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STM32F050F6P7

STMicroelectronics

STM32F050F6P7 by STMicroelectronics

STM32F050F6P7 microcontroller from STMicroelectronics features a 32-bit Cortex-M0 CPU, operates at 2-3.6V, and supports up to 32 MHz clock speed. With 20 terminals and multiple connectivity options like I2C and SPI, it's ideal for industrial applications. Its robust design includes ADC channels and DMA support for efficient data handling.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,037 parts In-Stock

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3,037

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Anansix

USA . 2,436 parts In-Stock

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2,436

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Digiode

USA . 963 parts In-Stock

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963

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Microchip USA

USA . 926 parts In-Stock

1+ parts

$5.481

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926

$5.481

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AZTECH Wire

Italy . 328 parts In-Stock

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$16.430

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328

$16.430

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IDEA Electronic Components Group

UK . 69 parts In-Stock

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$49.587

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$44.628

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69

$49.587

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$44.628

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MKK Technologies

India . 2,374 parts In-Stock

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$93.245

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2,374

$93.245

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DigiPath Technology Company

USA . 2,374 parts In-Stock

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$93.245

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2,374

$93.245

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Vigor

Singapore . 2,425 parts In-Stock

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Parana Technologies

USA . 2,008 parts In-Stock

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$59.289

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$59.289

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Corphita

USA . 1,530 parts In-Stock

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1,530

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Overview

Elevate your projects with the STM32F050F6P7 microcontroller from STMicroelectronics—where quality meets innovation. Designed for reliability in industrial applications, this compact, energy-efficient 32-bit MCU delivers exceptional performance with integrated features like ADC and DMA channels, enabling seamless connectivity. Trust in STMicroelectronics' legacy of excellence to unlock powerful possibilities for your designs while enjoying superior support and longevity in every application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy package provides protection and enhances reliability in various environments.

Surface Mount: YES

Surface mount technology allows for compact design and automated assembly, making it ideal for modern applications.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V provides flexibility for various power supply designs while ensuring proper functionality.

Package Shape: RECTANGULAR

Rectangular package shape helps in efficient space utilization on PCBs.

Bit Size: 32

The 32-bit architecture improves processing power, enabling complex computations and enhanced performance.

Power Supplies (V): 2.5/3.3

Supports multiple supply voltages, making it adaptable for different power supply setups.

No. of Terminals: 20

20 terminals provide ample I/O options, making it versatile for various applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Thin profile and small outline design facilitate compact circuit designs, perfect for space-constrained applications.

Minimum Supply Voltage: 2 V

Operating at a minimum of 2 V extends the range of compatible power sources, enhancing design flexibility.

Maximum Operating Temperature: 105 °C

A high operating temperature rating enables use in demanding industrial environments.

CPU Family: CORTEX-M0

The Cortex-M0 family supports efficient processing and low power consumption, making it ideal for energy-sensitive applications.

Minimum Operating Temperature: -40 °C

This temperature range ensures reliable operation in extreme conditions.

ADC Channels: YES

Supports Analog-to-Digital conversion for integrating analog signals, which is essential in many applications.

DMA Channels: YES

Having DMA channels allows for efficient data transfer without burdening the CPU, improving overall system performance.

Terminal Position: DUAL

Dual terminal position allows for versatile layout designs on PCBs.

ROM Words: 32768

With 32K ROM, it provides significant programmable memory space for applications.

Maximum Seated Height: 1.2 mm

Low seated height aids in minimizing overall device height, crucial for portable devices.

Width: 4.4 mm

Narrow width complements compact designs and enhances PCB layout flexibility.

Peripherals: CRC, DMA(5), POR, PVD, PWM(6), RTC, TEMPERATURE SENSOR, TIMER(7), WDT(2)

Rich peripheral set adds functionality for advanced applications, eliminating the need for external components.

Maximum Clock Frequency: 32 MHz

The 32 MHz clock frequency provides sufficient processing speed for a wide range of applications.

Length: 6.5 mm

Short length further contributes to compact design, essential for space-sensitive products.

Temperature Grade: INDUSTRIAL

Industrial grade ensures robustness and reliability in demanding conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture optimizes performance and power efficiency, ideal for embedded systems.

RAM Bytes: 4096

Offering 4096 bytes of RAM ensures ample temporary storage for application data.

Technology: CMOS

CMOS technology results in low power consumption, enhancing battery life in portable applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and reliable connections on PCBs.

Analog To Digital Convertors: 9-Ch 12-Bit

Nine 12-bit ADC channels allow for high-resolution data acquisition from multiple sensors.

Maximum Supply Current: 24.4 mA

A maximum supply current of 24.4 mA indicates reasonable power consumption relative to performance.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V aligns with common microcontroller standards for easy integration.

PWM Channels: YES

PWM channels provide efficient control of motors and other devices, making it versatile for control applications.

Connectivity: I2C, I2S, IRDA, LIN, SPI, USART

Diverse connectivity options make integration with various peripherals and systems straightforward.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications of firmware.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch supports a compact design while ensuring reliable solder joints.

Speed: 48 rpm

The speed rating offers insights into performance capabilities, enhancing application choice.

On Chip Program ROM Width: 8

8-bit program ROM width aids in compatibility with various data types and operations.

No. of I/O Lines: 15

Fifteen I/O lines provide flexibility in integrating and controlling external devices and components.

Technical Specifications

Microcontrollers STM32F050F6P7 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

INTERNAL 3-CH ADC IS ALSO AVAILABLE

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

No. of I/O Lines:

15

No. of Terminals:

20

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

48 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

24.4 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, I2S, IRDA, LIN, SPI, USART

Peripherals:

CRC, DMA(5), POR, PVD, PWM(6), RTC, TEMPERATURE SENSOR, TIMER(7), WDT(2)

Analog To Digital Convertors:

9-Ch 12-Bit

Trade Compliance

STM32F050F6P7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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