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STL15N3LLH5

STMicroelectronics

STL15N3LLH5 by STMicroelectronics

STL15N3LLH5 by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max drain current of 15 A, a breakdown voltage of 30 V, and operates at up to 150 °C. Ideal for compact power management in modern electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,675 parts In-Stock

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6,675

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Digiode

USA . 702 parts In-Stock

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702

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Anansix

USA . 347 parts In-Stock

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347

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SPM Sales

USA . 113 parts In-Stock

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113

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,385 parts In-Stock

1+ parts

$0.351

100+ parts

-

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$0.316

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1,385

$0.351

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$0.316

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MKK Technologies

India . 1,293 parts In-Stock

1+ parts

$0.661

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1,293

$0.661

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DigiPath Technology Company

USA . 1,293 parts In-Stock

1+ parts

$0.661

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1,293

$0.661

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AZTECH Wire

Italy . 365 parts In-Stock

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$11.920

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365

$11.920

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Component Stockers USA

USA . 324 parts In-Stock

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$99.990

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324

$99.990

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Alle Elektronik GmbH

Germany . 3,940 parts In-Stock

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3,940

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Corphita

USA . 3,925 parts In-Stock

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3,925

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Parana Technologies

USA . 2,168 parts In-Stock

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$0.420

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2,168

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$0.420

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Overview

Unlock the power of efficiency with the STL15N3LLH5 from STMicroelectronics, a leader in innovative semiconductor solutions. This N-channel Power FET offers unmatched reliability for demanding applications, boasting exceptional switching capabilities and robust performance, all in a sleek, space-saving package. Ideal for a range of electronics, it ensures lower power loss and higher durability, elevating your designs while enhancing energy efficiency. Experience quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers durability and protection, making it suitable for a variety of operating environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are generally more efficient and offer higher performance in switching applications compared to P-channel transistors.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides additional protection and improved thermal management, enhancing the reliability of the device in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can handle rapid on-off cycles effectively, making it ideal for power management.

Surface Mount: YES

Surface mount technology allows for smaller and more efficient circuit designs, leading to reduced board space and potentially lower manufacturing costs.

Minimum DS Breakdown Voltage: 30 V

With a breakdown voltage of 30 V, this FET is suitable for applications that require reliable operation at moderate to high voltage levels.

Package Shape: SQUARE

The square package shape facilitates efficient use of PCB space and allows for better thermal performance.

Terminal Form: NO LEAD

No-lead design minimizes parasitic inductance and improves the overall electrical performance of the FET.

Operating Mode: ENHANCEMENT MODE

Enhancement mode enables the device to have high input impedance, leading to lower power consumption during operation.

Maximum Pulsed Drain Current (IDM): 60 A

This capability allows for handling high transient currents, making it suitable for demanding applications.

Maximum Drain Current (Abs) (ID): 15 A

A maximum drain current of 15 A ensures that the device can handle significant power levels without overheating.

No. of Terminals: 5

Having 5 terminals provides flexibility in circuit design while ensuring robust connections for reliable performance.

Maximum Power Dissipation (Abs): 50 W

With a power dissipation capability of 50 W, the FET can manage heat effectively, allowing for efficient operation in power applications.

Package Style (Meter): SMALL OUTLINE

The small outline package minimizes footprint on the PCB while maintaining high performance characteristics.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables higher efficiency and faster switching speeds compared to other FET technologies.

Maximum Operating Temperature: 150 °C

A high operating temperature rating means this transistor can be used in demanding environments without risk of failure.

Transistor Element Material: SILICON

Silicon is a common material for FETs, providing good thermal stability and electrical performance.

Terminal Finish: MATTE TIN

Matte tin finish ensures good solderability, enhancing the reliability of the connections on the PCB.

Maximum Drain Current (ID): 15 A

The repeat of the maximum drain current reaffirms its capability to support robust applications under demanding load conditions.

Maximum Drain-Source On Resistance: 0.007 ohm

Low on-resistance translates to higher efficiency and less heat generation during operation, ideal for power applications.

Terminal Position: DUAL

Dual terminal positioning allows for flexible integration into complex circuit layouts, improving design versatility.

Case Connection: DRAIN

Connection type influences easy integration into various circuit designs, simplifying the overall layout.

Maximum Time At Peak Reflow Temperature (s): 30

30 seconds is optimal for ensuring quality solder joints without damaging the component, ensuring long-term reliability.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C indicates that this FET can withstand modern high-temperature soldering processes.

Technical Specifications

Power Field Effect Transistors (FET) STL15N3LLH5 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

ULTRA-LOW RESISTANCE

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

15 A

Maximum Drain Current (ID):

15 A

Maximum Drain-Source On Resistance:

.007 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-N5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

60 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STL15N3LLH5 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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