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STM32F051R8H6

STMicroelectronics

STM32F051R8H6 by STMicroelectronics

STM32F051R8H6 by STMicroelectronics is a 32-bit microcontroller with 64 terminals, operating at up to 32 MHz. It features DAC and ADC channels, PWM support, and DMA channels for industrial applications requiring high-speed processing in a compact package.

Median Price

$2.132

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$2.550

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500

$2.550

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Vyrian

USA . 8,768 parts In-Stock

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8,768

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Digiode

USA . 3,377 parts In-Stock

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3,377

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Anansix

USA . 1,515 parts In-Stock

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1,515

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ACDS - Activité Composants Distribution Service

France . 195 parts In-Stock

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195

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Bristol Electronics

USA . 195 parts In-Stock

1+ parts

-

100+ parts

$1.714

1k+ parts

$1.592

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-

195

-

$1.714

$1.592

-

Dan-Mar Components

USA . 195 parts In-Stock

1+ parts

-

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195

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 3,362 parts In-Stock

1+ parts

$2.550

100+ parts

-

1k+ parts

-

10k+ parts

$2.499

3,362

$2.550

-

-

$2.499

Argo Parts USA

USA . 525 parts In-Stock

1+ parts

$2.550

100+ parts

-

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-

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525

$2.550

-

-

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AZTECH Wire

Italy . 768 parts In-Stock

1+ parts

$12.900

100+ parts

-

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768

$12.900

-

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Semicontronic

India . 951 parts In-Stock

1+ parts

$13.000

100+ parts

$12.675

1k+ parts

$12.610

10k+ parts

-

951

$13.000

$12.675

$12.610

-

Ampacity Inc.

Singapore . 235 parts In-Stock

1+ parts

$21.000

100+ parts

-

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235

$21.000

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Corohmni

South Africa . 826 parts In-Stock

1+ parts

$32.978

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-

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826

$32.978

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IDEA Electronic Components Group

UK . 665 parts In-Stock

1+ parts

$43.503

100+ parts

-

1k+ parts

$39.153

10k+ parts

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665

$43.503

-

$39.153

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Aztec Data Supply Inc.

USA . 1,011 parts In-Stock

1+ parts

$68.640

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1,011

$68.640

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MKK Technologies

India . 530 parts In-Stock

1+ parts

$81.805

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530

$81.805

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DigiPath Technology Company

USA . 530 parts In-Stock

1+ parts

$81.805

100+ parts

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530

$81.805

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QUARKTWIN TECHNOLOGY LTD

USA . 17,643 parts In-Stock

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17,643

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Lixinc

USA . 2,982 parts In-Stock

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2,982

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Parana Technologies

USA . 1,687 parts In-Stock

1+ parts

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100+ parts

$52.015

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1,687

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$52.015

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Vigor

Singapore . 1,649 parts In-Stock

1+ parts

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1,649

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Corphita

USA . 916 parts In-Stock

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916

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Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$2.499

1k+ parts

$2.422

10k+ parts

$2.371

100

-

$2.499

$2.422

$2.371

Overview

Unlock the potential of your next project with the STM32F051R8H6 microcontroller by STMicroelectronics. With a reputation for excellence in the industry, this powerful device offers unmatched performance and reliability. Ideal for a wide range of applications, this microcontroller boasts advanced features such as DAC and ADC channels, PWM capabilities, and DMA channels. Whether you're designing IoT devices, industrial controls, or consumer electronics, the STM32F051R8H6 delivers the value, benefits, and advantages you need to bring your ideas to life. Trust STMicroelectronics to provide cutting-edge technology that exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, which is ideal for portable or rugged applications.

Surface Mount: YES

The surface mount feature allows for easy and compact PCB assembly, saving space and making it suitable for small electronic devices.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of electronic systems.

Package Shape: SQUARE

The square package shape provides uniformity and ease of handling during installation, ensuring a neat and organized PCB layout.

Bit Size: 32

The 32-bit size offers high computational capabilities, allowing for complex algorithms and tasks to be executed efficiently.

DAC Channels: YES

The presence of DAC channels enables analog output capabilities, which is essential for interfacing with analog sensors and devices.

No. of Terminals: 64

With 64 terminals, there are ample connectivity options for interfacing with external peripherals and components, enhancing the product's versatility.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a very thin profile and fine pitch enables higher component density on the PCB, optimizing space usage and improving signal integrity.

Minimum Supply Voltage: 2 V

The low minimum supply voltage allows for efficient power consumption and compatibility with low-power applications, extending the product's battery life.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range makes the product suitable for industrial environments where temperature fluctuations are common.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in extreme cold conditions, making it suitable for diverse environments.

ADC Channels: YES

The inclusion of ADC channels enables analog input capabilities, essential for converting external analog signals into digital data for processing.

DMA Channels: YES

The presence of DMA channels allows for efficient data transfer between peripherals and memory without CPU intervention, enhancing overall system performance.

Terminal Position: BOTTOM

The terminal position on the bottom facilitates easier PCB layout design and assembly, ensuring a more compact and organized configuration.

Maximum Seated Height: 0.6 mm

The low maximum seated height minimizes the overall profile of the product, ensuring compatibility with slim and space-constrained applications.

Width: 5 mm

The compact width dimension allows for efficient space utilization on the PCB and enables the product to be used in small form factor devices.

Maximum Clock Frequency: 32 MHz

The high maximum clock frequency enables fast processing speeds, making the product suitable for applications that require real-time data handling.

Length: 5 mm

The short length dimension helps in saving space on the PCB and allows for a more flexible and optimized component placement.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions, making the product suitable for industrial automation and control systems.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller ensures efficient and streamlined processing capabilities, ideal for applications that require high-speed data processing.

Technology: CMOS

The CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the product energy-efficient and reliable.

Terminal Form: BALL

The ball terminal form provides reliable electrical connections and easy soldering during PCB assembly, ensuring a robust and durable interconnection.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage provides stable and consistent power delivery to the product, ensuring reliable operation and performance.

PWM Channels: YES

The presence of PWM channels enables precise control over pulse-width modulation signals, essential for applications such as motor control and power management.

ROM Programmability: FLASH

The flash ROM programmability allows for flexible and reprogrammable memory storage, enabling easy firmware updates and customization of the product.

Terminal Pitch: 0.5 mm

The small terminal pitch enables high-density mounting on the PCB, optimizing space usage and enhancing signal integrity for reliable performance.

Speed: 48 rpm

The high speed of 48 rpm allows for rapid data processing and execution of tasks, making the product well-suited for time-critical applications.

No. of I/O Lines: 55

With 55 I/O lines, there are ample interface options for connecting to external devices and peripherals, enhancing the product's versatility and connectivity.

Technical Specifications

Microcontrollers STM32F051R8H6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B64

Length:

5 mm

No. of I/O Lines:

55

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

48 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Trade Compliance

STM32F051R8H6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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