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STM32F101R8T6TR

STMicroelectronics

STM32F101R8T6TR by STMicroelectronics

STM32F101R8T6TR microcontroller from STMicroelectronics features a 32-bit Cortex-M3 CPU, operates at 2-3.6V, and includes 16 ADC channels. With a max clock frequency of 16 MHz and industrial-grade temp range (-40 °C to 85°C), it's ideal for embedded applications. Its compact design (10x10 mm) ensures efficient integration in various devices.

Median Price

$5.610

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,170 parts In-Stock

1+ parts

$5.610

100+ parts

$3.602

1k+ parts

$3.239

10k+ parts

$3.133

1,170

$5.610

$3.602

$3.239

$3.133

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,962 parts In-Stock

1+ parts

$5.482

100+ parts

-

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-

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3,962

$5.482

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IBS Electronics

USA . 9,600 parts In-Stock

1+ parts

-

100+ parts

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$3.661

10k+ parts

-

9,600

-

-

$3.661

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Vyrian

USA . 4,951 parts In-Stock

1+ parts

-

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4,951

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HZD GmbH

Germany . 2,856 parts In-Stock

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2,856

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Anansix

USA . 1,924 parts In-Stock

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1,924

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Chip Stock

USA . 622 parts In-Stock

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622

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Distributors (Availability)

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Corphita

USA . 352 parts In-Stock

1+ parts

$5.193

100+ parts

-

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352

$5.193

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Vigor

Singapore . 1,224 parts In-Stock

1+ parts

$5.610

100+ parts

-

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1,224

$5.610

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IDEA Electronic Components Group

UK . 1,944 parts In-Stock

1+ parts

$23.975

100+ parts

-

1k+ parts

$21.578

10k+ parts

-

1,944

$23.975

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$21.578

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MKK Technologies

India . 1,522 parts In-Stock

1+ parts

$45.084

100+ parts

-

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10k+ parts

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1,522

$45.084

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DigiPath Technology Company

USA . 1,522 parts In-Stock

1+ parts

$45.084

100+ parts

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1,522

$45.084

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Perfect Parts

USA . 41,440 parts In-Stock

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41,440

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QUARKTWIN TECHNOLOGY LTD

USA . 19,313 parts In-Stock

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19,313

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Epart123

USA . 9,000 parts In-Stock

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9,000

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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Lixinc

USA . 4,526 parts In-Stock

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4,526

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Glotronic Ltd.

UK . 1,600 parts In-Stock

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1,600

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Futuretech Components

Singapore . 1,020 parts In-Stock

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1,020

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GreenTree Electronics

Israel . 1,000 parts In-Stock

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1,000

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Parana Technologies

USA . 621 parts In-Stock

1+ parts

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100+ parts

$28.666

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621

-

$28.666

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Overview

Elevate your projects with the STM32F101R8T6TR microcontroller from STMicroelectronics, a trusted leader in semiconductor innovation. This versatile Cortex-M3 powerhouse combines exceptional performance with low power consumption, making it ideal for industrial applications, IoT devices, and automation systems. Enjoy seamless connectivity options, robust reliability, and unmatched customer support, ensuring your designs stand out in any market while delivering outstanding value and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and reliability in various environments, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for reduced PCB size and increased design flexibility, making it ideal for compact designs.

Maximum Supply Voltage: 3.6 V

The maximum supply voltage of 3.6 V is optimal for low-power applications while ensuring reliable performance under normal operating conditions.

Package Shape: SQUARE

The square package shape is efficient for mounting and allows for uniform heat distribution, which aids in thermal management.

Bit Size: 32

A 32-bit architecture provides greater processing power and the capability to handle complex algorithms, making it excellent for advanced applications.

Power Supplies (V): 2.5/3.3

Flexibility in power supply voltages allows this microcontroller to be used in various systems requiring different power levels.

No. of Terminals: 64

With 64 terminals, this microcontroller offers ample connectivity options for I/O operations, enabling multiple peripheral connections.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low profile flatpack style aids in space-constrained designs while maintaining high performance.

