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STM1404CSNJQ6F

STMicroelectronics

STM1404CSNJQ6F by STMicroelectronics

STM1404CSNJQ6F by STMicroelectronics is a power management IC designed for industrial applications, operating b/w -40 °C to 85 °C. It supports supply voltages of 2.2V to 3.6V and features a compact 16-terminal design with a very thin profile. Ideal for efficient power supply support in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,861 parts In-Stock

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Anansix

USA . 2,093 parts In-Stock

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Digiode

USA . 1,817 parts In-Stock

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Microchip USA

USA . 320 parts In-Stock

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$7.206

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320

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IDEA Electronic Components Group

UK . 908 parts In-Stock

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$13.608

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$12.247

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908

$13.608

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$12.247

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AZTECH Wire

Italy . 548 parts In-Stock

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$15.740

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548

$15.740

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MKK Technologies

India . 50 parts In-Stock

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$25.588

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50

$25.588

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DigiPath Technology Company

USA . 50 parts In-Stock

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$25.588

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$25.588

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QUARKTWIN TECHNOLOGY LTD

USA . 15,245 parts In-Stock

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Corphita

USA . 4,071 parts In-Stock

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Parana Technologies

USA . 1,948 parts In-Stock

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$16.270

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$16.270

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Metaverse IC Inc.

Canada . 225 parts In-Stock

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Perfect Parts

USA . 204 parts In-Stock

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Kepictronics

USA . 125 parts In-Stock

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Overview

Elevate your designs with the STM1404CSNJQ6F from STMicroelectronics—a leader in power management solutions. This compact and efficient IC is engineered for reliable performance across a wide temperature range, making it ideal for industrial applications. Experience enhanced energy efficiency and seamless integration into your projects, ensuring longevity and reduced downtime. Trust in STMicroelectronics’ commitment to quality and innovation to power your next breakthrough!

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability allows for compact designs and efficient use of PCB space, making it ideal for modern electronics.

Package Shape: SQUARE

A square package ensures even thermal dissipation and a streamlined layout on the PCB.

Nominal Supply Voltage (Vsup): 3 V

With a nominal supply voltage of 3 V, this IC is compatible with a broad range of applications and devices.

Power Supplies (V): 2.5/3.3

Supports both 2.5V and 3.3V power supplies, providing flexibility in system design.

No. of Terminals: 16

Sixteen terminals offer multiple connectivity options, enabling various functional configurations.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The very thin profile ensures it fits in space-constrained applications while facilitating effective heat dissipation.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C ensures reliable performance in demanding environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this IC is suitable for industrial and outdoor applications.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides good solderability, ensuring strong electrical connections and durability.

Terminal Position: QUAD

Quad terminal positioning allows for versatile integration in various board layouts.

Maximum Seated Height: 1 mm

A maximum seated height of 1 mm contributes to a slim profile, crucial for low-profile electronic devices.

Width: 3 mm

A compact width of 3 mm makes this IC ideal for space-sensitive applications.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed as a power supply support circuit, it enhances power management capabilities in electronic systems.

Minimum Supply Voltage (Vsup): 2.2 V

A low minimum supply voltage ensures compatibility with a variety of low-voltage systems.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for optimal soldering processes, enabling efficient manufacturing without damaging the IC.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C ensures the product can withstand the soldering process used in modern PCB assembly.

Length: 3 mm

Similar to its width, a length of 3 mm further emphasizes its compact size, enhancing design flexibility.

Temperature Grade: INDUSTRIAL

Industrial temperature grading guarantees durability and reliability even in harsh operating conditions.

Maximum Supply Current (Isup): 0.065 mA

A maximum supply current of 0.065 mA indicates energy efficiency, leading to lower operational costs.

Terminal Form: NO LEAD

No lead construction minimizes environmental impact while also providing a cleaner solder joint.

Terminal Pitch: 0.5 mm

A fine terminal pitch of 0.5 mm allows for high-density PCB layouts, maximizing available space.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6 V allows for a wider range of applications while maintaining low power requirements.

Technical Specifications

Power Management ICs STM1404CSNJQ6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.065 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

STM1404CSNJQ6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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