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STM1403CSNQ6F

STMicroelectronics

STM1403CSNQ6F by STMicroelectronics

STM1403CSNQ6F by STMicroelectronics is a compact power management IC designed for industrial applications. It operates within a supply voltage range of 2.2V to 3.6V and features a max current of 0.06mA, ensuring efficient performance in tight spaces. With a temperature range from -40 °C to 85°C, it’s ideal for robust environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,513 parts In-Stock

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4,513

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Vyrian

USA . 2,377 parts In-Stock

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2,377

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Anansix

USA . 1,919 parts In-Stock

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1,919

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IDEA Electronic Components Group

UK . 1,491 parts In-Stock

1+ parts

$17.475

100+ parts

-

1k+ parts

$15.728

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1,491

$17.475

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$15.728

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Microchip USA

USA . 431 parts In-Stock

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$17.905

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-

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431

$17.905

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AZTECH Wire

Italy . 991 parts In-Stock

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$18.970

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991

$18.970

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$26.653

100+ parts

$24.254

1k+ parts

$21.855

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5,000

$26.653

$24.254

$21.855

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MKK Technologies

India . 2,070 parts In-Stock

1+ parts

$32.861

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2,070

$32.861

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DigiPath Technology Company

USA . 2,070 parts In-Stock

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$32.861

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2,070

$32.861

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A-Z Elektronik GmbH

Germany . 6,434 parts In-Stock

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6,434

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Corphita

USA . 3,345 parts In-Stock

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Parana Technologies

USA . 2,331 parts In-Stock

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$20.894

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$20.894

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Perfect Parts

USA . 273 parts In-Stock

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Overview

Elevate your designs with the STM1403CSNQ6F from STMicroelectronics, a leading name in innovative power management solutions. This compact, surface-mount IC ensures reliable performance across various applications, from industrial to consumer electronics. With exceptional thermal stability and efficiency, it seamlessly operates within a broad voltage range while minimizing energy consumption. Choose STMicroelectronics for unparalleled quality, empowering you to enhance functionality and drive success in your projects.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for easy integration into compact PCBs, making it suitable for modern electronic devices.

Package Shape: SQUARE

The square package shape enhances thermal performance and stability, facilitating efficient power management.

Nominal Supply Voltage (Vsup): 3.3 V

A nominal supply voltage of 3.3 V is standard for many digital circuits, ensuring compatibility with a wide range of devices.

Power Supplies (V): 2.5/3.3

Supports multiple supply voltages, providing flexibility for various applications in power management.

No. of Terminals: 16

With 16 terminals, it allows for robust connectivity and integration into complex systems.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The very thin profile package with a heat sink option improves thermal dissipation, essential for high-performance applications.

Maximum Operating Temperature: 85 °C

An operating temperature up to 85 °C ensures reliable performance in various industrial conditions.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes it suitable for applications in extreme and cold environments.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides good solderability, enhancing the reliability of the connections.

Terminal Position: QUAD

The quad terminal position offers a balanced layout for easier PCB layout and improved electrical performance.

Maximum Seated Height: 1 mm

A maximum seated height of 1 mm allows for low-profile designs, which are critical in space-constrained applications.

Width: 3 mm

The compact 3 mm width facilitates design flexibility, especially in compact and portable devices.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, it serves essential roles in voltage regulation and stability, important for power management.

Minimum Supply Voltage (Vsup): 2.2 V

Operating at a minimum of 2.2 V expands its usability across more battery-operated devices.

Maximum Time At Peak Reflow Temperature (s): 30

A peak reflow time of 30 seconds makes it suitable for automated assembly, saving production time.

Peak Reflow Temperature (°C): 260

The ability to withstand peak reflow temperatures of 260 °C ensures compatibility with modern soldering techniques.

Length: 3 mm

A length of 3 mm contributes to the overall compact design, essential for contemporary electronic applications.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature conditions ensures reliability in demanding applications.

Maximum Supply Current (Isup): 0.06 mA

A low maximum supply current of 0.06 mA contributes to power efficiency, making it suitable for low-power applications.

Terminal Form: NO LEAD

The no-lead terminal form promotes a smaller footprint and better thermal performance.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm facilitates high-density packaging, which is crucial for modern compact electronics.

Maximum Supply Voltage (Vsup): 3.6 V

With a maximum supply voltage of 3.6 V, it supports higher voltages, suitable for various electronics and power applications.

Technical Specifications

Power Management ICs STM1403CSNQ6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

MANUAL RESET INPUT

Adjustable Threshold:

NO

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

STM1403CSNQ6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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