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STM32F072R8T7

STMicroelectronics

STM32F072R8T7 by STMicroelectronics

STM32F072R8T7 microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates at a max voltage of 3.6V, and includes 16 ADC channels. Ideal for industrial applications, it supports various connectivity options like USB and CAN. Its compact design ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,732 parts In-Stock

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6,732

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Anansix

USA . 2,558 parts In-Stock

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2,558

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Digiode

USA . 1,883 parts In-Stock

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1,883

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,634 parts In-Stock

1+ parts

$2.570

100+ parts

-

1k+ parts

-

10k+ parts

-

1,634

$2.570

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AZTECH Wire

Italy . 766 parts In-Stock

1+ parts

$10.560

100+ parts

-

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766

$10.560

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Microchip USA

USA . 5,948 parts In-Stock

1+ parts

$20.530

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-

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5,948

$20.530

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Component Stockers USA

USA . 2,775 parts In-Stock

1+ parts

$40.490

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2,775

$40.490

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IDEA Electronic Components Group

UK . 743 parts In-Stock

1+ parts

$48.501

100+ parts

-

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$43.651

10k+ parts

-

743

$48.501

-

$43.651

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$60.836

100+ parts

$55.361

1k+ parts

$49.886

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-

2,500

$60.836

$55.361

$49.886

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MKK Technologies

India . 1,641 parts In-Stock

1+ parts

$91.204

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1,641

$91.204

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DigiPath Technology Company

USA . 1,641 parts In-Stock

1+ parts

$91.204

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1,641

$91.204

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Parana Technologies

USA . 1,286 parts In-Stock

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$57.991

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1,286

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$57.991

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Eastek

USA . 800 parts In-Stock

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800

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Corphita

USA . 272 parts In-Stock

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272

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Overview

Unlock unparalleled performance with the STM32F072R8T7 microcontroller from STMicroelectronics. Renowned for their innovative technology and reliability, ST delivers a versatile powerhouse ideal for industrial, automotive, and consumer applications. With its efficient power management, robust connectivity options, and advanced peripherals, this microcontroller ensures seamless integration and exceptional value, empowering you to create smarter solutions that stand out in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy construction ensures reliability in various applications.

Surface Mount: YES

Surface mount design allows for simplified assembly and reduced circuit board space.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage enables compatibility with a variety of power supply configurations.

Package Shape: SQUARE

Square package shape provides efficient use of space on the PCB.

Bit Size: 32

32-bit architecture supports complex computations and larger memory addressing.

DAC Channels: YES

Integrated DAC channels allow for analog output, making it suitable for applications requiring signal generation.

Power Supplies (V): 2.5/3.3

Flexible voltage supply range supports a wide range of operating conditions.

No. of Terminals: 64

A large number of terminals facilitates extensive interfacing options with other components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Low profile design is ideal for space-constrained applications and enhances thermal performance.

Minimum Supply Voltage: 2 V

Ability to operate at low voltage improves energy efficiency in battery-powered applications.

Maximum Operating Temperature: 105 °C

High operating temperature range makes it suitable for industrial applications.

CPU Family: CORTEX-M0

Cortex-M0 core provides a good balance of performance and power efficiency, ideal for IoT applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures reliable performance in harsh environments.

ADC Channels: YES

Integrated ADC channels are ideal for applications requiring precise analog input processing.

DMA Channels: YES

DMA capabilities enhance data transfer efficiency, reducing CPU load and improving application performance.

Terminal Position: QUAD

Quad terminal position allows for improved connection reliability and ease of soldering.

ROM Words: 65536

Ample ROM capacity supports more complex applications and extensive firmware.

Maximum Seated Height: 1.6 mm

Low seated height is beneficial for compact designs and improves coupling with other components.

Digital To Analog Convertors: 2-Ch 12-Bit

High-resolution DACs make this microcontroller suitable for audio and signal processing applications.

Width: 10 mm

Compact 10 mm width is appropriate for space-constrained designs.

Peripherals: COMPARATOR(2), DMA(7), POR, RTC, TIMER(12)

Rich peripheral set enhances functionality, enabling a wider range of applications.

Maximum Clock Frequency: 32 MHz

32 MHz clock frequency offers sufficient processing power for a variety of tasks.

Length: 10 mm

Short length maximizes PCB real estate, crucial for tight layouts.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability and robustness in demanding environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture promotes efficient instruction execution, optimizing performance and power use.

No. of Timers: 12

Multiple timers provide extensive timing and scheduling options for varied applications.

RAM Bytes: 16384

Sufficient RAM allows for more complex computations and efficient data handling.

Technology: CMOS

CMOS technology ensures low power consumption, which is vital for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide enhanced solder joint reliability and easier handling.

Analog To Digital Convertors: 16-Ch 12-Bit

High channel count and resolution make it suitable for applications requiring multiple sensor inputs.

Maximum Supply Current: 27.9 mA

Low maximum supply current enhances battery life in portable applications.

Nominal Supply Voltage: 3.3 V

Common nominal voltage simplifies design and power distribution.

PWM Channels: YES

PWM capabilities enable control of motors and brightness in lighting applications.

Connectivity: CAN, HDMI-CEC, I2C(2), I2S(2), IRDA, LIN, SPI(2), USART(4), USB

Versatile connectivity options provide flexibility for different communication protocols.

ROM Programmability: FLASH

Flash programmability allows for easy updates to firmware, enhancing longevity of applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density layouts and compact designs.

Speed: 48 rpm

Provides adequate processing speed for applications requiring moderate computational capabilities.

On Chip Program ROM Width: 8

8-bit ROM width enables efficient data handling and compatibility with various data formats.

No. of I/O Lines: 51

A high number of I/O lines enhances flexibility in interfacing with external components.

Technical Specifications

Microcontrollers STM32F072R8T7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of DMA Channels:

0

No. of I/O Lines:

51

No. of Terminals:

64

No. of Timers:

12

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

27.9 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, HDMI-CEC, I2C(2), I2S(2), IRDA, LIN, SPI(2), USART(4), USB

Peripherals:

COMPARATOR(2), DMA(7), POR, RTC, TIMER(12)

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F072R8T7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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