficient designs.

Maximum Operating Temperature: 85 °C

The high operating temperature range ensures reliability in harsh environments, essential for industrial and outdoor applications.

CPU Family: CORTEX-M3

The ARM Cortex-M3 provides efficient processing capabilities alongside low power consumption, making it ideal for embedded applications.

Minimum Operating Temperature: -40 °C

The ability to operate in extreme cold environments extends product reliability and usage in various industrial applications.

ADC Channels: YES

Integrated ADC channels facilitate data acquisition from sensors, enhancing the versatility and capability of the microcontroller.

DMA Channels: YES

Direct Memory Access channels enable quicker data transfers and multitasking capabilities, improving overall system efficiency.

Terminal Position: QUAD

Quad terminal position simplifies PCB design and assembly processes, making integration into devices easier and more reliable.

ROM Words: 16384

With substantial ROM memory, the microcontroller can store complex programs and applications, enhancing functionality.

Maximum Seated Height: 1.6 mm

A low seated height is beneficial for compact designs and reduces the overall profile of the electronic assemblies.

Width: 7 mm

Compact width makes this microcontroller useful for tight spaces in devices, optimizing layout and design efficiency.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz ensures rapid processing capabilities for a variety of applications, striking a balance between performance and power consumption.

Length: 7 mm

A short length allows for flexible board designs, suitable for small form factor electronic devices.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this microcontroller guarantees high performance and reliability in demanding conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture enhances the efficiency of the microcontroller, leading to better performance in executing instructions.

RAM Bytes: 4096

Ample RAM capacity supports more complex tasks and data processing, which is vital for enriching the functionality of applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, essential for portable and efficient electronic devices.

Terminal Form: GULL WING

Gull wing terminals enhance soldering efficiency and reliability during assembly, ensuring robust connections in the final product.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage aligns with many common applications, simplifying power supply design and enhancing compatibility.

PWM Channels: YES

Pulse Width Modulation capabilities enable precise control over motors and lights, broadening application potential.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications, ensuring the product can adapt to changing requirements.

Terminal Pitch: 0.5 mm

The fine pitch of 0.5 mm allows for efficient packing of pins on space-constrained boards, ideal for advanced circuit designs.

Speed: 48 rpm

A speed rating of 48 rpm is sufficient for controlling various low-speed applications reliably, enhancing functionality across projects.

No. of I/O Lines: 37

With 37 input/output lines, users can connect a variety of components and sensors, supporting diverse applications in embedded systems.

Technical Specifications

Microcontrollers STM32F102C4T6ATR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of I/O Lines:

37

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM32F102C4T6ATR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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