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STM32F101TBU6TR

STMicroelectronics

STM32F101TBU6TR by STMicroelectronics

STM32F101TBU6TR by STMicroelectronics is a 32-bit microcontroller with Cortex-M3 CPU, 131072 ROM words, and 16384 RAM bytes. It operates at a max clock frequency of 16 MHz and has 26 I/O lines. Ideal for industrial applications requiring a reliable and efficient microcontroller solution.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,019 parts In-Stock

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5,019

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Anansix

USA . 2,295 parts In-Stock

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2,295

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Digiode

USA . 652 parts In-Stock

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652

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Distributors (Availability)

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Vigor

Singapore . 5,000 parts In-Stock

1+ parts

$3.070

100+ parts

-

1k+ parts

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5,000

$3.070

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AZTECH Wire

Italy . 467 parts In-Stock

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$8.570

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467

$8.570

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IDEA Electronic Components Group

UK . 1,478 parts In-Stock

1+ parts

$21.583

100+ parts

-

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$19.425

10k+ parts

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1,478

$21.583

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$19.425

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Microchip USA

USA . 4,951 parts In-Stock

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$24.632

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4,951

$24.632

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MKK Technologies

India . 1,789 parts In-Stock

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$40.586

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1,789

$40.586

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DigiPath Technology Company

USA . 1,789 parts In-Stock

1+ parts

$40.586

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1,789

$40.586

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Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$57.384

100+ parts

$56.810

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$54.515

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50

$57.384

$56.810

$54.515

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Corphita

USA . 4,513 parts In-Stock

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4,513

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Parana Technologies

USA . 1,518 parts In-Stock

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$25.806

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1,518

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$25.806

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Overview

Unleash the power of innovation with the STM32F101TBU6TR microcontroller by STMicroelectronics! Crafted with precision and expertise, this chip carrier microcontroller offers unrivaled performance and reliability for a wide range of applications. Whether you're designing IoT devices, consumer electronics, or industrial automation systems, this Cortex-M3 based microcontroller is your ultimate solution. With its advanced features like ADC channels, DMA channels, and PWM channels, coupled with low power consumption and a wide operating temperature range, the STM32F101TBU6TR delivers exceptional value and efficiency to meet all your project needs. Experience seamless integration and exceptional performance like never before with the STM32F101TBU6TR microcontroller!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Supports a higher voltage range, increasing flexibility in power supply options.

Bit Size: 32

Provides sufficient processing power for handling complex tasks and calculations.

Power Supplies (V): 2.5/3.3

Compatibility with common power supply voltages ensures easy integration into existing systems.

No. of Terminals: 36

Offers a sufficient number of connections for interfacing with external components and peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Versatile package design that allows for efficient heat dissipation and compact size for space-constrained applications.

Minimum Supply Voltage: 2 V

Supports lower voltage operation, conserving power and reducing energy consumption.

Maximum Operating Temperature: 85 °C

Can withstand high temperature environments, suitable for industrial applications.

CPU Family: CORTEX-M3

Utilizes a reliable and efficient processor architecture for optimal performance.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold environments, enhancing its versatility.

Terminal Finish: MATTE TIN

Provides a durable and corrosion-resistant finish for reliable connections.

ADC Channels: YES

Allows for analog-to-digital conversion, enabling the microcontroller to interface with analog sensors and devices.

DMA Channels: YES

Supports Direct Memory Access for efficient data transfer, enhancing overall system performance.

Terminal Position: QUAD

Organized terminal layout for ease of connectivity and routing on a PCB.

ROM Words: 131072

Offers ample non-volatile memory for storing program instructions and data.

Width: 6 mm

Compact size for space-efficient PCB design and integration.

Maximum Clock Frequency: 16 MHz

Supports high-speed processing for quick and responsive operation.

Length: 6 mm

Compact form factor for versatility in mounting and placement within a system.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in harsh industrial environments with elevated temperatures.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a Reduced Instruction Set Computing architecture for efficient and optimized performance.

RAM Bytes: 16384

Provides sufficient random access memory for data storage and manipulation during program execution.

Technology: CMOS

Utilizes Complementary Metal-Oxide-Semiconductor technology for low power consumption and high noise immunity.

Terminal Form: NO LEAD

Lead-free terminals for compliance with environmental regulations and improved solder joint reliability.

Maximum Supply Current: 28.6 mA

Efficient power consumption for reduced heat generation and longer battery life.

Nominal Supply Voltage: 3.3 V

Stable and common supply voltage for reliable operation in a wide range of applications.

PWM Channels: YES

Supports Pulse Width Modulation for precise control of analog signals and devices.

ROM Programmability: FLASH

Flash memory allows for convenient and flexible reprogramming of the microcontroller's firmware.

Terminal Pitch: 0.5 mm

Close terminal spacing for compact design and efficient routing on a PCB.

Speed: 36 rpm

Capable of executing instructions and processing data at a high speed, suitable for real-time applications.

No. of I/O Lines: 26

Sufficient input/output lines for interfacing with external devices and peripherals, enhancing system connectivity.

Technical Specifications

Microcontrollers STM32F101TBU6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N36

JESD-609 Code:

e3

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

26

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC36,.25SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Speed:

36 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

28.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

6 mm

Peripheral IC Type:

Trade Compliance

STM32F101TBU6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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