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STM32F100VET6

STMicroelectronics

STM32F100VET6 by STMicroelectronics

STM32F100VET6 by STMicroelectronics is a 32-bit microcontroller with a max clock frequency of 24 MHz and operates b/w 2-3.6 V. It features 80 I/O lines, ADC, and PWM channels, making it ideal for embedded systems and automation applications. Its compact FLATPACK design ensures efficient space utilization in various projects.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,265 parts In-Stock

1+ parts

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8,265

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Digiode

USA . 3,811 parts In-Stock

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3,811

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Anansix

USA . 2,590 parts In-Stock

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2,590

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,480 parts In-Stock

1+ parts

$5.140

100+ parts

-

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2,480

$5.140

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AZTECH Wire

Italy . 128 parts In-Stock

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$10.720

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128

$10.720

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Microchip USA

USA . 3,792 parts In-Stock

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$20.141

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3,792

$20.141

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IDEA Electronic Components Group

UK . 1,769 parts In-Stock

1+ parts

$79.524

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$71.571

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1,769

$79.524

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$71.571

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MKK Technologies

India . 1,788 parts In-Stock

1+ parts

$149.539

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1,788

$149.539

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DigiPath Technology Company

USA . 1,788 parts In-Stock

1+ parts

$149.539

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1,788

$149.539

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Corphita

USA . 1,348 parts In-Stock

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1,348

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Kepictronics

USA . 330 parts In-Stock

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330

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Parana Technologies

USA . 93 parts In-Stock

1+ parts

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$95.083

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93

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$95.083

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Overview

Unlock innovation with the STM32F100VET6 microcontroller from STMicroelectronics, a leader in semiconductor excellence. Designed for versatility, this high-performance MCU seamlessly integrates into diverse applications, from consumer electronics to industrial automation. Experience unparalleled reliability and efficiency, empowering your projects with advanced features like ADC and PWM channels. Choose STM32F100VET6 for superior quality that accelerates your development journey and ensures your success.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for easy integration into various compact electronic systems, saving space while maintaining performance.

Maximum Supply Voltage: 3.6 V

This voltage range allows compatibility with a wide variety of power sources, making the microcontroller versatile for different applications.

Address Bus Width: 26

A 26-bit address bus enables access to a larger memory space, enhancing the microcontroller's capability to handle complex tasks.

Package Shape: SQUARE

The square shape of the package promotes better heat dissipation and simplifies layout designs in PCB fabrication.

Bit Size: 32

With a 32-bit architecture, this microcontroller provides better processing power and efficiency compared to lower bit sizes.

No. of Terminals: 100

Having 100 terminals allows for greater connectivity options, enabling the integration of various peripherals and I/O devices.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This style is ideal for high-density applications requiring robust connections in a compact form factor.

Minimum Supply Voltage: 2 V

The capability to operate at a minimum of 2 V enhances battery life and supports low-power applications.

ADC Channels: YES

Integrated ADC channels provide enhanced data acquisition capabilities, crucial for applications requiring sensor interfacing.

DMA Channels: YES

Built-in DMA channels allow for efficient data transfer, freeing up CPU cycles for other tasks, significantly improving performance.

Terminal Position: QUAD

Quad terminal positioning ensures symmetrical layout, allowing for better soldering and improved electrical performance.

Width: 14 mm

A compact width ensures this microcontroller can fit into smaller devices while maintaining performance.

External Data Bus Width: 16

A 16-bit external data bus facilitates efficient data handling capabilities, enabling faster communication with other components.

Maximum Clock Frequency: 24 MHz

A maximum clock frequency of 24 MHz enhances processing speed, making this microcontroller suitable for demanding applications.

Length: 14 mm

The small length is ideal for space-constrained applications, allowing for more compact designs.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture ensures high performance with lower power consumption, making it suitable for energy-efficient systems.

Terminal Form: GULL WING

Gull wing terminals facilitate easy handling and soldering during manufacturing and assembly processes.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3 V is standard in many modern electronics, ensuring compatibility with a range of devices.

PWM Channels: YES

Integrated PWM channels are perfect for applications needing precise control over motors or lights, enhancing functionality.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density designs, optimizing space without compromising on performance.

Speed: 24 rpm

A speed rating of 24 rpm signifies potential applications in control systems that require moderate speed adjustments.

No. of I/O Lines: 80

With 80 I/O lines available, this microcontroller offers robust interfacing capabilities, ideal for complex applications involving multiple sensors and actuators.

Technical Specifications

Microcontrollers STM32F100VET6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

26

Bit Size:

32

Maximum Clock Frequency:

24 MHz

DMA Channels:

YES

External Data Bus Width:

16

Length:

14 mm

No. of I/O Lines:

80

No. of Terminals:

100

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

24 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

STM32F100VET6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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