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STL17N3LLH6

STMicroelectronics

STL17N3LLH6 by STMicroelectronics

STL17N3LLH6 by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max drain current of 17 A, a breakdown voltage of 30 V, and operates at up to 150 °C. Ideal for compact designs with its no-lead surface mount package.

Median Price

$6.720

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 35 parts In-Stock

1+ parts

$6.720

100+ parts

$3.360

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35

$6.720

$3.360

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Vyrian

USA . 3,358 parts In-Stock

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3,358

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J2 Sourcing AB

Sweden . 3,045 parts In-Stock

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3,045

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Digiode

USA . 2,618 parts In-Stock

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2,618

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Anansix

USA . 1,287 parts In-Stock

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1,287

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Contempo Components LLC

USA . 401 parts In-Stock

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401

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Microfarads

USA . 34 parts In-Stock

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34

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,314 parts In-Stock

1+ parts

$1.092

100+ parts

-

1k+ parts

$0.983

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-

1,314

$1.092

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$0.983

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MKK Technologies

India . 297 parts In-Stock

1+ parts

$2.054

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297

$2.054

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DigiPath Technology Company

USA . 297 parts In-Stock

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$2.054

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297

$2.054

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AZTECH Wire

Italy . 1,156 parts In-Stock

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$18.450

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$18.450

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Component Stockers USA

USA . 563 parts In-Stock

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$99.990

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563

$99.990

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Kepictronics

USA . 9,994 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,154 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,295 parts In-Stock

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Parana Technologies

USA . 1,742 parts In-Stock

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$1.306

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1,742

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$1.306

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Corphita

USA . 1,337 parts In-Stock

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Perfect Parts

USA . 931 parts In-Stock

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Overview

Unlock powerful performance with the STL17N3LLH6 from STMicroelectronics, a trusted leader in the semiconductor industry. This N-channel power FET offers exceptional switching capabilities and reliability, making it ideal for diverse applications—from automotive to industrial systems. With its compact design and high efficiency, you can achieve superior energy management and enhanced system response, ensuring your projects run smoothly while reducing costs. Choose quality; choose STMicroelectronics.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their enhanced electron mobility, providing faster switching speeds and improved efficiency, making this product ideal for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design by reducing component count and improves reliability by providing intrinsic protection against back EMF in inductive loads.

Transistor Application: SWITCHING

Designed for switching applications, this FET can handle rapid on/off tasks efficiently, making it suitable for power management and motor control applications.

Surface Mount: YES

Surface mount design allows for compact PCB layouts and automated assembly, enhancing manufacturing efficiency and saving space in electronic devices.

Minimum DS Breakdown Voltage: 30 V

A minimum breakdown voltage of 30V ensures safe operation in high-voltage environments, protecting the circuit from voltage spikes.

Package Shape: SQUARE

The square package shape promotes efficient thermal dissipation and ease of mounting, facilitating reliable performance in constrained spaces.

Terminal Form: NO LEAD

No lead technology reduces parasitic inductance, improving performance at high frequencies while also being compatible with modern soldering techniques.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides lower power consumption during idle states, enhancing energy efficiency in power-sensitive applications.

Maximum Pulsed Drain Current (IDM): 68 A

The ability to handle high pulsed drain current enhances this FET's capability for demanding applications, allowing it to manage transient loads effectively.

Maximum Drain Current (Abs) (ID): 17 A

With a maximum drain current rating of 17A, this FET can support substantial load currents, making it suitable for diverse power applications.

No. of Terminals: 8

An 8-terminal configuration supports complex circuit designs and offers flexibility in interconnections for various application requirements.

Maximum Power Dissipation (Abs): 50 W

A power dissipation rating of 50W allows for effective thermal management in high-power scenarios, supporting system reliability and longevity.

Package Style (Meter): SMALL OUTLINE

The small outline package style optimizes space and is ideal for portable devices, contributing to the overall compact design of electronics.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for high switching speed and low power consumption, making this FET suitable for modern electronic applications.

Maximum Operating Temperature: 150 °C

Operating at high temperatures up to 150 °C increases application versatility, allowing it to function in harsh environments without degradation.

Transistor Element Material: SILICON

Silicon offers excellent electrical characteristics, reliability, and availability, making this FET a dependable choice for numerous applications.

Maximum Drain Current (ID): 17 A

Reiterating a maximum drain current of 17A highlights the FET's robust design, capable of handling substantial load requirements efficiently.

Maximum Drain-Source On Resistance: 0.0073 ohm

The low on-resistance of 0.0073 ohm minimizes power loss during operation, enhancing overall efficiency and performance in power applications.

Terminal Position: DUAL

Dual terminal position allows for versatile layout options, giving designers greater flexibility in circuit design and component placement.

Case Connection: DRAIN

DRAIN case connection ensures optimized thermal performance and electrical characteristics, improving the FET's reliability in demanding applications.

Technical Specifications

Power Field Effect Transistors (FET) STL17N3LLH6 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

ULTRA-LOW RESISTANCE

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

17 A

Maximum Drain Current (ID):

17 A

Maximum Drain-Source On Resistance:

.0073 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-XDSO-N8

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

68 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STL17N3LLH6 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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