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STM32F101T8U6TR

STMicroelectronics

STM32F101T8U6TR by STMicroelectronics

STM32F101T8U6TR microcontroller from STMicroelectronics features a 32-bit Cortex-M3 CPU, operates at a max voltage of 3.6V, and includes 10 ADC channels. With industrial-grade temp range (-40 °C to 85°C), it's ideal for embedded applications requiring robust performance. Its compact design supports various connectivity options like I2C and SPI.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,973 parts In-Stock

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8,973

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ComSIT Distribution GmbH

Germany . 6,000 parts In-Stock

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6,000

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Digiode

USA . 3,098 parts In-Stock

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3,098

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Anansix

USA . 953 parts In-Stock

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953

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Distributors (Availability)

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Vigor

Singapore . 5,097 parts In-Stock

1+ parts

$2.750

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5,097

$2.750

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AZTECH Wire

Italy . 537 parts In-Stock

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$11.110

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537

$11.110

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Ampacity Inc.

Singapore . 794 parts In-Stock

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$14.000

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794

$14.000

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Microchip USA

USA . 5,730 parts In-Stock

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$21.690

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5,730

$21.690

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Component Stockers USA

USA . 1,962 parts In-Stock

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$40.810

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$40.810

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IDEA Electronic Components Group

UK . 2,055 parts In-Stock

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$47.569

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$42.812

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$47.569

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$42.812

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MKK Technologies

India . 1,029 parts In-Stock

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$89.450

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$89.450

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DigiPath Technology Company

USA . 1,029 parts In-Stock

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$89.450

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$89.450

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Perfect Parts

USA . 10,080 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 8,487 parts In-Stock

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8,487

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Parana Technologies

USA . 1,661 parts In-Stock

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$56.876

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$56.876

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Metaverse IC Inc.

Canada . 557 parts In-Stock

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557

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Corphita

USA . 200 parts In-Stock

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200

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Overview

Unlock your project's potential with the STM32F101T8U6TR microcontroller from STMicroelectronics, a trusted leader in semiconductor innovation. Designed for versatility and efficiency, this 32-bit powerhouse ensures high performance across diverse applications—from industrial automation to smart home devices. With robust features like integrated ADCs and multiple communication interfaces, it offers reliability and scalability, empowering developers to create advanced solutions while benefiting from ST's commitment to quality and support. Choose the STM32F101T8U6TR for unmatched performance and peace of mind in your next design!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for efficient use of board space and simplifies the assembly process.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6V makes this microcontroller suitable for low-power applications.

Package Shape: SQUARE

The square package shape enhances soldering and layout flexibility on PCBs.

Bit Size: 32

The 32-bit architecture provides higher performance and allows for more complex applications.

Power Supplies (V): 2.5/3.3

Compatible with both 2.5V and 3.3V power supplies, offering flexibility in design choices.

No. of Terminals: 36

A higher number of terminals facilitates more I/O options and integration with external devices.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style ensures effective thermal management, making it ideal for high-performance applications.

Minimum Supply Voltage: 2 V

The ability to operate at a minimum supply voltage of 2V enhances its applicability in battery-operated devices.

Maximum Operating Temperature: 85 °C

This temperature rating ensures reliable operation in various environments, making it suitable for industrial applications.

CPU Family: CORTEX-M3

The ARM Cortex-M3 family delivers excellent power efficiency and performance for embedded applications.

Minimum Operating Temperature: -40 °C

A wide temperature range allows for deployment in harsh environments, ensuring robust performance.

ADC Channels: YES

Built-in ADC channels enable direct sensor interfacing, enhancing functionality and reducing component count.

DMA Channels: YES

DMA channels facilitate efficient data transfers, improving processing speed and reducing CPU load.

Terminal Position: QUAD

Quad terminal position simplifies PCB routing and enables better connectivity options.

ROM Words: 65536

Ample ROM allows for the storage of complex firmware and algorithms, enhancing application capabilities.

Maximum Seated Height: 1 mm

The low seated height improves placement accuracy and reduces the risk of soldering defects.

Width: 6 mm

Compact dimensions make it suitable for space-constrained applications while maintaining performance.

Peripherals: DMA(7), POR, RTC, TIMER(6)

A variety of integrated peripherals enhances functionality and reduces the need for additional components.

Maximum Clock Frequency: 16 MHz

Adequate clock frequency provides a balanced performance suitable for many embedded applications.

Length: 6 mm

The small length complements the compact design of the microcontroller, allowing for efficient design.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability and performance in challenging environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture contributes to faster execution times and improved energy efficiency.

RAM Bytes: 10240

Generous RAM capacity supports more complex algorithms and data handling capabilities.

Technology: CMOS

CMOS technology enhances power efficiency, making it suitable for battery-operated devices.

Terminal Form: NO LEAD

No-lead terminals minimize the packaging footprint and improve thermal performance.

Analog To Digital Converters: 10-Ch 12-Bit

High-resolution ADCs provide precise measurements, ideal for applications requiring accuracy.

Maximum Supply Current: 28.6 mA

Low supply current enhances battery life in portable applications.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3V strikes a balance between power efficiency and operational performance.

PWM Channels: YES

Integrated PWM channels enable efficient control of motors and other devices directly.

Connectivity: I2C, IRDA, LIN, SPI, USART(2)

Versatile connectivity options facilitate easy integration into a wide range of applications.

ROM Programmability: FLASH

Flash ROM allows for easy updating and modification of firmware without the need for physical changes.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density PCB layouts while ensuring reliable connections.

Speed: 36 rpm

The operational speed is ideal for a range of control applications, ensuring efficient performance.

On Chip Program ROM Width: 8

8-bit ROM width supports efficient data handling and processing capabilities.

No. of I/O Lines: 26

A substantial number of I/O lines provide flexibility for various interfacing options and complex designs.

Technical Specifications

Microcontrollers STM32F101T8U6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N36

Length:

6 mm

No. of I/O Lines:

26

No. of Terminals:

36

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC36,.25SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

10240

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

36 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

28.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, LIN, SPI, USART(2)

Peripherals:

DMA(7), POR, RTC, TIMER(6)

Analog To Digital Convertors:

10-Ch 12-Bit

Trade Compliance

STM32F101T8U6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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