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STM32F071V8T7TR

STMicroelectronics

STM32F071V8T7TR by STMicroelectronics

STM32F071V8T7TR by STMicroelectronics is a 32-bit microcontroller with 16-Ch 12-Bit ADC, 2-Ch 12-Bit DAC, and 87 I/O lines. It operates at up to 32 MHz clock frequency and has a temperature range of -40 to +105 °C. Ideal for industrial applications requiring high-speed processing and precise analog-to-digital conversion.

Median Price

$4.079

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 973 parts In-Stock

1+ parts

$5.040

100+ parts

$3.209

1k+ parts

$2.795

10k+ parts

$2.701

973

$5.040

$3.209

$2.795

$2.701

RS (Exports)

UK . 2,000 parts In-Stock

1+ parts

-

100+ parts

$3.118

1k+ parts

$2.966

10k+ parts

-

2,000

-

$3.118

$2.966

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,000 parts In-Stock

1+ parts

$3.686

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

$3.686

-

-

-

Sensible Micro Corp

USA . 27,028 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

27,028

-

-

-

-

Vyrian

USA . 4,470 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,470

-

-

-

-

Cyclops Electronics Ltd

UK . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

Anansix

USA . 987 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

987

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 2,022 parts In-Stock

1+ parts

$2.630

100+ parts

-

1k+ parts

-

10k+ parts

-

2,022

$2.630

-

-

-

Corphita

USA . 4,773 parts In-Stock

1+ parts

$3.492

100+ parts

-

1k+ parts

-

10k+ parts

-

4,773

$3.492

-

-

-

Microchip USA

USA . 4,721 parts In-Stock

1+ parts

$16.828

100+ parts

-

1k+ parts

-

10k+ parts

-

4,721

$16.828

-

-

-

IDEA Electronic Components Group

UK . 557 parts In-Stock

1+ parts

$63.891

100+ parts

-

1k+ parts

$57.502

10k+ parts

-

557

$63.891

-

$57.502

-

MKK Technologies

India . 377 parts In-Stock

1+ parts

$120.143

100+ parts

-

1k+ parts

-

10k+ parts

-

377

$120.143

-

-

-

DigiPath Technology Company

USA . 377 parts In-Stock

1+ parts

$120.143

100+ parts

-

1k+ parts

-

10k+ parts

-

377

$120.143

-

-

-

Parana Technologies

USA . 111 parts In-Stock

1+ parts

-

100+ parts

$76.392

1k+ parts

-

10k+ parts

-

111

-

$76.392

-

-

Overview

Unlock the power of innovation with the STM32F071V8T7TR microcontroller by STMicroelectronics. Designed with quality and precision, this versatile device offers a wide range of applications in various industries. With advanced features such as ADC channels, DMA channels, and PWM capabilities, this microcontroller provides unmatched performance and reliability. Whether you're developing IoT devices, consumer electronics, or industrial automation systems, the STM32F071V8T7TR delivers value and efficiency, making it the ideal choice for your next project. Experience the difference with STMicroelectronics and revolutionize your designs today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and lightweight, making the microcontroller suitable for a wide range of applications.

Surface Mount: YES

Surface mount components are easier to handle and assemble, improving the manufacturing process.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making it versatile for different power requirements.

Package Shape: SQUARE

Square packages are compact and efficient in terms of PCB space utilization.

Bit Size: 32

With a 32-bit architecture, the microcontroller can handle complex tasks and calculations efficiently.

DAC Channels: YES

Digital-to-analog converters allow the microcontroller to interface with analog components and sensors.

No. of Terminals: 100

Sufficient number of terminals for connecting peripherals and external components to the microcontroller.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a low profile and fine pitch, making it suitable for compact designs with high density components.

Minimum Supply Voltage: 2 V

Supports low voltage operation, which can be beneficial for power efficiency in certain applications.

Maximum Operating Temperature: 105 °C

Can operate at high temperatures, suitable for industrial applications that require robust performance.

Minimum Operating Temperature: -40 °C

Capable of functioning in cold environments, making it versatile for different operating conditions.

ADC Channels: YES

Analog-to-digital converters enable the microcontroller to read analog signals from sensors accurately.

DMA Channels: YES

Direct Memory Access channels help in efficient data transfer between peripherals and memory, improving overall system performance.

Terminal Position: QUAD

Quad terminal position allows for easy PCB layout and routing of connections, simplifying the design process.

ROM Words: 65536

Large ROM capacity allows for storing program instructions and data, accommodating complex applications.

Maximum Seated Height: 1.6 mm

Low profile package design saves space and enables compact product form factors.

Digital To Analog Convertors: 2-Ch 12-Bit

Dual 12-bit DACs provide accurate conversion of digital signals to analog voltage levels.

Width: 14 mm

Compact width dimensions make the microcontroller suitable for space-constrained designs.

Peripherals: COMPARATOR(2), CRC, DMA(7), POR, PWM(6), RTC, TEMPERATURE SENSOR, TIMER(9), TSC(24), WDT

A wide range of peripherals enhances the functionality and versatility of the microcontroller for various applications.

Maximum Clock Frequency: 32 MHz

High clock frequency allows for fast processing speeds and quick execution of instructions.

Length: 14 mm

Compact length dimensions provide flexibility in PCB layout and design.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable operation in harsh environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture offers efficient performance and high throughput for real-time applications.

RAM Bytes: 16384

Adequate RAM capacity for storing data and variables during program execution, supporting multitasking operations.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the efficiency and reliability of the microcontroller.

Terminal Form: GULL WING

Gull wing terminal form enables easy soldering and rework, simplifying the assembly process.

Analog To Digital Convertors: 16-Ch 12-Bit

16-channel 12-bit ADCs allow for precise conversion of analog signals to digital data, suitable for sensor interface applications.

Nominal Supply Voltage: 3.3 V

Standard supply voltage for compatibility with common power sources and peripherals.

PWM Channels: YES

Pulse-width modulation channels enable precise control of output signals for motor control and power management applications.

Connectivity: CEC, I2C(2), I2S(2), SPI(2), USART(4)

Multiple connectivity options facilitate communication with external devices and peripherals, enhancing versatility and compatibility.

ROM Programmability: FLASH

Flash memory allows for easy reprogramming of the microcontroller, enabling firmware updates and customization.

Terminal Pitch: 0.5 mm

Fine terminal pitch for efficient PCB layout and compact design integration.

Speed: 48 rpm

High-speed performance for rapid data processing and real-time applications.

On Chip Program ROM Width: 8

8-bit on-chip program ROM width for efficient storage and execution of program instructions.

No. of I/O Lines: 87

Abundance of input and output lines for connecting to external devices and peripherals, enhancing the microcontroller's functionality.

Technical Specifications

Microcontrollers STM32F071V8T7TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

87

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CEC, I2C(2), I2S(2), SPI(2), USART(4)

Peripherals:

COMPARATOR(2), CRC, DMA(7), POR, PWM(6), RTC, TEMPERATURE SESNOR, TIMER(9), TSC(24), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F071V8T7TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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