Minimum Supply Voltage: 2 V

A minimum supply voltage of 2 V enhances versatility, allowing usage in battery-powered devices with lower voltage requirements.

Maximum Operating Temperature: 85 °C

An operating temperature of 85 °C is suitable for industrial environments, ensuring reliability even under stress.

CPU Family: CORTEX-M3

The ARM Cortex-M3 core provides an efficient instruction set and excellent performance for a wide range of applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this microcontroller is suitable for extreme conditions, ensuring reliability in various climates.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finishes provide excellent connectivity and resistance to corrosion, enhancing the longevity of the device.

ADC Channels: YES

The inclusion of ADC channels enables analog signal processing, which is essential for interfacing with sensors and other analog components.

DMA Channels: YES

DMA channels allow for efficient data transfer without CPU intervention, improving overall system performance and reducing latency.

Terminal Position: QUAD

Quad terminal positioning enhances solder joint quality and connection reliability, essential for long-term use.

ROM Words: 65536

Significant ROM capacity allows for complex firmware and data storage, enhancing the functionality of embedded systems.

Maximum Seated Height: 1.6 mm

A maximum seated height of 1.6 mm makes this microcontroller easy to integrate into compact designs without sacrificing performance.

Width: 10 mm

A small width of 10 mm facilitates space-efficient PCB designs, making it ideal for compact project requirements.

Peripherals: DMA(7), POR, RTC, TIMER(6)

Multiple peripherals including DMA and timers improve functionality, enabling sophisticated control and monitoring capabilities.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz provides adequate speed for most applications while balancing power efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

A high tolerance for reflow temperature ensures safe soldering methods without compromising semiconductor integrity.

Peak Reflow Temperature °C: 260

This high peak reflow temperature capability ensures compatibility with modern soldering processes, enhancing manufacturing efficiency.

Length: 10 mm

A compact length of 10 mm suits space-saving applications, allowing for efficient use in diverse electronic designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures the microcontroller can withstand harsh conditions typically found in industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC microcontroller contributes to higher performance and efficiency, making it suitable for a variety of demanding applications.

RAM Bytes: 10240

A substantial amount of RAM allows for effective processing of data and execution of complex programs, enhancing operational capability.

Technology: CMOS

CMOS technology contributes to lower power consumption and higher noise immunity, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide ease of soldering and handling, improving assembly efficiency during manufacturing.

Analog To Digital Convertors: 16-Ch 12-Bit

With 16 channels of 12-bit resolution ADCs, this microcontroller effectively manages multiple sensor inputs with high accuracy.

Maximum Supply Current: 28.6 mA

A maximum supply current of 28.6 mA ensures the microcontroller can support diverse peripherals while maintaining efficiency.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3 V optimizes power consumption, making it suitable for low-energy applications.

PWM Channels: YES

PWM channels allow for precise control of motors and other devices, enhancing the versatility of the microcontroller in control systems.

Connectivity: I2C(2), IRDA, LIN, SPI(2), USART(3)

Diverse connectivity options enable easy integration with various peripherals, facilitating flexible system design.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications, making the microcontroller adaptable to changing requirements.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for higher terminal density, making it suitable for compact and complex PCB layouts.

Moisture Sensitivity Level (MSL): 3

An MSL rating of 3 indicates that the microcontroller can be stored in standard conditions, simplifying inventory management.

Speed: 36 rpm

Speed capability of 36 rpm enables the microcontroller to handle moderate-speed applications effectively.

On Chip Program ROM Width: 8

An 8-bit program ROM width allows efficient data handling and processing, supporting its role in embedded systems.

No. of I/O Lines: 51

A significant number of I/O lines increases interfacing capabilities with external devices, allowing for greater functionality in designs.

Technical Specifications

Microcontrollers STM32F101R8T6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

51

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

10240

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

36 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

28.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), IRDA, LIN, SPI(2), USART(3)

Peripherals:

DMA(7), POR, RTC, TIMER(6)

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

STM32F101R8T6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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