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STM32F051R8H7

STMicroelectronics

STM32F051R8H7 by STMicroelectronics

STM32F051R8H7 by STMicroelectronics is a 32-bit microcontroller with 64 terminals, operating at up to 32 MHz. It features DAC and ADC channels, PWM support, and DMA capabilities. Ideal for industrial applications requiring high-speed processing in a compact form factor with low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,184 parts In-Stock

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5,184

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Anansix

USA . 2,072 parts In-Stock

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2,072

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Nova Conductors

Japan . 900 parts In-Stock

1+ parts

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900

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Digiode

USA . 703 parts In-Stock

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703

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 613 parts In-Stock

1+ parts

$14.670

100+ parts

-

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10k+ parts

-

613

$14.670

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Microchip USA

USA . 6,308 parts In-Stock

1+ parts

$15.845

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6,308

$15.845

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Semicontronic

India . 1,423 parts In-Stock

1+ parts

$28.000

100+ parts

$27.300

1k+ parts

$27.160

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-

1,423

$28.000

$27.300

$27.160

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Ampacity Inc.

Singapore . 983 parts In-Stock

1+ parts

$35.000

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-

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-

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983

$35.000

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IDEA Electronic Components Group

UK . 1,214 parts In-Stock

1+ parts

$48.989

100+ parts

-

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$44.090

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1,214

$48.989

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$44.090

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Corohmni

South Africa . 329 parts In-Stock

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$57.019

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-

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329

$57.019

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Aztec Data Supply Inc.

USA . 1,419 parts In-Stock

1+ parts

$62.921

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1,419

$62.921

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MKK Technologies

India . 490 parts In-Stock

1+ parts

$92.121

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490

$92.121

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DigiPath Technology Company

USA . 490 parts In-Stock

1+ parts

$92.121

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490

$92.121

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Vigor

Singapore . 9,685 parts In-Stock

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9,685

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Continental Prestige Electronics

USA . 5,289 parts In-Stock

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5,289

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Argo Parts USA

USA . 4,539 parts In-Stock

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4,539

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Corphita

USA . 4,174 parts In-Stock

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4,174

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Parana Technologies

USA . 1,620 parts In-Stock

1+ parts

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$58.574

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1,620

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$58.574

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Aranea Global

USA . 50 parts In-Stock

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50

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Overview

Unlock endless possibilities with the STM32F051R8H7 microcontroller by STMicroelectronics. Delve into a world of innovation and efficiency as you explore the seamless integration, reliable performance, and cutting-edge technology this product has to offer. Perfect for a wide range of applications, this microcontroller boasts superior quality and value, providing customers with unmatched benefits and advantages. Elevate your projects to new heights with the STM32F051R8H7 and experience the difference that top-notch manufacturing and advanced features can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and lightweight, making the product ideal for portable applications.

Surface Mount: YES

Surface mount technology allows for compact design and easy assembly, saving space and simplifying production processes.

Maximum Supply Voltage: 3.6 V

Support for a higher supply voltage allows for increased flexibility and compatibility with a wider range of power sources.

Package Shape: SQUARE

Square package shape provides a good balance between space efficiency and ease of mounting.

Bit Size: 32

A 32-bit architecture offers improved processing capabilities and performance compared to lower bit sizes.

DAC Channels: YES

Digital-to-analog converter channels enable the product to interface with analog sensors and devices for a broader range of applications.

No. of Terminals: 64

Having a higher number of terminals allows for more versatile connectivity options and integration with external components.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array package style with a thin profile and fine pitch design enhances signal integrity and enables high-density circuit integration.

Minimum Supply Voltage: 2 V

Support for a low minimum supply voltage ensures compatibility with low-power applications and energy-efficient designs.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions and extended operation in industrial settings.

Minimum Operating Temperature: -40 °C

A low minimum operating temperature range allows the product to function reliably in cold environments without performance degradation.

ADC Channels: YES

Analog-to-digital converter channels enable the product to convert analog signals into digital data for processing and analysis.

DMA Channels: YES

Direct memory access channels enhance data transfer efficiency and reduce processor load, improving overall system performance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier PCB layout and routing, simplifying the design and assembly process.

Maximum Seated Height: 0.6 mm

Low maximum seated height allows for compact device profiles and minimizes space requirements within constrained designs.

Width: 5 mm

Compact width dimensions enable the product to fit into tight spaces and compact enclosures, maximizing design flexibility.

Maximum Clock Frequency: 32 MHz

Support for a high maximum clock frequency ensures efficient processing speed and performance for demanding applications.

Length: 5 mm

Short length dimensions contribute to a small form factor design, ideal for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature ratings ensure reliable operation in challenging environments with temperature fluctuations and harsh conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

A microcontroller with RISC architecture delivers efficient processing power and performance, suitable for a wide range of embedded applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Terminal Form: BALL

Ball terminal form simplifies soldering and improves solder joint reliability, ensuring robust electrical connections.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources.

PWM Channels: YES

Pulse-width modulation channels enable precise control and modulation of output signals, enhancing versatility in signal processing and motor control applications.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates and customization, adapting the product to evolving requirements and applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch facilitates high-density mounting and integration, enabling compact and efficient PCB designs.

Speed: 48 rpm

With a speed of 48 rpm, the product offers fast data processing and response times, suitable for real-time applications and control systems.

No. of I/O Lines: 55

Having a high number of I/O lines allows for versatile input/output configurations and connectivity options, enhancing system flexibility and adaptability.

Technical Specifications

Microcontrollers STM32F051R8H7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B64

Length:

5 mm

No. of I/O Lines:

55

No. of Terminals:

64

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

48 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Trade Compliance

STM32F051R8H7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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