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STM32F038C6T6TR

STMicroelectronics

STM32F038C6T6TR by STMicroelectronics

STM32F038C6T6TR microcontroller by STMicroelectronics features a 32-bit architecture, operates at a max clock frequency of 48 MHz, and supports ADC & PWM channels. Ideal for low-power applications, it comes in a compact 7x7 mm flatpack package. Its quad terminal design ensures efficient connectivity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,419 parts In-Stock

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5,419

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Anansix

USA . 2,699 parts In-Stock

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2,699

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Digiode

USA . 1,585 parts In-Stock

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1,585

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 3,981 parts In-Stock

1+ parts

$1.560

100+ parts

-

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3,981

$1.560

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Microchip USA

USA . 4,353 parts In-Stock

1+ parts

$12.569

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4,353

$12.569

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AZTECH Wire

Italy . 39 parts In-Stock

1+ parts

$18.220

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39

$18.220

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IDEA Electronic Components Group

UK . 733 parts In-Stock

1+ parts

$66.447

100+ parts

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$59.802

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733

$66.447

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$59.802

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MKK Technologies

India . 2,090 parts In-Stock

1+ parts

$124.949

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2,090

$124.949

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DigiPath Technology Company

USA . 2,090 parts In-Stock

1+ parts

$124.949

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2,090

$124.949

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Parana Technologies

USA . 1,288 parts In-Stock

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$79.448

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1,288

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$79.448

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Corphita

USA . 851 parts In-Stock

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851

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Overview

Unlock the potential of your projects with the STM32F038C6T6TR microcontroller from STMicroelectronics, a trusted leader in semiconductor innovation. Designed for efficiency and versatility, this compact powerhouse excels in embedded applications, ensuring seamless performance in consumer electronics, automation, and IoT devices. Experience enhanced reliability, lower energy consumption, and greater design flexibility, all while benefiting from ST's commitment to quality and cutting-edge technology. Elevate your designs today!

Feature Benefit Bullets

Surface Mount: YES

This surface mount design allows for compact PCB layout and minimizes space usage, making it ideal for modern electronics.

Maximum Supply Voltage: 1.944 V

With a maximum supply voltage of 1.944 V, this microcontroller is energy-efficient and suitable for low-power applications.

Package Shape: SQUARE

The square package shape promotes uniform thermal distribution and provides ease of integration into various designs.

Bit Size: 32

A 32-bit architecture enables high performance and allows for more complex computations, making it powerful enough for demanding applications.

No. of Terminals: 48

Having 48 terminals allows for extensive connectivity options, ensuring versatile integration with other components in your system.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low-profile design suits applications where space is a premium while offering a fine pitch for improved connectivity.

Minimum Supply Voltage: 1.656 V

A low minimum supply voltage enhances flexibility in power supply design, making it compatible with various low-voltage systems.

ADC Channels: YES

Incorporating ADC channels allows for direct interaction with analog sensors, making it ideal for data acquisition applications.

DMA Channels: YES

Direct Memory Access (DMA) channels enable efficient data handling and transfer, enhancing overall processing efficiency.

Terminal Position: QUAD

Quad terminal positioning facilitates easy routing on PCBs and aligns well with common manufacturing processes.

Width: 7 mm

A compact width of 7 mm is beneficial for dense hardware designs and enables seamless integration in small devices.

Maximum Clock Frequency: 48 MHz

A maximum clock frequency of 48 MHz delivers adequate processing speed for a wide range of applications, ensuring smooth operation.

Length: 7 mm

The 7 mm length complements the compact design, facilitating more efficient use of space in device layouts.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC architecture microcontroller provides enhanced performance through simplified instruction sets, improving execution speed.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, essential for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals simplify soldering and assembly processes, making manufacturing more efficient.

Nominal Supply Voltage: 1.8 V

A nominal voltage of 1.8 V optimizes power consumption and is compatible with modern, energy-efficient designs.

PWM Channels: YES

PWM channels allow for precise control of motors and other devices, making it a versatile option for various applications.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch enhances design density, allowing for more functions in a smaller space.

Speed: 32 rpm

Operating at 32 rpm indicates suitability for low-speed applications, fulfilling the needs of specific control systems.

No. of I/O Lines: 38

With 38 I/O lines, this microcontroller offers extensive interfacing capabilities, supporting a variety of peripherals and configurations.

Technical Specifications

Microcontrollers STM32F038C6T6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

48 MHz

DMA Channels:

YES

External Data Bus Width:

0

Length:

7 mm

No. of I/O Lines:

38

No. of Terminals:

48

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Speed:

32 rpm

Maximum Supply Voltage:

1.944 V

Minimum Supply Voltage:

1.656 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM32F038C6T6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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