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STM32F100R8H7B

STMicroelectronics

STM32F100R8H7B by STMicroelectronics

STM32F100R8H7B by STMicroelectronics is a 32-bit microcontroller with 64 terminals, operating at -40 to 105 °C. It features 2 DAC and 16 ADC channels, with a max clock frequency of 24 MHz. Ideal for industrial applications requiring high-speed processing and connectivity via I2C, SPI, USART interfaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,559 parts In-Stock

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4,559

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Digiode

USA . 2,804 parts In-Stock

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2,804

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Anansix

USA . 1,814 parts In-Stock

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1,814

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Distributors (Availability)

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Vigor

Singapore . 1,754 parts In-Stock

1+ parts

$2.860

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-

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1,754

$2.860

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IDEA Electronic Components Group

UK . 2,189 parts In-Stock

1+ parts

$14.249

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-

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$12.824

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2,189

$14.249

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$12.824

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AZTECH Wire

Italy . 702 parts In-Stock

1+ parts

$17.960

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702

$17.960

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Microchip USA

USA . 8,304 parts In-Stock

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$21.949

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8,304

$21.949

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MKK Technologies

India . 493 parts In-Stock

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$26.794

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493

$26.794

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DigiPath Technology Company

USA . 493 parts In-Stock

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$26.794

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493

$26.794

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Parana Technologies

USA . 1,225 parts In-Stock

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$17.037

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1,225

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$17.037

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Corphita

USA . 410 parts In-Stock

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410

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Overview

Unleash the power of innovation with the STM32F100R8H7B microcontroller by STMicroelectronics. Designed with cutting-edge technology and precision engineering, this device offers unparalleled performance and reliability for a wide range of applications. Whether you are developing IoT devices, industrial automation systems, or consumer electronics, this product delivers exceptional value with its advanced features and high-quality components. Experience seamless connectivity, efficient power management, and superior processing capabilities with the STM32F100R8H7B, setting new standards in the world of microcontrollers. Elevate your projects to the next level with this game-changing solution from STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is cost-effective and provides good protection for the microcontroller, making it durable and long-lasting.

Maximum Supply Voltage: 3.6 V

A higher maximum supply voltage allows for flexibility in power supply options, ensuring compatibility with various systems.

ADC Channels: YES

ADC channels allow for analog-to-digital conversion, making the microcontroller suitable for applications that require sensing and processing of analog signals.

ROM Words: 65536

With a large ROM capacity of 65536 words, this microcontroller can store complex programs and data efficiently.

Maximum Clock Frequency: 24 MHz

A high maximum clock frequency of 24 MHz enables fast processing speeds and efficient performance.

RAM Bytes: 8192

The ample RAM capacity of 8192 bytes enables the microcontroller to handle multitasking and complex computations effectively.

Speed: 24 rpm

The speed of 24 rotations per minute indicates the maximum operational efficiency of the microcontroller, making it suitable for tasks that require precise timing.

Connectivity: HDMI-CEC, I2C(2), IRDA, LIN, SPI(2), USART(3)

The multiple connectivity options including HDMI-CEC, I2C, IRDA, LIN, SPI, and USART make the microcontroller versatile and compatible with various communication protocols.

Technical Specifications

Microcontrollers STM32F100R8H7B attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

24 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B64

Length:

5 mm

No. of I/O Lines:

50

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA64,8X8,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

24 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

15.7 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

HDMI-CEC, I2C(2), IRDA, LIN, SPI(2), USART(3)

Peripherals:

DMA(7), POR, RTC, TIMER(12)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F100R8H7B Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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