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STGIPQ3H60T-HLS

STMicroelectronics

STGIPQ3H60T-HLS by STMicroelectronics

STGIPQ3H60T-HLS by STMicroelectronics is a Motion Control IC with 26 terminals, operating voltage range of 13.5V to 18V. It is designed for AC motor control applications in automotive environments, featuring a max output current of 6A and temperature range from -40°C to 125°C.

Median Price

$6.694

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 54 parts In-Stock

1+ parts

$6.694

100+ parts

-

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54

$6.694

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-

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Vyrian

USA . 8,922 parts In-Stock

1+ parts

-

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8,922

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Anansix

USA . 2,414 parts In-Stock

1+ parts

-

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2,414

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Digiode

USA . 963 parts In-Stock

1+ parts

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963

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 127 parts In-Stock

1+ parts

$0.500

100+ parts

-

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127

$0.500

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$6.694

100+ parts

-

1k+ parts

$6.359

10k+ parts

$6.225

1,000

$6.694

-

$6.359

$6.225

IDEA Electronic Components Group

UK . 941 parts In-Stock

1+ parts

$7.771

100+ parts

-

1k+ parts

$6.994

10k+ parts

-

941

$7.771

-

$6.994

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MKK Technologies

India . 2,191 parts In-Stock

1+ parts

$14.613

100+ parts

-

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10k+ parts

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2,191

$14.613

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DigiPath Technology Company

USA . 2,191 parts In-Stock

1+ parts

$14.613

100+ parts

-

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10k+ parts

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2,191

$14.613

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AZTECH Wire

Italy . 786 parts In-Stock

1+ parts

$18.780

100+ parts

-

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786

$18.780

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Microchip USA

USA . 8,830 parts In-Stock

1+ parts

$20.739

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8,830

$20.739

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Corphita

USA . 2,372 parts In-Stock

1+ parts

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2,372

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Parana Technologies

USA . 1,537 parts In-Stock

1+ parts

-

100+ parts

$9.292

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1,537

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$9.292

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Perfect Parts

USA . 622 parts In-Stock

1+ parts

-

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622

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Overview

Elevate your motion control applications with the STGIPQ3H60T-HLS from STMicroelectronics. Designed with precision and reliability in mind, this AC motor controller offers seamless operation and efficient performance. With a wide temperature range and automotive-grade quality, this microelectronic assembly is perfect for a variety of industrial and automotive applications. Trust in STMicroelectronics' reputation for excellence and experience the value and benefits of superior motion control with the STGIPQ3H60T-HLS.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Nominal Supply Voltage (Vsup): 15 V

The 15V supply voltage allows for efficient power consumption and compatibility with a wide range of devices.

No. of Terminals: 26

Having 26 terminals provides flexibility and options for connecting to other components or devices.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliable performance even in demanding conditions.

Width (mm): 12.45 mm

The compact width of 12.45mm allows for easy integration into space-constrained applications.

Minimum Supply Voltage (Vsup): 13.5 V

The 13.5V minimum supply voltage ensures that the product can operate effectively even under low power conditions.

Temperature Grade: AUTOMOTIVE

Being automotive grade means the product is designed to withstand the rigors of automotive environments, ensuring reliability and durability.

Maximum Output Current: 6 A

The high maximum output current of 6A allows the product to drive motors and other components with significant power requirements.

Terminal Form: THROUGH-HOLE

The through-hole terminal form makes installation and soldering easy, ensuring a reliable connection.

Technical Specifications

Motion Control ICs STGIPQ3H60T-HLS attributes and parameters. Explore more Motion Control ICs devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PDFM-T26

Length:

32.15 mm

No. of Functions:

1

No. of Terminals:

26

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

6 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DFM

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

4.2 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

13.5 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

12.45 mm

Trade Compliance

STGIPQ3H60T-HLS Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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