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STM32F072V8H6

STMicroelectronics

STM32F072V8H6 by STMicroelectronics

STM32F072V8H6 by STMicroelectronics is a versatile 32-bit microcontroller featuring a max supply voltage of 3.6V, 16 ADC channels, and 2 DAC channels. It operates in industrial temperatures from -40 °C to 85 °C, making it ideal for automation and control applications. With robust connectivity options like CAN and USB, it's perfect for embedded systems.

Median Price

$2.205

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 9 parts In-Stock

1+ parts

$2.205

100+ parts

-

1k+ parts

-

10k+ parts

-

9

$2.205

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-

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Arrow

USA . 9 parts In-Stock

1+ parts

$2.206

100+ parts

-

1k+ parts

-

10k+ parts

-

9

$2.206

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,421 parts In-Stock

1+ parts

$2.095

100+ parts

-

1k+ parts

-

10k+ parts

-

1,421

$2.095

-

-

-

Vyrian

USA . 6,330 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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6,330

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-

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Anansix

USA . 1,013 parts In-Stock

1+ parts

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1,013

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 884 parts In-Stock

1+ parts

$1.985

100+ parts

-

1k+ parts

-

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-

884

$1.985

-

-

-

Vigor

Singapore . 3,296 parts In-Stock

1+ parts

$2.450

100+ parts

-

1k+ parts

-

10k+ parts

-

3,296

$2.450

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-

-

AZTECH Wire

Italy . 213 parts In-Stock

1+ parts

$19.430

100+ parts

-

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213

$19.430

-

-

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IDEA Electronic Components Group

UK . 2,227 parts In-Stock

1+ parts

$25.321

100+ parts

-

1k+ parts

$22.789

10k+ parts

-

2,227

$25.321

-

$22.789

-

MKK Technologies

India . 2,125 parts In-Stock

1+ parts

$47.615

100+ parts

-

1k+ parts

-

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2,125

$47.615

-

-

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DigiPath Technology Company

USA . 2,125 parts In-Stock

1+ parts

$47.615

100+ parts

-

1k+ parts

-

10k+ parts

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2,125

$47.615

-

-

-

Parana Technologies

USA . 2,018 parts In-Stock

1+ parts

-

100+ parts

$30.275

1k+ parts

-

10k+ parts

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2,018

-

$30.275

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-

Overview

Unlock a world of possibilities with the STM32F072V8H6 microcontroller from STMicroelectronics. Renowned for their exceptional quality and innovation, STMicroelectronics delivers this compact powerhouse designed for a variety of applications, from industrial automation to consumer electronics. Experience unparalleled performance with its advanced peripherals and robust connectivity options, enabling seamless integration into your projects while ensuring energy efficiency and reliability. Elevate your designs and enjoy the benefits of cutting-edge technology tailored for success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable yet lightweight material ensures reliable performance in various applications.

Surface Mount: YES

Facilitates compact designs and efficient use of PCB space, making assembly easier.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages for flexibility in different circuit designs.

Package Shape: SQUARE

Provides uniform dimensions for easier integration into design layouts.

Bit Size: 32

32-bit architecture allows for improved performance and handling of larger data sets.

DAC Channels: YES

Incorporated digital-to-analog converters enable diverse audio and signal processing applications.

Power Supplies (V): 2.5/3.3

Versatility in power supply options, making it adaptable to different designs.

No. of Terminals: 100

Offers extensive connectivity options for complex projects requiring multiple inputs and outputs.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Thin profile allows for high density mounting, which is ideal for space-constrained applications.

Minimum Supply Voltage: 2 V

Operates efficiently at low voltages, catering to battery-operated or energy-efficient devices.

Maximum Operating Temperature: 85 °C

High-temperature tolerance makes it suitable for industrial applications.

CPU Family: CORTEX-M0

Low power consumption paired with high performance, ideal for embedded systems.

Minimum Operating Temperature: -40 °C

Robust performance in extreme conditions enhances the reliability in harsh environments.

ADC Channels: YES

Integration of analog-to-digital converters allows direct interfacing with analog sensors.

DMA Channels: YES

Direct Memory Access improves data handling efficiency, reducing CPU load during data transfer.

Terminal Position: BOTTOM

Bottom terminal position aids in effective heat dissipation and better assembly placement.

ROM Words: 65536

Sufficient on-chip ROM provides ample space for program storage, enhancing overall functionality.

Maximum Seated Height: 0.6 mm

Extremely low height supports designs requiring a low-profile profile, perfect for compact devices.

Digital To Analog Converters: 2-Ch 12-Bit

Provides high-resolution conversion for accurate signal representation in various applications.

Width: 7 mm

Compact width fits into smaller circuit designs, leading to space-efficient projects.

Peripherals: COMPARATOR(2), DMA(7), POR, RTC, TIMER(12)

Rich peripheral integration supports a wide range of applications, from timers to real-time clocks.

Maximum Clock Frequency: 32 MHz

High clock frequency enhances processing capabilities, suitable for demanding tasks.

Length: 7 mm

Compact length complements the width to create a small footprint for tight spaces.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, ensuring reliability and stable operation.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture allows for efficient instruction execution and simplified design.

No. of Timers: 12

Large number of timers provides extensive timing functionalities for multitasking applications.

RAM Bytes: 16384

Generous RAM allocation permits better multitasking and storage of temporary data.

Technology: CMOS

CMOS technology minimizes power consumption while maintaining high processing performance.

Terminal Form: BALL

Ball Grid Array (BGA) format allows for improved electrical performance and thermal management.

Analog To Digital Convertors: 16-Ch 12-Bit

High channel count coupled with 12-bit resolution supports sophisticated data acquisition tasks.

Maximum Supply Current: 27.6 mA

Lower supply current translates to better battery life for portable applications.

Nominal Supply Voltage: 3.3 V

Standard supply voltage suitable for most modern electronic designs, ensuring compatibility.

PWM Channels: YES

Pulse Width Modulation channels facilitate motor control and other signal modulation applications.

Connectivity: CAN, HDMI-CEC, I2C(2), I2S(2), IRDA, LIN, SPI(2), USART(4), USB

Diverse connectivity options ensure seamless integration into various systems and protocols.

ROM Programmability: FLASH

Flash programmability allows for easy updates and customization post-deployment.

Terminal Pitch: 0.5 mm

Fine terminal pitch enhances density and routing flexibility in compact PCBs.

Speed: 48 rpm

Operational speed provides adequate response times for most embedded applications.

On Chip Program ROM Width: 8

8-bit wide program ROM enhances data handling and program execution efficiency.

No. of I/O Lines: 87

High I/O line count supports complex applications requiring numerous input and output functions.

Technical Specifications

Microcontrollers STM32F072V8H6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B100

Length:

7 mm

No. of DMA Channels:

0

No. of I/O Lines:

87

No. of Terminals:

100

No. of Timers:

12

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,12X12,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

48 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

27.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, HDMI-CEC, I2C(2), I2S(2), IRDA, LIN, SPI(2), USART(4), USB

Peripherals:

COMPARATOR(2), DMA(7), POR, RTC, TIMER(12)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F072V8H6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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