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STH140N6F7-6

STMicroelectronics

STH140N6F7-6 by STMicroelectronics

STH140N6F7-6 by STMicroelectronics is an N-channel MOSFET designed for efficient switching applications. It features a max drain current of 80 A, a breakdown voltage of 60 V, and operates at up to 175 °C. Ideal for power management in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,892 parts In-Stock

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Anansix

USA . 2,291 parts In-Stock

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Digiode

USA . 1,389 parts In-Stock

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1,389

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IDEA Electronic Components Group

UK . 1,990 parts In-Stock

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$0.442

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$0.397

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1,990

$0.442

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$0.397

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MKK Technologies

India . 1,187 parts In-Stock

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$0.830

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$0.830

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DigiPath Technology Company

USA . 1,187 parts In-Stock

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$0.830

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$0.830

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Ampacity Inc.

Singapore . 335 parts In-Stock

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$1.050

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335

$1.050

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AZTECH Wire

Italy . 114 parts In-Stock

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$11.110

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114

$11.110

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Component Stockers USA

USA . 314 parts In-Stock

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$99.990

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Alle Elektronik GmbH

Germany . 3,983 parts In-Stock

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Perfect Parts

USA . 3,360 parts In-Stock

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Parana Technologies

USA . 1,289 parts In-Stock

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$0.528

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$0.528

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Corphita

USA . 1,041 parts In-Stock

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Overview

Experience unparalleled reliability and efficiency with the STH140N6F7-6 from STMicroelectronics, a leader in semiconductor innovation. This N-channel power FET excels in switching applications, offering robust performance with minimal on-resistance for superior energy savings. Its compact design ensures easy integration into your projects, making it ideal for a variety of applications, from automotive to industrial systems. Elevate your designs with STMicroelectronics' trusted quality and enjoy the peace of mind that comes with their industry expertise.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers good mechanical strength and thermal stability, making the product durable and reliable in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically provide better performance and efficiency compared to P-channel transistors, making them ideal for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the versatility of the FET by providing protection and enabling efficient bidirectional operation.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can handle rapid on/off cycles effectively, improving overall circuit performance.

Surface Mount: YES

Surface mount capability allows for compact PCB designs and facilitates automated assembly processes, reducing manufacturing costs.

Minimum DS Breakdown Voltage: 60 V

With a minimum breakdown voltage of 60 V, this FET is suited for high-voltage applications, providing reliable operation under demanding conditions.

Package Shape: RECTANGULAR

The rectangular package shape maximizes PCB space usage, making it compatible with a variety of layout designs.

Terminal Form: GULL WING

Gull wing terminals ensure optimal soldering and robustness in assembly, reducing the chances of mechanical stress failures.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for higher efficiency and better control of the output characteristics, making it suitable for precision applications.

Maximum Pulsed Drain Current (IDM): 320 A

A maximum pulsed drain current of 320 A provides the capability to handle high-current applications, making it suitable for power-intensive devices.

No. of Terminals: 6

Having 6 terminals allows for flexible circuit designing and increased functionality in various applications.

Maximum Power Dissipation (Abs): 158 W

With a high power dissipation rating of 158 W, the FET can manage substantial power loads, enhancing system performance and reliability.

Package Style (Meter): SMALL OUTLINE

The small outline package style reduces space requirements on PCBs, allowing for higher density designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables high-speed operation and low power consumption, making this FET suitable for modern electronic applications.

Maximum Operating Temperature: 175 °C

A maximum operating temperature of 175 °C allows this FET to function reliably in high-temperature environments, extending its application range.

Transistor Element Material: SILICON

Silicon material provides a well-established platform for the FET, ensuring good performance and reliability in varied applications.

Maximum Drain Current (ID): 80 A

The ability to handle a maximum drain current of 80 A makes this FET an excellent choice for high-power applications.

Maximum Drain-Source On Resistance: 0.0032 ohm

A low on-resistance value of 0.0032 ohm minimizes power loss and improves efficiency, making it ideal for energy-sensitive applications.

Terminal Position: SINGLE

The single terminal position simplifies circuit design and integration into various layouts.

Case Connection: DRAIN

The case connection to the drain facilitates efficient heat dissipation, ensuring reliable operation under load conditions.

Maximum Feedback Capacitance (Crss): 193 pF

A feedback capacitance of 193 pF allows for stable operation in high-frequency applications without significant delay or distortion.

Technical Specifications

Power Field Effect Transistors (FET) STH140N6F7-6 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

BULK: 1000

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.0032 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

193 pF

JESD-30 Code:

R-PSSO-G6

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

320 A

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STH140N6F7-6 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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