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STM32F071CBT6TR

STMicroelectronics

STM32F071CBT6TR by STMicroelectronics

STM32F071CBT6TR by STMicroelectronics is a 32-bit microcontroller with 131072 ROM words and 16384 RAM bytes. It features 10-Ch 12-Bit ADC, 2-Ch 12-Bit DAC, and peripherals like CRC, DMA(7), PWM(6). Ideal for industrial applications requiring high-speed processing up to 32 MHz with a supply voltage range of 2-3.6 V.

Median Price

$2.223

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 12,000 parts In-Stock

1+ parts

-

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-

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$2.223

12,000

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$2.223

Distributors (In-Stock)

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Greenchips

USA . 16,800 parts In-Stock

1+ parts

$1.838

100+ parts

$1.751

1k+ parts

$1.667

10k+ parts

$1.505

16,800

$1.838

$1.751

$1.667

$1.505

Nova Conductors

Japan . 52 parts In-Stock

1+ parts

$2.924

100+ parts

-

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52

$2.924

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Martec Srl

Italy . 241,048 parts In-Stock

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Velocity Electronics

USA . 64,200 parts In-Stock

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64,200

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IBS Electronics

USA . 19,200 parts In-Stock

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$3.240

10k+ parts

$3.156

19,200

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$3.240

$3.156

SIE Connect GmbH - GreenChips

Germany . 16,800 parts In-Stock

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16,800

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Chip Stock

USA . 12,549 parts In-Stock

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Digiode

USA . 4,977 parts In-Stock

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4,977

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Bristol Electronics

USA . 4,785 parts In-Stock

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4,785

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Vyrian

USA . 4,654 parts In-Stock

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Anansix

USA . 2,169 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 17,933 parts In-Stock

1+ parts

$1.560

100+ parts

$1.521

1k+ parts

$1.513

10k+ parts

-

17,933

$1.560

$1.521

$1.513

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Ampacity Inc.

Singapore . 17,575 parts In-Stock

1+ parts

$1.560

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17,575

$1.560

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iBuyXS LLC

. 3,000 parts In-Stock

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$2.100

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3,000

$2.100

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Argo Parts USA

USA . 1,885 parts In-Stock

1+ parts

$2.764

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1,885

$2.764

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Continental Prestige Electronics

USA . 187 parts In-Stock

1+ parts

$2.764

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$2.709

187

$2.764

-

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$2.709

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$2.924

100+ parts

-

1k+ parts

$2.778

10k+ parts

$2.720

2,000

$2.924

-

$2.778

$2.720

Vigor

Singapore . 3,295 parts In-Stock

1+ parts

$4.140

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3,295

$4.140

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AZTECH Wire

Italy . 969 parts In-Stock

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$11.070

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969

$11.070

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Microchip USA

USA . 1,759 parts In-Stock

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$14.840

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1,759

$14.840

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Aztec Data Supply Inc.

USA . 1,310 parts In-Stock

1+ parts

$51.050

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1,310

$51.050

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IDEA Electronic Components Group

UK . 594 parts In-Stock

1+ parts

$54.608

100+ parts

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$49.147

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594

$54.608

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$49.147

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$76.779

100+ parts

$72.940

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$72.940

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1,000

$76.779

$72.940

$72.940

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Corohmni

South Africa . 165 parts In-Stock

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$86.266

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$86.266

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MKK Technologies

India . 749 parts In-Stock

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$102.686

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749

$102.686

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DigiPath Technology Company

USA . 749 parts In-Stock

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$102.686

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$102.686

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Component Connect

USA . 48,928 parts In-Stock

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Glotronic Ltd.

UK . 36,280 parts In-Stock

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Infinite Electronics LLP (Excess)

. 33,205 parts In-Stock

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Perfect Parts

USA . 21,504 parts In-Stock

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Technoshack Inc. (Excess)

Canada . 10,658 parts In-Stock

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Lixinc

USA . 10,127 parts In-Stock

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GreenTree Electronics

Israel . 5,000 parts In-Stock

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Corphita

USA . 4,367 parts In-Stock

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BidChips

USA . 3,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,472 parts In-Stock

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Emar International I/E

Canada . 2,375 parts In-Stock

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Futuretech Components

Singapore . 1,600 parts In-Stock

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Parana Technologies

USA . 537 parts In-Stock

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$65.292

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537

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$65.292

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iodParts Technologies Inc.

India . 20 parts In-Stock

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20

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Overview

Unlock endless possibilities with the STM32F071CBT6TR microcontroller by STMicroelectronics. Crafted with precision and expertise, this powerful device offers unparalleled performance for a wide range of applications. From smart home devices to industrial automation, this microcontroller provides seamless connectivity, efficient power management, and advanced features to enhance your projects. Embrace innovation and elevate your designs with the STM32F071CBT6TR - the ultimate solution for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for the package body.

Surface Mount: YES

Easy to integrate into circuit boards and saves space.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage requirements in applications.

Bit Size: 32

Higher bit size for processing data with more precision.

DAC Channels: YES

Supports Digital-to-Analog Conversion for versatile functionality.

No. of Terminals: 48

Sufficient terminals for connecting to other components.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures in industrial environments.

Minimum Operating Temperature: -40 °C

Operational in extreme cold conditions.

ADC Channels: YES

Analog-to-Digital Conversion capability for accurate measurements.

DMA Channels: YES

Direct Memory Access for efficient data transfer.

ROM Words: 131072

Large memory capacity for storing program data.

Digital To Analog Convertors: 2-Ch 12-Bit

Two 12-bit DAC channels for precise analog outputs.

Peripheral IC Type: MICROCONTROLLER, RISC

Uses RISC architecture for efficient processing.

RAM Bytes: 16384

Sufficient RAM for data storage and manipulation.

Technology: CMOS

Low power consumption and high noise immunity.

Analog To Digital Convertors: 10-Ch 12-Bit

Ten 12-bit ADC channels for accurate analog inputs.

PWM Channels: YES

Pulse Width Modulation support for precise control of outputs.

Connectivity: CEC, I2C(2), I2S(2), SPI(2), USART(4)

Multiple communication interfaces for connecting with other devices.

ROM Programmability: FLASH

Programmable flash memory for flexibility in updating firmware.

Technical Specifications

Microcontrollers STM32F071CBT6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of I/O Lines:

37

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CEC, I2C(2), I2S(2), SPI(2), USART(4)

Peripherals:

COMPARATOR(2), CRC, DMA(7), POR, PWM(6), RTC, TEMPERATURE SESNOR, TIMER(9), TSC(24), WDT

Analog To Digital Convertors:

10-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F071CBT6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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