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STM32F101VBT6TR

STMicroelectronics

STM32F101VBT6TR by STMicroelectronics

STM32F101VBT6TR by STMicroelectronics is a 32-bit microcontroller featuring a max supply voltage of 3.6V, 16 MHz clock speed, and 80 I/O lines. It operates in industrial temperatures from -40 °C to 85°C, ideal for embedded applications. With integrated ADC and DMA channels, it's perfect for complex control tasks.

Median Price

$3.069

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 11,000 parts In-Stock

1+ parts

-

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$3.500

10k+ parts

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11,000

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$3.500

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Arrow

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.069

10k+ parts

$3.024

1,000

-

-

$3.069

$3.024

Verical

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.069

10k+ parts

$3.024

1,000

-

-

$3.069

$3.024

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IBS Electronics

USA . 11,000 parts In-Stock

1+ parts

-

100+ parts

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$4.909

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11,000

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-

$4.909

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Digiode

USA . 4,566 parts In-Stock

1+ parts

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4,566

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Vyrian

USA . 2,025 parts In-Stock

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2,025

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Anansix

USA . 1,431 parts In-Stock

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1,431

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,629 parts In-Stock

1+ parts

$3.780

100+ parts

-

1k+ parts

-

10k+ parts

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1,629

$3.780

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AZTECH Wire

Italy . 771 parts In-Stock

1+ parts

$16.450

100+ parts

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771

$16.450

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IDEA Electronic Components Group

UK . 1,912 parts In-Stock

1+ parts

$35.138

100+ parts

-

1k+ parts

$31.624

10k+ parts

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1,912

$35.138

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$31.624

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MKK Technologies

India . 417 parts In-Stock

1+ parts

$66.074

100+ parts

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417

$66.074

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DigiPath Technology Company

USA . 417 parts In-Stock

1+ parts

$66.074

100+ parts

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417

$66.074

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Corphita

USA . 2,698 parts In-Stock

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2,698

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Component Stockers USA

USA . 1,646 parts In-Stock

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1,646

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Parana Technologies

USA . 1,044 parts In-Stock

1+ parts

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100+ parts

$42.012

1k+ parts

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1,044

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$42.012

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Overview

Unlock the power of innovation with the STM32F101VBT6TR microcontroller from STMicroelectronics, a leader in cutting-edge technology. This versatile 32-bit MCU excels in diverse applications, from industrial automation to consumer electronics, delivering unmatched performance and reliability. With its robust features and superior quality assurance, you can trust it to elevate your projects, reduce time-to-market, and enhance efficiency. Experience seamless integration and the competitive edge that comes with choosing STMicroelectronics—where excellence meets innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design and easier integration into modern circuit boards.

Maximum Supply Voltage: 3.6 V

The maximum supply voltage of 3.6 V is appropriate for low-power applications, enhancing efficiency and reducing energy consumption.

Package Shape: SQUARE

A square package shape facilitates better space utilization on PCBs, accommodating more components in a smaller footprint.

Bit Size: 32

The 32-bit architecture provides enhanced processing capabilities, allowing for more complex computations and applications.

Power Supplies (V): 2.5/3.3

Compatible with common supply voltages, enhancing versatility for various designs and systems.

No. of Terminals: 100

A higher number of terminals enables more peripheral connections, offering greater flexibility in hardware configuration.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack and low profile design allows for tighter layout on PCBs, which is essential in compact electronic devices.

Minimum Supply Voltage: 2 V

A low minimum supply voltage enhances the product's compatibility with a wide range of power management systems.

Maximum Operating Temperature: 85 °C

Designed to operate at elevated temperatures, making it suitable for industrial environments where heat may be a concern.

CPU Family: CORTEX-M3

The ARM Cortex-M3 CPU family is renowned for its balance of performance and power efficiency, ideal for embedded applications.

Minimum Operating Temperature: -40 °C

The capability to operate at low temperatures makes this microcontroller suitable for extreme environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finishes reduce oxidation and improve solderability, ensuring reliable connections.

ADC Channels: YES

Integrated ADC channels enable analog signal processing directly on the chip, simplifying design and reducing component count.

DMA Channels: YES

Direct Memory Access (DMA) improves performance by allowing data transfers without CPU intervention, optimizing processing efficiency.

Terminal Position: QUAD

Quad terminal positioning enhances soldering surface and stability on the PCB, ensuring robust connections.

ROM Words: 131072

Ample ROM memory allows for the storage of extensive code, enabling complex program functionalities.

Maximum Seated Height: 1.6 mm

A low seated height reduces space requirements on PCBs and helps create thinner devices.

Width: 14 mm

This compact width is advantageous for small form factor designs, making it easier to fit into various applications.

Peripherals: DMA(7), POR, RTC, TIMER(6)

A rich set of peripherals enhances functionality and allows for more complex application designs.

Maximum Clock Frequency: 16 MHz

The 16 MHz clock frequency supports responsive real-time control applications, crucial for embedded systems.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures that the microcontroller can endure manufacturing processes without damage.

Peak Reflow Temperature (°C): 260

It can withstand high temperatures during soldering processes, ensuring reliable manufacturing.

Length: 14 mm

Compact length aids in space-constrained applications, maintaining a clean PCB layout.

Temperature Grade: INDUSTRIAL

Designed for industrial applications ensures reliability and durability in demanding environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture allows for efficient instruction execution and contributes to lower power consumption.

RAM Bytes: 16384

Adequate RAM supports more complex operations and enhances computation performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, beneficial for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering surface area for reliable connections.

Analog To Digital Converters: 16-Ch 12-Bit

Integrated ADCs with multiple channels allow for robust data acquisition from various sensors.

Maximum Supply Current: 28.6 mA

This low maximum supply current enhances battery life in portable applications, making it energy-efficient.

Nominal Supply Voltage: 3.3 V

A common nominal voltage that is widely used, simplifying power supply design.

PWM Channels: YES

Pulse Width Modulation channels enable advanced motor control and signal generation, increasing application flexibility.

Connectivity: I2C(2), IRDA, LIN, SPI(2), USART(3)

Diverse connectivity options facilitate integration with a variety of peripherals and communication protocols.

ROM Programmability: FLASH

Flash memory programming allows for updates and modifications, enhancing the product's lifecycle and flexibility.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch supports high-density designs, allowing more functionality in a smaller space.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates moderate sensitivity, requiring standard precautions during handling.

Speed: 36 rpm

This speed rating makes the device suitable for applications requiring rotational feedback or control.

On Chip Program ROM Width: 8

The 8-bit ROM width allows for efficient memory utilization and caters to specialized embedded applications.

No. of I/O Lines: 80

With 80 I/O lines, this microcontroller offers ample connectivity for various sensors and actuators, expanding its application range.

Technical Specifications

Microcontrollers STM32F101VBT6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

80

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

36 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

28.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA, LIN, SPI(2), USART(3)

Peripherals:

DMA(7), POR, RTC, TIMER(6)

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

STM32F101VBT6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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