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STM1403ASMQ6F

STMicroelectronics

STM1403ASMQ6F by STMicroelectronics

STM1403ASMQ6F from STMicroelectronics is a compact power management IC designed for industrial applications. It operates at a nominal voltage of 3.3V, with a max current of 0.06mA and supports temperatures from -40 °C to 85°C. Its square, no-lead package ensures efficient thermal performance in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,535 parts In-Stock

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4,535

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Vyrian

USA . 4,303 parts In-Stock

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4,303

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Anansix

USA . 2,732 parts In-Stock

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2,732

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,322 parts In-Stock

1+ parts

$4.293

100+ parts

-

1k+ parts

$3.863

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2,322

$4.293

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$3.863

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MKK Technologies

India . 1,707 parts In-Stock

1+ parts

$8.072

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1,707

$8.072

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DigiPath Technology Company

USA . 1,707 parts In-Stock

1+ parts

$8.072

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1,707

$8.072

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AZTECH Wire

Italy . 1,000 parts In-Stock

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$13.470

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1,000

$13.470

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Microchip USA

USA . 451 parts In-Stock

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$18.154

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451

$18.154

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Component Stockers USA

USA . 626 parts In-Stock

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$99.990

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626

$99.990

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Perfect Parts

USA . 10,613 parts In-Stock

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10,613

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Corphita

USA . 2,024 parts In-Stock

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2,024

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Parana Technologies

USA . 362 parts In-Stock

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$5.133

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362

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$5.133

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Overview

Elevate your power management solutions with the STM1403ASMQ6F from STMicroelectronics, a trusted leader in innovation and quality. This cutting-edge IC seamlessly supports a range of applications, ensuring efficiency and reliability in even the most demanding environments. With its compact design and robust temperature range, it delivers exceptional performance while minimizing space requirements. Experience the benefits of superior energy management that enhances device longevity and operational effectiveness. Transform your projects today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for higher density designs and simpler automated assembly processes.

Package Shape: SQUARE

A square package shape optimizes space on the PCB, enabling efficient use of board real estate.

Nominal Supply Voltage (Vsup): 3.3 V

Operating at a nominal 3.3V is suitable for a wide range of digital circuits, making it versatile for various applications.

Power Supplies (V): 2.5/3.3

Support for both 2.5V and 3.3V supply voltages increases compatibility with different system architectures.

No. of Terminals: 16

Having 16 terminals provides sufficient I/O options for complex power management functions.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile is ideal for space-constrained applications, while the heat sink/slugs help with thermal management.

Maximum Operating Temperature: 85 °C

Operating up to 85 °C ensures reliability in demanding environmental conditions, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C allows for applications in extreme cold environments.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish enhances solderability and provides better corrosion resistance.

Terminal Position: QUAD

Quad terminal position aids in reducing trace lengths, improving electrical performance.

Maximum Seated Height: 1 mm

A low seated height contributes to a slim profile, making it ideal for compact designs.

Width (mm): 3 mm

A width of 3 mm allows for efficient PCB layout without sacrificing performance.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, it can be integrated seamlessly in power management applications.

Minimum Supply Voltage (Vsup): 2.2 V

Supports operation at a minimum of 2.2V, providing flexibility for low-voltage designs.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds ensures compatibility with standard soldering processes, improving manufacturability.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C indicates a robust design capable of withstanding modern soldering techniques.

Length: 3 mm

The compact length of 3 mm supports high-density PCB layouts without overcrowding.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures long-term reliability in harsh environments.

Maximum Supply Current (Isup): 0.06 mA

Low supply current of 0.06 mA minimizes power consumption, making it ideal for battery-operated devices.

Terminal Form: NO LEAD

No-lead terminals facilitate a smaller footprint and better thermal performance.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm is conducive for compact designs, allowing for high-density mounting.

Maximum Supply Voltage (Vsup): 3.6 V

A maximum supply voltage of 3.6V provides versatility and adaptability to different design requirements.

Technical Specifications

Power Management ICs STM1403ASMQ6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

MANUAL RESET INPUT

Adjustable Threshold:

NO

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

STM1403ASMQ6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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