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STM32F071C8U7

STMicroelectronics

STM32F071C8U7 by STMicroelectronics

STM32F071C8U7 from STMicroelectronics is a versatile 32-bit microcontroller featuring a max supply voltage of 3.6V, 48 terminals, and dual 12-bit DAC channels. It operates in extreme temperatures (-40 °C to 105 °C) and supports various connectivity options like I2C and SPI. Ideal for embedded applications requiring efficient processing and analog interfacing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,282 parts In-Stock

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2,282

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Vyrian

USA . 2,126 parts In-Stock

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2,126

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Digiode

USA . 1,188 parts In-Stock

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1,188

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Distributors (Availability)

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Vigor

Singapore . 3,289 parts In-Stock

1+ parts

$2.030

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-

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3,289

$2.030

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Microchip USA

USA . 4,213 parts In-Stock

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$16.234

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4,213

$16.234

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AZTECH Wire

Italy . 1,217 parts In-Stock

1+ parts

$18.330

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1,217

$18.330

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IDEA Electronic Components Group

UK . 974 parts In-Stock

1+ parts

$47.236

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$42.512

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974

$47.236

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$42.512

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MKK Technologies

India . 102 parts In-Stock

1+ parts

$88.823

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102

$88.823

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DigiPath Technology Company

USA . 102 parts In-Stock

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$88.823

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102

$88.823

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Corphita

USA . 3,789 parts In-Stock

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3,789

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Parana Technologies

USA . 1,728 parts In-Stock

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$56.477

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1,728

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$56.477

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Overview

Elevate your projects with the STM32F071C8U7 microcontroller from STMicroelectronics, renowned for its innovative solutions and exceptional reliability. Designed for versatility, this powerful 32-bit MCU excels in diverse applications, from automation to IoT devices. Enjoy seamless integration, enhanced performance, and energy efficiency—all in a compact package. Trust in ST’s legacy of quality to deliver superior value and unlock endless possibilities for your next breakthrough!

Feature Benefit Bullets

Surface Mount: YES

This surface mount design allows for compact integration into various applications, enabling efficient PCB layouts.

Maximum Supply Voltage: 3.6 V

The maximum supply voltage compatibility facilitates safe integration with standard power systems and prevents overvoltage damage.

Package Shape: SQUARE

The square package shape enhances thermal performance and makes it easier to fit into tight spaces on circuit boards.

Bit Size: 32

With a 32-bit architecture, this microcontroller supports complex computations and offers better performance over 8- or 16-bit alternatives.

DAC Channels: YES

Having DAC channels allows for high-quality analog signal generation, making it suitable for audio applications and sensor interfacing.

No. of Terminals: 48

A total of 48 terminals provides ample interfacing options for a variety of peripherals, making it versatile for various designs.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This packaging style optimizes heat dissipation while maintaining a low profile, ideal for space-constrained applications.

Minimum Supply Voltage: 2 V

With a low minimum supply voltage, this microcontroller is suitable for battery-operated devices and energy-efficient applications.

Maximum Operating Temperature: 105 °C

This high temperature tolerance ensures reliable operation in demanding environments, making it suitable for industrial applications.

CPU Family: CORTEX-M0

The ARM Cortex-M0 architecture provides efficient power consumption and performance, ideal for low-power and real-time applications.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes this microcontroller suitable for harsh and extreme environments, such as automotive and aerospace.

ADC Channels: YES

Integrated ADC channels enable direct interaction with sensors, facilitating efficient data acquisition for various applications.

DMA Channels: YES

DMA channels enhance data transfer efficiency, allowing the CPU to focus on processing while data is managed automatically.

Terminal Position: QUAD

Quad terminal positioning allows for higher density pin configurations, maximizing the utility of available PCB space.

ROM Words: 65536

The substantial ROM capacity supports complex applications and extensive firmware, accommodating a wide range of functionality.

Digital To Analog Converters: 2-Ch 12-Bit

With two 12-bit DACs, this device provides high-resolution signal output, enhancing audio quality and control in various projects.

Width: 7 mm

The compact 7 mm width is ideal for space-constrained designs, allowing for more compact device footprints.

Peripherals: COMPARATOR(2), DMA(7), POR, RTC, TIMER(10), WDT(2)

A rich set of peripherals expands the functionality of the microcontroller, reducing the need for external components and simplifying design.

Maximum Clock Frequency: 32 MHz

The 32 MHz clock frequency provides sufficient processing speed for intermediate tasks, balancing performance with power consumption.

Length: 7 mm

Similar to its width, the 7 mm length enables compact module designs, ideal for portable and small electronic devices.

RAM Bytes: 16384

With 16KB of RAM, it supports multiple variables and temporary data storage, enhancing the ability to run more complex programs.

Terminal Form: NO LEAD

The no-lead design aids in thermal performance and solderability, making them suitable for modern PCB assembly techniques.

Analog To Digital Converters: 10-Ch 12-Bit

The presence of 10 ADC channels allows for extensive sensor input capability, making it a strong choice for data acquisition applications.

Nominal Supply Voltage: 3.3 V

The standard 3.3 V nominal supply voltage aligns well with most digital logic levels, ensuring easy interfacing with other components.

PWM Channels: YES

PWM channels support motor control and dimming applications, adding versatility for various hardware interactions.

Connectivity: I2C(2), I2S(2), SPI(2), USART(4)

Multiple connectivity options enable easy integration with a wide array of devices and peripherals, enhancing system versatility.

ROM Programmability: FLASH

FLASH programmability allows for easy updates and modifications of the firmware, ensuring longevity and adaptability of the product.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for high-density mounting options, making it suitable for modern compact PCBs.

Speed: 48 rpm

The ability to operate at a speed of 48 rpm is beneficial for applications requiring precise control, such as motor control and robotics.

On Chip Program ROM Width: 8

An 8-bit ROM width provides compatibility with a variety of data sizes, enabling flexibility in programming and usage.

No. of I/O Lines: 37

With 37 I/O lines, this microcontroller offers ample interfacing capacity for connecting to sensors, displays, and other peripherals.

Technical Specifications

Microcontrollers STM32F071C8U7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

Length:

7 mm

No. of I/O Lines:

37

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Speed:

48 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Data EEPROM Size:

0

Connectivity:

I2C(2), I2S(2), SPI(2), USART(4)

Peripherals:

COMPARATOR(2), DMA(7), POR, RTC, TIMER(10), WDT(2)

Analog To Digital Convertors:

10-Ch 12-Bit

Digital To Analog Convertors:

2-Ch 12-Bit

Trade Compliance

STM32F071C8U7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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