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STM32F100VET7B

STMicroelectronics

STM32F100VET7B by STMicroelectronics

STM32F100VET7B by STMicroelectronics is a 32-bit microcontroller with Cortex-M3 CPU, 524288 ROM words, and 32768 RAM bytes. It operates at a max clock frequency of 24 MHz and has peripherals like DMA(12), PWM, and TIMER(16). Ideal for industrial applications requiring high-speed processing and extensive I/O capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 12,362 parts In-Stock

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Digiode

USA . 1,405 parts In-Stock

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Anansix

USA . 609 parts In-Stock

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609

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Vigor

Singapore . 2,500 parts In-Stock

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$5.500

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2,500

$5.500

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AZTECH Wire

Italy . 474 parts In-Stock

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$9.880

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474

$9.880

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Microchip USA

USA . 3,281 parts In-Stock

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$20.543

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$20.543

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IDEA Electronic Components Group

UK . 805 parts In-Stock

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$25.881

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$23.293

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805

$25.881

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$23.293

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MKK Technologies

India . 591 parts In-Stock

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$48.668

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DigiPath Technology Company

USA . 591 parts In-Stock

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$48.668

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QUARKTWIN TECHNOLOGY LTD

USA . 10,147 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Corphita

USA . 1,347 parts In-Stock

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Parana Technologies

USA . 1,259 parts In-Stock

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$30.945

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$30.945

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Overview

Discover the STM32F100VET7B by STMicroelectronics, a top-of-the-line microcontroller that promises unparalleled quality and performance. Designed with cutting-edge technology, this device is perfect for a wide range of applications in various industries. With its advanced features and reliable manufacturer, customers can trust in the value and benefits this product provides. From its efficient power supplies to its extensive peripherals, the STM32F100VET7B offers unmatched advantages that will take your projects to the next level. Elevate your designs with this exceptional microcontroller today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for easy handling and longevity.

Surface Mount: YES

Convenient for easy mounting on circuit boards.

Maximum Supply Voltage: 3.6 V

Allows for higher power input for enhanced performance.

Package Shape: SQUARE

Space-saving design for compact devices.

Bit Size: 32

Provides high processing capability and performance.

Power Supplies (V): 2.5/3.3

Compatibility with standard voltage supplies for easy integration.

No. of Terminals: 100

Sufficient terminals for connecting various components in a circuit.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Sleek design for efficient use of space on circuit boards.

Minimum Supply Voltage: 2.4 V

Allows for lower power input with reliable performance.

Maximum Operating Temperature: 105 °C

Suitable for industrial environments with high temperature conditions.

CPU Family: CORTEX-M3

High-performance Cortex-M3 CPU for efficient processing.

Minimum Operating Temperature: -40 °C

Operational in extreme cold environments with reliable performance.

ADC Channels: YES

Analog-to-digital conversion capability for sensor interfacing.

DMA Channels: YES

Direct Memory Access for efficient data transfer and processing.

Terminal Position: QUAD

Quad terminal configuration for easy connectivity.

ROM Words: 524288

Large ROM capacity for storing program data.

Width: 14 mm

Compact width for space-constrained designs.

Peripherals: DMA(12), PWM, TIMER(16)

Multiple peripherals for versatile functionality in various applications.

Maximum Clock Frequency: 24 MHz

High clock frequency for fast processing speed.

Length: 14 mm

Compact length for space-saving designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance for rugged applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture microcontroller for efficient processing.

No. of Timers: 16

Multiple timer channels for precise timekeeping and control.

RAM Bytes: 32768

Sufficient RAM for data storage and manipulation.

Technology: CMOS

CMOS technology for low power consumption and high reliability.

Terminal Form: GULL WING

Gull wing terminal form for easy soldering and connection.

Maximum Supply Current: 20 mA

Low supply current for efficient power usage.

Nominal Supply Voltage: 3.3 V

Standard nominal supply voltage for compatibility.

No. of DMA Channels: 12

Multiple DMA channels for efficient data transfer.

PWM Channels: YES

Pulse Width Modulation channels for precise control signals.

Connectivity: I2C, UART(2), USART(3)

Multiple connectivity options for interfacing with external devices.

ROM Programmability: FLASH

Flash ROM programmability for easy updating of firmware.

Terminal Pitch: 0.5 mm

Fine pitch terminal for compact designs and high-density circuits.

Speed: 24 rpm

High speed processing for quick response in applications.

No. of I/O Lines: 80

Sufficient I/O lines for connecting external devices and peripherals.

Technical Specifications

Microcontrollers STM32F100VET7B attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of DMA Channels:

12

No. of I/O Lines:

80

No. of Terminals:

100

No. of Timers:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

524288

ROM Programmability:

FLASH

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

20 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Connectivity:

I2C, UART(2), USART(3)

Peripherals:

DMA(12), PWM, TIMER(16)

Trade Compliance

STM32F100VET7B Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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