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STM32F101RET6TR

STMicroelectronics

STM32F101RET6TR by STMicroelectronics

STM32F101RET6TR by STMicroelectronics is a 32-bit microcontroller with 64 terminals, operating at -40 to 85°C. It features DAC and ADC channels, DMA support, and a max clock frequency of 16 MHz. Ideal for industrial applications requiring high-speed processing and precise analog-to-digital conversion.

Median Price

$4.770

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.770

10k+ parts

-

1,000

-

-

$4.770

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 46 parts In-Stock

1+ parts

$7.190

100+ parts

-

1k+ parts

-

10k+ parts

-

46

$7.190

-

-

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Classic Components Corporation

USA . 8,000 parts In-Stock

1+ parts

-

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-

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8,000

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-

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Digiode

USA . 4,698 parts In-Stock

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4,698

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Vyrian

USA . 4,159 parts In-Stock

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4,159

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Anansix

USA . 2,662 parts In-Stock

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2,662

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 3,445 parts In-Stock

1+ parts

$7.190

100+ parts

-

1k+ parts

-

10k+ parts

$7.046

3,445

$7.190

-

-

$7.046

Vigor

Singapore . 1,819 parts In-Stock

1+ parts

$8.360

100+ parts

-

1k+ parts

-

10k+ parts

-

1,819

$8.360

-

-

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AZTECH Wire

Italy . 142 parts In-Stock

1+ parts

$16.910

100+ parts

-

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142

$16.910

-

-

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Microchip USA

USA . 6,439 parts In-Stock

1+ parts

$16.994

100+ parts

-

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6,439

$16.994

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Ampacity Inc.

Singapore . 16,527 parts In-Stock

1+ parts

$19.000

100+ parts

-

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16,527

$19.000

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Semicontronic

India . 16,950 parts In-Stock

1+ parts

$25.000

100+ parts

$24.375

1k+ parts

$24.250

10k+ parts

-

16,950

$25.000

$24.375

$24.250

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Corohmni

South Africa . 443 parts In-Stock

1+ parts

$29.045

100+ parts

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443

$29.045

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Aztec Data Supply Inc.

USA . 3,083 parts In-Stock

1+ parts

$48.190

100+ parts

-

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3,083

$48.190

-

-

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IDEA Electronic Components Group

UK . 184 parts In-Stock

1+ parts

$64.562

100+ parts

-

1k+ parts

$58.106

10k+ parts

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184

$64.562

-

$58.106

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MKK Technologies

India . 523 parts In-Stock

1+ parts

$121.404

100+ parts

-

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523

$121.404

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DigiPath Technology Company

USA . 523 parts In-Stock

1+ parts

$121.404

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523

$121.404

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QUARKTWIN TECHNOLOGY LTD

USA . 29,888 parts In-Stock

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29,888

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Perfect Parts

USA . 29,120 parts In-Stock

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29,120

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iodParts Technologies Inc.

India . 18,000 parts In-Stock

1+ parts

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18,000

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Lixinc

USA . 15,002 parts In-Stock

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15,002

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Futuretech Components

Singapore . 6,000 parts In-Stock

1+ parts

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6,000

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RC Electronics

USA . 5,331 parts In-Stock

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5,331

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Corphita

USA . 4,921 parts In-Stock

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4,921

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Argo Parts USA

USA . 3,897 parts In-Stock

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3,897

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$7.046

1k+ parts

$6.831

10k+ parts

$6.687

2,000

-

$7.046

$6.831

$6.687

Authorized Procurement Solutions

USA . 1,260 parts In-Stock

1+ parts

-

100+ parts

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1,260

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Parana Technologies

USA . 925 parts In-Stock

1+ parts

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100+ parts

$77.194

1k+ parts

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925

-

$77.194

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GreenTree Electronics

Israel . 100 parts In-Stock

1+ parts

-

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100

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Overview

Unlock the full potential of your projects with the STM32F101RET6TR microcontroller by STMicroelectronics. This cutting-edge device offers unparalleled quality and reliability, backed by the reputable manufacturer's track record of excellence. Ideal for a wide range of applications, this microcontroller provides customers with unmatched value, benefits, and advantages. Whether you're looking to streamline your industrial processes, enhance your IoT devices, or innovate in the automotive sector, the STM32F101RET6TR is the perfect choice for your next project. Elevate your designs with this versatile and powerful microcontroller today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto PCBs, saving space and reducing production costs.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of systems.

Package Shape: SQUARE

The square package shape provides a compact footprint, ideal for space-constrained designs.

Bit Size: 32

A 32-bit architecture offers high computational power and performance for demanding applications.

DAC Channels: YES

Digital-to-analog converter channels enable the product to interface with analog sensors or output analog signals.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages provides flexibility in design and compatibility with different power sources.

No. of Terminals: 64

A higher number of terminals allow for more I/O options and connections to peripherals, enhancing the product's versatility.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style enables high-density PCB layout and efficient use of space.

Minimum Supply Voltage: 2 V

The low minimum supply voltage ensures compatibility with a wide range of power sources and extends the product's operational range.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and extended operation in industrial settings.

CPU Family: CORTEX-M3

The Cortex-M3 CPU family offers efficient performance and low power consumption, suitable for embedded applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function reliably in cold environments or outdoor applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and durability for reliable connections.

ADC Channels: YES

Analog-to-digital converter channels enable the product to interface with analog sensors or input analog signals.

DMA Channels: YES

Direct memory access channels improve data transfer efficiency and reduce CPU workload, enhancing overall system performance.

Terminal Position: QUAD

Quad terminal positioning simplifies PCB layout and enhances signal integrity for improved reliability.

ROM Words: 524288

Large ROM capacity allows for storing program instructions and data, enabling complex software applications to be run on the product.

Maximum Seated Height: 1.6 mm

The low maximum seated height enables the product to be installed in slim devices or applications where space is limited.

Width: 10 mm

Compact width dimension allows for efficient placement of the product on the PCB, optimizing board space usage.

Maximum Clock Frequency: 16 MHz

High maximum clock frequency provides fast processing speed and responsiveness for real-time applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable soldering during assembly processes, maintaining connection integrity.

Length: 10 mm

Compact length dimension allows for efficient placement of the product on the PCB, optimizing board space usage.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions typically found in industrial settings.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller with RISC architecture offers efficient performance and low power consumption, ideal for embedded applications.

RAM Bytes: 49152

Large RAM capacity allows for temporary data storage and efficient multitasking, enhancing the product's performance.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of systems and devices.

Terminal Form: GULL WING

Gull wing terminal form simplifies surface mount assembly and enhances solder joint reliability for robust connections.

Maximum Supply Current: 39 mA

Low maximum supply current helps in minimizing power consumption and heat generation, improving energy efficiency.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent and reliable operation of the product within specified voltage limits.

PWM Channels: YES

Pulse-width modulation channels enable precise control of analog components, such as motors or LEDs, enhancing system flexibility.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and efficient updates of software or firmware, ensuring scalability and adaptability of the product.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density placement of terminals, enabling compact PCB designs with efficient use of space.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates that the product can withstand exposure to moderate humidity levels during storage or transportation.

Speed: 36 rpm

The high operation speed of 36 rpm provides fast data processing and response times, suitable for time-critical applications.

No. of I/O Lines: 51

A high number of I/O lines offer extensive connectivity options for interfacing with external devices and peripherals, enhancing the product's versatility.

Technical Specifications

Microcontrollers STM32F101RET6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

51

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

49152

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

36 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

39 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Trade Compliance

STM32F101RET6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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