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STM32F058R8H7

STMicroelectronics

STM32F058R8H7 by STMicroelectronics

STM32F058R8H7 microcontroller from STMicroelectronics features a 32-bit architecture, operates at 1.8V nominal supply, and supports up to 54 I/O lines. With a max clock frequency of 32 MHz and integrated ADC/DMA channels, it's ideal for compact embedded applications. Its thin profile and fine pitch make it suitable for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,865 parts In-Stock

1+ parts

-

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8,865

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Digiode

USA . 1,390 parts In-Stock

1+ parts

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-

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1,390

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Anansix

USA . 1,299 parts In-Stock

1+ parts

-

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1,299

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 590 parts In-Stock

1+ parts

$12.770

100+ parts

-

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-

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590

$12.770

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Microchip USA

USA . 5,285 parts In-Stock

1+ parts

$15.845

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5,285

$15.845

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IDEA Electronic Components Group

UK . 1,499 parts In-Stock

1+ parts

$54.638

100+ parts

-

1k+ parts

$49.174

10k+ parts

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1,499

$54.638

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$49.174

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MKK Technologies

India . 462 parts In-Stock

1+ parts

$102.743

100+ parts

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462

$102.743

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DigiPath Technology Company

USA . 462 parts In-Stock

1+ parts

$102.743

100+ parts

-

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462

$102.743

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Corphita

USA . 3,766 parts In-Stock

1+ parts

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3,766

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Vigor

Singapore . 1,780 parts In-Stock

1+ parts

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1,780

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Parana Technologies

USA . 967 parts In-Stock

1+ parts

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100+ parts

$65.328

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967

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$65.328

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Overview

Elevate your projects with the STM32F058R8H7 from STMicroelectronics, a microcontroller that combines exceptional quality and reliability. Designed for versatility, it excels in applications ranging from IoT devices to industrial control systems. Enjoy the benefits of low power consumption without compromising performance, ensuring your designs are efficient and effective. Trust in STMicroelectronics' legacy of innovation and experience the difference today!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact and efficient use of PCB space, making it ideal for modern electronic devices.

Maximum Supply Voltage: 1.95 V

The low maximum supply voltage ensures compatibility with battery-operated devices and helps in lowering power consumption.

Package Shape: SQUARE

The square package shape offers a balanced footprint which enhances layout flexibility in circuit design.

Bit Size: 32

With a 32-bit architecture, this microcontroller allows for higher processing power and efficiency in handling complex tasks.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options for peripherals and other circuitry, facilitating versatile applications.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array with a very thin profile and fine pitch enables high-density assembly on PCBs, essential for compact designs.

Minimum Supply Voltage: 1.65 V

The minimum supply voltage allows for operation in a broader range of power supply conditions, enhancing system stability.

ADC Channels: YES

Integration of ADC channels allows for direct analog signal processing, making it suitable for sensors and data acquisition tasks.

DMA Channels: YES

The presence of DMA channels enables efficient data transfers, freeing up processing time for the CPU by offloading memory management.

Terminal Position: BOTTOM

Bottom terminal positioning aids in reducing the overall height of the device when installed, crucial for space-constrained applications.

Width: 5 mm

A compact width of 5 mm allows for integration into space-limited designs, providing more flexibility in layout configuration.

Maximum Clock Frequency: 32 MHz

A maximum clock frequency of 32 MHz provides sufficient speed for various processing applications, ensuring responsive performance.

Length: 5 mm

A length of 5 mm further enhances compactness, supporting miniaturization trends in electronic product designs.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture offers a streamlined instruction set that can improve execution speeds and power efficiency.

Technology: CMOS

CMOS technology yields lower power consumption and higher noise immunity, making it an excellent choice for battery-powered applications.

Terminal Form: BALL

Ball terminal form facilitates easier handling and soldering, enhancing production efficiency and reliability during assembly.

Nominal Supply Voltage: 1.8 V

With a nominal supply voltage of 1.8 V, the microcontroller is optimized for low-power operation, extending battery life in portable devices.

PWM Channels: YES

The availability of PWM channels allows for precise control of motors and LED brightness, expanding the range of applications.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm helps achieve high-density termination, crucial for modern compact PCB designs.

Speed: 48 rpm

A speed rating of 48 rpm indicates that the microcontroller can handle applications requiring low-speed control, such as motors.

No. of I/O Lines: 54

Having 54 I/O lines provides significant flexibility in interfacing with multiple peripherals, making it suitable for complex applications.

Technical Specifications

Microcontrollers STM32F058R8H7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

5 mm

No. of I/O Lines:

54

No. of Terminals:

64

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

48 rpm

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Trade Compliance

STM32F058R8H7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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