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STM32F101VFT6TR

STMicroelectronics

STM32F101VFT6TR by STMicroelectronics

STM32F101VFT6TR by STMicroelectronics is a 32-bit microcontroller with 80 I/O lines, 81920 bytes of RAM, and 786432 ROM words. It operates at a max clock frequency of 16 MHz and has DAC, ADC, and PWM channels for versatile applications in industrial-grade environments.

Median Price

$6.043

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$6.043

10k+ parts

$5.821

5,000

-

-

$6.043

$5.821

EBV Elektronik

Germany . 2,000 parts In-Stock

1+ parts

-

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2,000

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Distributors (In-Stock)

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Sensible Micro Corp

USA . 121,000 parts In-Stock

1+ parts

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121,000

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Vyrian

USA . 3,474 parts In-Stock

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3,474

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Anansix

USA . 749 parts In-Stock

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749

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Digiode

USA . 343 parts In-Stock

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343

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-

Distributors (Availability)

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Vigor

Singapore . 1,680 parts In-Stock

1+ parts

$10.150

100+ parts

-

1k+ parts

-

10k+ parts

-

1,680

$10.150

-

-

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AZTECH Wire

Italy . 73 parts In-Stock

1+ parts

$20.220

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-

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-

73

$20.220

-

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Microchip USA

USA . 3,944 parts In-Stock

1+ parts

$36.064

100+ parts

-

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3,944

$36.064

-

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IDEA Electronic Components Group

UK . 378 parts In-Stock

1+ parts

$79.395

100+ parts

-

1k+ parts

$71.456

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378

$79.395

-

$71.456

-

MKK Technologies

India . 420 parts In-Stock

1+ parts

$149.297

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420

$149.297

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DigiPath Technology Company

USA . 420 parts In-Stock

1+ parts

$149.297

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420

$149.297

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iodParts Technologies Inc.

India . 447,000 parts In-Stock

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447,000

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QUARKTWIN TECHNOLOGY LTD

USA . 21,774 parts In-Stock

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21,774

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Lixinc

USA . 15,544 parts In-Stock

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15,544

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Corphita

USA . 4,097 parts In-Stock

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4,097

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Perfect Parts

USA . 3,774 parts In-Stock

1+ parts

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3,774

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Parana Technologies

USA . 2,131 parts In-Stock

1+ parts

-

100+ parts

$94.929

1k+ parts

-

10k+ parts

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2,131

-

$94.929

-

-

Overview

Revolutionize your electronic designs with the STM32F101VFT6TR microcontroller by STMicroelectronics. Known for their high-quality products, STMicroelectronics delivers superior performance and reliability. This versatile microcontroller is perfect for a wide range of applications, offering customers value and flexibility. From consumer electronics to industrial automation, this product provides countless benefits and advantages. Upgrade your projects today with the STM32F101VFT6TR and experience the difference in efficiency and functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

The surface mount capability allows for easy integration into circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows the microcontroller to operate efficiently even in applications with varying power requirements.

Bit Size: 32

The 32-bit architecture enables the microcontroller to handle complex computations and process data efficiently, making it suitable for advanced applications.

DAC Channels: YES

The presence of DAC channels allows for analog signal output, enabling the microcontroller to interface with external components such as sensors and actuators.

Power Supplies (V): 2.5/3.3

The multiple power supply options provide flexibility in powering the microcontroller, ensuring compatibility with various voltage sources.

No. of Terminals: 100

The large number of terminals provide ample connectivity options for interfacing with peripherals and external devices, enhancing the versatility of the microcontroller.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style allows for compact and efficient placement on circuit boards, optimizing space usage in electronic designs.

Minimum Supply Voltage: 2 V

The low minimum supply voltage ensures the microcontroller can operate in low power settings, making it suitable for battery-powered applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range makes the microcontroller suitable for industrial applications where temperature fluctuations are common.

CPU Family: CORTEX-M3

The Cortex-M3 CPU family offers high performance and efficiency, enabling the microcontroller to execute complex tasks with speed and accuracy.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows the microcontroller to function reliably in harsh environmental conditions, making it suitable for outdoor or automotive applications.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to convert analog signals from external sensors or inputs into digital data, facilitating precise measurements and control.

DMA Channels: YES

The availability of DMA channels allows for efficient data transfer between peripherals and memory without CPU intervention, improving overall system performance.

Terminal Position: QUAD

The quad terminal position facilitates easy and secure connections with external devices, ensuring reliable signal transmission and reduced risk of connectivity issues.

ROM Words: 786432

The large ROM capacity provides ample storage space for program instructions and data, enabling the microcontroller to support complex algorithms and applications.

Maximum Seated Height: 1.6 mm

The low maximum seated height allows for slim and compact design integration, making the microcontroller suitable for space-constrained applications.

Width: 14 mm

The compact width dimensions enable the microcontroller to fit snugly on circuit boards without occupying excess space, contributing to improved layout efficiency.

Maximum Clock Frequency: 16 MHz

The high maximum clock frequency allows the microcontroller to operate at high speeds, ensuring fast processing of data and timely execution of tasks.

Length: 14 mm

The short length dimensions contribute to the overall compact form factor of the microcontroller, facilitating integration into small electronic devices or systems.

Temperature Grade: INDUSTRIAL

The industrial temperature grade rating ensures the microcontroller can withstand rugged operating conditions and temperature extremes commonly encountered in industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture and microcontroller peripheral IC type enable the efficient execution of instructions, optimized control of peripherals, and enhanced overall system performance.

RAM Bytes: 81920

The generous RAM capacity provides ample temporary storage for data and variables during program execution, supporting multitasking and memory-intensive applications.

Technology: CMOS

The CMOS technology used in the microcontroller ensures low power consumption, high noise immunity, and compatibility with a wide range of applications and system designs.

Terminal Form: GULL WING

The gull wing terminal form factor offers secure mechanical connections and reliable signal transmission, reducing the risk of solder joint fatigue and ensuring long-term performance.

Maximum Supply Current: 41 mA

The moderate maximum supply current requirement allows for efficient power consumption and operation, making the microcontroller suitable for energy-efficient applications.

Nominal Supply Voltage: 2.4 V

The stable nominal supply voltage ensures consistent and reliable operation of the microcontroller, supporting proper functionality and performance over extended periods.

PWM Channels: YES

The availability of PWM channels enables the microcontroller to generate precise analog output signals for controlling motors, lights, and other devices, enhancing system flexibility and accuracy.

ROM Programmability: FLASH

The flash ROM programmability allows for easy and versatile reprogramming of the microcontroller firmware and software, facilitating firmware updates and customization without removing the chip.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm facilitates high-density mounting on circuit boards, enabling compact and space-efficient electronic designs with optimized signal routing.

Speed: 36 rpm

The high speed capability of 36 rpm enables the microcontroller to process data quickly and respond to input signals promptly, ensuring smooth operation and real-time control.

No. of I/O Lines: 80

The abundant number of I/O lines provides ample connectivity options for interfacing with external devices, sensors, and peripherals, enabling versatile input/output configurations and system expansion.

Technical Specifications

Microcontrollers STM32F101VFT6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

80

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

81920

ROM Words:

786432

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

36 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

41 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

2.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

STM32F101VFT6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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