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STHU32N65DM6AG

STMicroelectronics

STHU32N65DM6AG by STMicroelectronics

STHU32N65DM6AG by STMicroelectronics is a robust N-channel FET designed for switching applications. It features a 650V breakdown voltage, 120A max pulsed drain current, and operates at temperatures from -55 °C to 150 °C. Ideal for high-power circuits, it ensures efficient performance in compact designs.

Median Price

$8.010

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 18 parts In-Stock

1+ parts

$4.160

100+ parts

$3.270

1k+ parts

$3.050

10k+ parts

-

18

$4.160

$3.270

$3.050

-

Newark

USA . 18 parts In-Stock

1+ parts

$8.010

100+ parts

$5.360

1k+ parts

$5.040

10k+ parts

$4.950

18

$8.010

$5.360

$5.040

$4.950

Element14

Singapore . 58 parts In-Stock

1+ parts

$12.100

100+ parts

$8.640

1k+ parts

$8.120

10k+ parts

-

58

$12.100

$8.640

$8.120

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,524 parts In-Stock

1+ parts

$5.234

100+ parts

-

1k+ parts

-

10k+ parts

-

4,524

$5.234

-

-

-

Vyrian

USA . 3,459 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,459

-

-

-

-

Anansix

USA . 1,126 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,126

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 886 parts In-Stock

1+ parts

$1.704

100+ parts

-

1k+ parts

$1.533

10k+ parts

-

886

$1.704

-

$1.533

-

MKK Technologies

India . 98 parts In-Stock

1+ parts

$3.204

100+ parts

-

1k+ parts

-

10k+ parts

-

98

$3.204

-

-

-

DigiPath Technology Company

USA . 98 parts In-Stock

1+ parts

$3.204

100+ parts

-

1k+ parts

-

10k+ parts

-

98

$3.204

-

-

-

Corphita

USA . 4,254 parts In-Stock

1+ parts

$4.959

100+ parts

-

1k+ parts

-

10k+ parts

-

4,254

$4.959

-

-

-

Continental Prestige Electronics

USA . 93 parts In-Stock

1+ parts

$8.590

100+ parts

$6.940

1k+ parts

-

10k+ parts

-

93

$8.590

$6.940

-

-

Microchip USA

USA . 8,082 parts In-Stock

1+ parts

$16.193

100+ parts

-

1k+ parts

-

10k+ parts

-

8,082

$16.193

-

-

-

Alle Elektronik GmbH

Germany . 1,216 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,216

-

-

-

-

Parana Technologies

USA . 447 parts In-Stock

1+ parts

-

100+ parts

$2.037

1k+ parts

-

10k+ parts

-

447

-

$2.037

-

-

Overview

Unlock high-performance efficiency with the STHU32N65DM6AG from STMicroelectronics, a leading innovator in semiconductor technology. This robust N-channel power FET is engineered for seamless switching applications, delivering unmatched reliability and enhanced thermal management. Ideal for demanding environments, it offers exceptional voltage handling and low on-resistance, boosting your designs' performance while reducing energy costs. Experience the quality and innovation that only ST can provide!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides an optimal balance between durability and cost-effectiveness, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are generally more efficient and faster in switching applications, which improves performance in power management.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances reliability and simplifies circuit design, making it easier to handle inductive loads.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET excels in rapidly turning on and off, ideal for power supply circuits.

Surface Mount: YES

Surface mount technology allows for compact designs and automated assembly, ensuring high scalability and efficiency in manufacturing.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage, this FET can withstand higher voltage levels, making it suitable for demanding power applications.

Package Shape: RECTANGULAR

The rectangular package shape is advantageous for PCB layout, promoting efficient space utilization on circuit boards.

Terminal Form: GULL WING

Gull wing terminals provide robust mechanical support and optimal soldering areas, which enhance reliability and ease of assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for minimized power losses by enabling the device to remain off until activated, increasing energy efficiency.

Maximum Pulsed Drain Current (IDM): 120 A

A high pulsed drain current supports the use of this FET in transient power applications without compromising performance.

Avalanche Energy Rating (EAS): 778 mJ

The high avalanche energy rating offers added protection against voltage spikes, ensuring durability in harsh conditions.

No. of Terminals: 7

Having seven terminals provides multiple connection points, facilitating flexible circuit designs and multiple functionalities.

Maximum Power Dissipation (Abs): 320 W

An impressive power dissipation capability enables this FET to handle high-power applications without overheating, enhancing reliability.

Package Style (Meter): SMALL OUTLINE

The small outline package is ideal for space-constrained applications, allowing for more compact device designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology is well-known for its superior switching speed and efficiency, making this product suitable for high-performance applications.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature ensures performance stability in demanding thermal environments, widening application scope.

Transistor Element Material: SILICON

Silicon is a standard material in FETs, renowned for its excellent electrical characteristics, contributing to overall performance efficiency.

Minimum Operating Temperature: -55 °C

With a low minimum operating temperature, this FET can function reliably in extreme cold environments, expanding its application possibilities.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish provides superior corrosion resistance and excellent conductivity, ensuring long-term reliability and performance.

Maximum Drain Current (ID): 37 A

The substantial maximum drain current rating allows this FET to manage significant load currents, making it suitable for high-power applications.

Maximum Drain-Source On Resistance: 0.097 ohm

A low on-resistance minimizes power losses during operation, contributing to greater efficiency and thermal management.

Terminal Position: SINGLE

A single terminal position simplifies the design and layout of circuits, allowing for streamlined integration into devices.

Case Connection: DRAIN

Having the case connection at the drain facilitates better thermal conduction and overall device efficiency.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures compatibility with robust soldering processes, enhancing manufacturing reliability.

Maximum Feedback Capacitance (Crss): 0.3 pF

Low feedback capacitance contributes to faster switching speeds, improving overall circuit performance in fast applications.

Reference Standard: AEC-Q101

Compliance with the AEC-Q101 standard ensures this FET meets automotive reliability and quality benchmarks, making it suitable for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) STHU32N65DM6AG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

778 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

37 A

Maximum Drain-Source On Resistance:

.097 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

.3 pF

JESD-30 Code:

R-PSSO-G7

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

7

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

120 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STHU32N65DM6AG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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