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STM32F100RDT6BTR

STMicroelectronics

STM32F100RDT6BTR by STMicroelectronics

STM32F100RDT6BTR by STMicroelectronics is a 32-bit microcontroller with 64 terminals, operating at -40 to 85°C. It features 16 timers, 12 DMA channels, and ADC/DAC capabilities. Ideal for industrial applications requiring high-speed processing and connectivity via I2C, SPI, UART interfaces.

Median Price

$6.832

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 469 parts In-Stock

1+ parts

$9.310

100+ parts

$5.780

1k+ parts

$4.420

10k+ parts

-

469

$9.310

$5.780

$4.420

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Verical

USA . 1,000 parts In-Stock

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$4.353

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1,000

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$4.353

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Distributors (In-Stock)

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Digiode

USA . 2,943 parts In-Stock

1+ parts

$7.448

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2,943

$7.448

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Chip Stock

USA . 44,794 parts In-Stock

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IBS Electronics

USA . 6,000 parts In-Stock

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$5.470

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$5.470

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Vyrian

USA . 2,422 parts In-Stock

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2,422

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Anansix

USA . 2,056 parts In-Stock

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2,056

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Semicontronic

India . 2,900 parts In-Stock

1+ parts

$3.200

100+ parts

$3.120

1k+ parts

$3.104

10k+ parts

-

2,900

$3.200

$3.120

$3.104

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Ampacity Inc.

Singapore . 2,820 parts In-Stock

1+ parts

$3.200

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-

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2,820

$3.200

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Corphita

USA . 4,513 parts In-Stock

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$7.056

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4,513

$7.056

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Vigor

Singapore . 1,502 parts In-Stock

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$7.880

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1,502

$7.880

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Corohmni

South Africa . 110 parts In-Stock

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$21.332

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110

$21.332

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Aztec Data Supply Inc.

USA . 95 parts In-Stock

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$22.060

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95

$22.060

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IDEA Electronic Components Group

UK . 272 parts In-Stock

1+ parts

$30.756

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$27.680

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272

$30.756

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$27.680

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$48.213

100+ parts

$45.803

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$45.803

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$48.213

$45.803

$45.803

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MKK Technologies

India . 1,848 parts In-Stock

1+ parts

$57.834

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1,848

$57.834

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DigiPath Technology Company

USA . 1,848 parts In-Stock

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$57.834

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1,848

$57.834

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Component Connect

USA . 117,404 parts In-Stock

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Perfect Parts

USA . 48,160 parts In-Stock

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BidChips

USA . 22,360 parts In-Stock

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Lixinc

USA . 11,449 parts In-Stock

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RC Electronics

USA . 7,487 parts In-Stock

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Argo Parts USA

USA . 4,871 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Glotronic Ltd.

UK . 1,600 parts In-Stock

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Microchip USA

USA . 1,034 parts In-Stock

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1,034

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Bastille Electronics

Australia . 200 parts In-Stock

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200

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Parana Technologies

USA . 15 parts In-Stock

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$36.773

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15

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$36.773

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Overview

Unleash the power of innovation with the STM32F100RDT6BTR by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-quality microcontrollers that redefine possibilities. Ideal for a wide range of applications, this product offers unmatched value and benefits to customers looking for seamless integration and reliable performance. Experience the advantage of cutting-edge technology with the STM32F100RDT6BTR and take your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material ensures durability and lightweight design, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards.

Maximum Supply Voltage: 3.6 V

It supports a higher supply voltage which can provide more power for processing tasks.

Bit Size: 32

A 32-bit architecture offers enhanced processing capability and potential for complex operations.

DAC Channels: YES

Digital-to-analog converter channels enable the microcontroller to interface with analog components.

No. of Terminals: 64

The abundance of terminals allows for versatile connectivity options with other devices or peripherals.

CPU Family: CORTEX-M3

The Cortex-M3 CPU family provides a balance of performance and power efficiency for various applications.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to read analog signals accurately.

DMA Channels: YES

Direct memory access channels help in efficient data transfer without CPU intervention.

ROM Words: 393216

Large ROM size allows for extensive program storage and flexibility in application development.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances processing speed and efficiency, making it suitable for real-time applications.

RAM Bytes: 32768

Sufficient RAM capacity enables the microcontroller to store and access data efficiently during operation.

Analog To Digital Convertors: 16-Ch 12-Bit

Multiple ADC channels with 12-bit resolution provide accurate analog signal conversion capabilities.

PWM Channels: YES

Pulse-width modulation channels allow for precise control of analog components such as motors or LEDs.

Technical Specifications

Microcontrollers STM32F100RDT6BTR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

24 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

12

No. of I/O Lines:

51

No. of Terminals:

64

No. of Timers:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

393216

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

19.7 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

HDMI-CEC, I2C(2), IRDA, LIN, SPI(3), UART(2), USART(3)

Peripherals:

DMA(12), POR, RTC, TIMER(16)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F100RDT6BTR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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