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STM32F031K6T7TR

STMicroelectronics

STM32F031K6T7TR by STMicroelectronics

STM32F031K6T7TR by STMicroelectronics is a 32-bit microcontroller with a max supply voltage of 3.6V and operates in extreme temps from -40 °C to 105 °C. It features ADC and PWM channels, making it ideal for industrial applications. Its compact design ensures efficient surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,858 parts In-Stock

1+ parts

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4,858

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Digiode

USA . 3,771 parts In-Stock

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3,771

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Anansix

USA . 974 parts In-Stock

1+ parts

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974

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 3,906 parts In-Stock

1+ parts

$1.700

100+ parts

-

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-

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3,906

$1.700

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IDEA Electronic Components Group

UK . 36 parts In-Stock

1+ parts

$16.339

100+ parts

-

1k+ parts

$14.705

10k+ parts

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36

$16.339

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$14.705

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AZTECH Wire

Italy . 1,123 parts In-Stock

1+ parts

$19.610

100+ parts

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1,123

$19.610

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MKK Technologies

India . 1,931 parts In-Stock

1+ parts

$30.725

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1,931

$30.725

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DigiPath Technology Company

USA . 1,931 parts In-Stock

1+ parts

$30.725

100+ parts

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1,931

$30.725

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Corphita

USA . 2,704 parts In-Stock

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2,704

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Parana Technologies

USA . 1,251 parts In-Stock

1+ parts

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$19.536

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1,251

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$19.536

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Overview

Unlock limitless possibilities with the STM32F031K6T7TR from STMicroelectronics, a leader in innovative microcontroller technology. This compact, high-performance solution empowers your designs with exceptional reliability and versatility for industrial applications, IoT devices, and more. Experience unparalleled quality and support, ensuring your projects thrive while benefiting from low power consumption and a robust feature set that accelerates time-to-market. Transform your ideas into reality!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures longevity and resilience against environmental factors.

Surface Mount: YES

Surface mount technology allows for compact designs and faster assembly processes.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6V ensures compatibility with a wide range of battery and power supply configurations.

Package Shape: SQUARE

The square package shape provides a balanced footprint, making it easy to design into various PCB layouts.

Bit Size: 32

The 32-bit architecture supports complex computations and makes the microcontroller suitable for sophisticated applications.

No. of Terminals: 32

With 32 terminals, this microcontroller offers enough connectivity for a variety of peripherals and interfaces.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design allows for space-saving installations, particularly in compact devices.

Minimum Supply Voltage: 2 V

A minimum supply voltage of 2V enhances power flexibility, enabling use in applications with low power requirements.

Maximum Operating Temperature: 105 °C

The ability to operate at high temperatures (up to 105 °C) makes this microcontroller ideal for industrial environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this microcontroller can function in harsh cold conditions reliably.

ADC Channels: YES

Integrated ADC channels provide the capability to process analog signals, making it versatile for various sensing applications.

DMA Channels: YES

DMA channels enhance data transfer efficiency, allowing the CPU to manage other tasks while data is moved in the background.

Terminal Position: QUAD

Quad terminal positioning ensures stable mounting and effective electrical connections.

Maximum Seated Height: 1.6 mm

A maximum seated height of 1.6 mm contributes to a low-profile design, aiding in space-constrained applications.

Width: 7 mm

A width of 7 mm offers a compact design, facilitating integration into smaller electronic devices.

Maximum Clock Frequency: 32 MHz

The 32 MHz maximum clock frequency allows for quick processing times, suitable for performance-sensitive applications.

Length: 7 mm

The compact length of 7 mm aligns with space-efficient designs, making it an ideal choice for portable gadgets.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliability in rigorous operational conditions commonly found in industry.

Peripheral IC Type: MICROCONTROLLER, RISC

As a RISC microcontroller, it benefits from a reduced instruction set, leading to faster execution and efficiency.

Technology: CMOS

CMOS technology translates to low power consumption, which is crucial for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and better handling during assembly, enhancing manufacturability.

Nominal Supply Voltage: 3.3 V

Designed for a nominal supply voltage of 3.3V, it fits well within common logic levels used in embedded systems.

PWM Channels: YES

The availability of PWM channels allows for effective control in applications like motor driving, enhancing design flexibility.

ROM Programmability: FLASH

FLASH programmability enables easy updates and modifications in firmware without needing to replace the chip.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm allows greater density in PCB layouts, making this microcontroller suitable for high-performance, compact designs.

Speed: 48 rpm

While the speed of 48 rpm indicates limited direct application, this could be relevant for specific interfacing scenarios and system designs.

No. of I/O Lines: 25

Having 25 I/O lines provides ample input and output options for diverse interfacing needs, enhancing application versatility.

Technical Specifications

Microcontrollers STM32F031K6T7TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

Length:

7 mm

No. of I/O Lines:

25

No. of Terminals:

32

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM32F031K6T7TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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