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STM32F048C6U6TR

STMicroelectronics

STM32F048C6U6TR by STMicroelectronics

STM32F048C6U6TR by STMicroelectronics is a 32-bit microcontroller with 48 I/O lines, 32768 ROM words, and 32 MHz clock frequency. Ideal for applications requiring ADC and DMA channels, it operates at a voltage range of 1.65V to 1.95V in a square chip carrier package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,323 parts In-Stock

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8,323

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Digiode

USA . 1,837 parts In-Stock

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1,837

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Anansix

USA . 1,614 parts In-Stock

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1,614

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Distributors (Availability)

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Vigor

Singapore . 3,955 parts In-Stock

1+ parts

$1.780

100+ parts

-

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3,955

$1.780

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Microchip USA

USA . 5,651 parts In-Stock

1+ parts

$13.639

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5,651

$13.639

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AZTECH Wire

Italy . 124 parts In-Stock

1+ parts

$15.520

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124

$15.520

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IDEA Electronic Components Group

UK . 2,053 parts In-Stock

1+ parts

$73.739

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$66.365

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2,053

$73.739

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$66.365

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MKK Technologies

India . 2,157 parts In-Stock

1+ parts

$138.661

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2,157

$138.661

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DigiPath Technology Company

USA . 2,157 parts In-Stock

1+ parts

$138.661

100+ parts

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2,157

$138.661

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Corphita

USA . 4,138 parts In-Stock

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4,138

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Parana Technologies

USA . 1,377 parts In-Stock

1+ parts

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100+ parts

$88.166

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1,377

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$88.166

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Overview

Discover the STM32F048C6U6TR by STMicroelectronics, a high-quality microcontroller designed to revolutionize your projects. With a powerful 32-bit RISC technology and a maximum clock frequency of 32 MHz, this chip carrier package offers 27 I/O lines and PWM channels for seamless integration into various applications. From industrial automation to consumer electronics, the STM32F048C6U6TR provides unmatched value and performance, making it the ideal choice for your next innovation. Experience the benefits of STMicroelectronics' expertise and unlock endless possibilities with this advanced microcontroller.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy installation and reduced space usage.

Maximum Supply Voltage: 1.95 V

Operates efficiently within specified voltage range.

Package Shape: SQUARE

Square package shape provides efficient use of space.

Bit Size: 32

Larger bit size allows for processing of larger and more complex data sets.

No. of Terminals: 48

Provides ample connectivity options for external devices or components.

Package Style (Meter): CHIP CARRIER

Chip carrier package style ensures protection and portability.

Minimum Supply Voltage: 1.65 V

Can function reliably even at lower voltage levels.

ADC Channels: YES

Analog-to-digital converter channels enable conversion of analog signals to digital data.

DMA Channels: YES

Direct memory access channels improve data transfer efficiency and speed.

Terminal Position: QUAD

Quad terminal position allows for easy and secure connections.

ROM Words: 32768

Large ROM capacity enables storing of extensive program codes and data.

Width: 7 mm

Compact width facilitates installation in small spaces or devices.

Maximum Clock Frequency: 32 MHz

High clock frequency allows for fast processing and response times.

Length: 7 mm

Short length contributes to overall compact design.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with Reduced Instruction Set Computing architecture improves processing efficiency.

Technology: CMOS

Complementary metal-oxide-semiconductor technology offers low power consumption and high performance.

Terminal Form: NO LEAD

No-lead terminal form enhances reliability and ease of installation.

Nominal Supply Voltage: 1.8 V

Ideal operating voltage for stable and efficient performance.

PWM Channels: YES

Pulse-width modulation channels support precise control of connected devices or components.

Terminal Pitch: 0.5 mm

Narrow terminal pitch allows for compact design and space-saving layout.

Speed: 48 rpm

Operates at a moderate speed suitable for various applications.

No. of I/O Lines: 27

Multiple input/output lines provide versatility for connecting to external peripherals.

Technical Specifications

Microcontrollers STM32F048C6U6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

7 mm

No. of I/O Lines:

27

No. of Terminals:

48

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Words:

32768

Speed:

48 rpm

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM32F048C6U6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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