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STM32F101RBH6

STMicroelectronics

STM32F101RBH6 by STMicroelectronics

STM32F101RBH6 by STMicroelectronics is a 32-bit microcontroller with 131072 ROM words and 16384 RAM bytes. It operates at a max clock frequency of 16 MHz, suitable for industrial applications requiring high-speed processing. With 51 I/O lines and PWM channels, it offers versatile connectivity options in a compact square package.

Median Price

$2.444

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 76 parts In-Stock

1+ parts

$2.444

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76

$2.444

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Vyrian

USA . 5,044 parts In-Stock

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5,044

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Digiode

USA . 2,494 parts In-Stock

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2,494

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Chip Stock

USA . 175 parts In-Stock

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175

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Anansix

USA . 154 parts In-Stock

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154

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$2.395

100+ parts

-

1k+ parts

$2.299

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-

1,000

$2.395

-

$2.299

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Continental Prestige Electronics

USA . 5,881 parts In-Stock

1+ parts

$2.444

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-

1k+ parts

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$2.395

5,881

$2.444

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-

$2.395

Argo Parts USA

USA . 1,742 parts In-Stock

1+ parts

$2.444

100+ parts

-

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1,742

$2.444

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Vigor

Singapore . 3,768 parts In-Stock

1+ parts

$3.460

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-

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3,768

$3.460

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AZTECH Wire

Italy . 393 parts In-Stock

1+ parts

$17.702

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393

$17.702

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Ampacity Inc.

Singapore . 1,546 parts In-Stock

1+ parts

$19.000

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1,546

$19.000

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IDEA Electronic Components Group

UK . 665 parts In-Stock

1+ parts

$29.786

100+ parts

-

1k+ parts

$26.807

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665

$29.786

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$26.807

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Corohmni

South Africa . 250 parts In-Stock

1+ parts

$34.108

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250

$34.108

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Aztec Data Supply Inc.

USA . 3,053 parts In-Stock

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$41.191

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3,053

$41.191

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MKK Technologies

India . 1,690 parts In-Stock

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$56.010

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1,690

$56.010

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DigiPath Technology Company

USA . 1,690 parts In-Stock

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$56.010

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1,690

$56.010

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QUARKTWIN TECHNOLOGY LTD

USA . 10,974 parts In-Stock

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10,974

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Lixinc

USA . 8,206 parts In-Stock

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8,206

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Corphita

USA . 4,784 parts In-Stock

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4,784

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Kepictronics

USA . 3,840 parts In-Stock

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3,840

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Metaverse IC Inc.

Canada . 3,840 parts In-Stock

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3,840

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Parana Technologies

USA . 2,256 parts In-Stock

1+ parts

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$35.614

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2,256

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$35.614

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Overview

Unlock the power of innovation with the STM32F101RBH6 microcontroller by STMicroelectronics. Crafted with precision and quality materials, this versatile device is designed to meet the demands of various applications. From industrial automation to consumer electronics, this Cortex-M3 CPU family microcontroller offers exceptional performance, reliability, and flexibility. Experience seamless operation with its advanced features like ADC and DMA channels, PWM support, and high-speed clock frequency. Elevate your projects with the STM32F101RBH6 and witness the difference in efficiency and functionality it brings.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material provides durability and protection for the microcontroller, making it a reliable choice for various applications.

Surface Mount

YES - The surface-mount feature allows for easy and efficient integration of the microcontroller onto a PCB, saving time and effort during assembly.

Maximum Supply Voltage

3.6 V - With a high maximum supply voltage, this microcontroller can be used in applications that require higher voltage levels, offering versatility and compatibility.

Package Shape

SQUARE - The square shape of the package allows for compact and space-saving designs, making it ideal for applications with limited board space.

Bit Size

32 - The 32-bit architecture provides enhanced performance and efficiency for tasks that require high processing capabilities, making this microcontroller a powerful choice.

Power Supplies (V)

2.5/3.3 - The availability of different power supply options gives flexibility in designing and powering the microcontroller, catering to various voltage requirements.

No. of Terminals

64 - The ample number of terminals allows for connectivity with other components and peripherals, enabling the microcontroller to interface with a wide range of devices.

Package Style (Meter)

GRID ARRAY, FINE PITCH - The fine-pitch grid array package style offers a high level of connectivity and reliability, ensuring stable and efficient operation of the microcontroller.

Minimum Supply Voltage

2 V - The low minimum supply voltage requirement allows for operation in low-power applications, conserving energy and extending battery life.

Maximum Operating Temperature

85 °C - The high maximum operating temperature range makes this microcontroller suitable for use in harsh environments or applications that require extended temperature ranges.

Technical Specifications

Microcontrollers STM32F101RBH6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B64

JESD-609 Code:

e1

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

51

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,20

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Speed:

36 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

28.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

5 mm

Peripheral IC Type:

Trade Compliance

STM32F101RBH6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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