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STC6NF30V

STMicroelectronics

STC6NF30V by STMicroelectronics

STC6NF30V by STMicroelectronics is a versatile N-channel FET designed for switching applications. It features a max drain current of 6 A, a breakdown voltage of 30 V, and operates at up to 150 °C. Ideal for compact designs with its surface mount configuration.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,814 parts In-Stock

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7,814

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Digiode

USA . 2,764 parts In-Stock

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2,764

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Anansix

USA . 2,615 parts In-Stock

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2,615

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,077 parts In-Stock

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$1.580

100+ parts

-

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$1.422

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1,077

$1.580

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$1.422

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MKK Technologies

India . 1,477 parts In-Stock

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$2.970

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1,477

$2.970

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DigiPath Technology Company

USA . 1,477 parts In-Stock

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$2.970

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1,477

$2.970

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AZTECH Wire

Italy . 391 parts In-Stock

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$21.240

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391

$21.240

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A-Z Elektronik GmbH

Germany . 5,006 parts In-Stock

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5,006

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Corphita

USA . 4,903 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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Parana Technologies

USA . 1,544 parts In-Stock

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$1.889

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1,544

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$1.889

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Assy Fe

Spain . 1,294 parts In-Stock

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Kepictronics

USA . 262 parts In-Stock

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Overview

Unlock the power of efficiency with the STC6NF30V from STMicroelectronics, a leader in innovative semiconductor solutions. This N-channel Power FET is designed for reliable switching applications, ensuring seamless performance and minimal energy loss. With its robust construction and advanced technology, it excels in diverse electronic designs, providing exceptional value and durability to customers. Elevate your projects with a trusted component that embodies quality and reliability!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection against environmental factors, making the FET suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are generally preferred for their higher efficiency in conducting current, which translates to better performance in switching applications.

Configuration: COMMON DRAIN, 2 ELEMENTS WITH BUILT-IN DIODE

This configuration allows for versatile usage in circuits while providing protection from back EMF, enhancing reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can handle rapid on/off cycles, making it ideal for power management in electronic devices.

Surface Mount: YES

Being surface mountable allows for compact designs and easier integration into modern PCB layouts, optimizing space in electronic products.

Minimum DS Breakdown Voltage: 30 V

A minimum breakdown voltage of 30 V ensures that the FET can operate safely in applications with varying voltage levels.

Package Shape: RECTANGULAR

The rectangular package shape provides a standardized form factor that simplifies PCB design and assembly processes.

Terminal Form: GULL WING

Gull wing terminals enable easy soldering and reliable connections, reducing the likelihood of mechanical stress failure.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation leads to lower power consumption during idle states, improving energy efficiency in circuits.

No. of Elements: 2

With two elements in this FET, it can handle more current and support complex circuit designs, maximizing functionality.

Maximum Pulsed Drain Current (IDM): 24 A

A high pulsed drain current rating of 24 A allows for significant bursts of current, making this FET suitable for demanding applications.

Maximum Drain Current (Abs) (ID): 6 A

The maximum continuous drain current of 6 A supports robust performance in power handling applications.

No. of Terminals: 8

Having 8 terminals allows for versatile wiring options in circuit designs, enhancing the FET’s adaptability.

Maximum Power Dissipation (Abs): 1.25 W

A maximum power dissipation of 1.25 W ensures that the FET remains operational without overheating, increasing longevity.

Package Style (Meter): SMALL OUTLINE

The small outline package style optimizes space on PCBs, making it ideal for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high input impedance and excellent switching speed, making this FET suitable for high-performance applications.

Maximum Operating Temperature: 150 °C

Operating up to 150 °C enables use in high-temperature environments, expanding application possibilities.

Transistor Element Material: SILICON

Silicon elements provide favorable electrical characteristics and reliability, contributing to the effectiveness of the FET.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish offers excellent corrosion resistance and enhances solderability, improving connection quality.

Maximum Drain Current (ID): 6 A

Reaffirming the maximum drain current of 6 A supports reliable operation in applications requiring steady power delivery.

Maximum Drain-Source On Resistance: 0.03 ohm

A low on-resistance of 0.03 ohms minimizes power loss during operation, enhancing overall energy efficiency.

Terminal Position: DUAL

Dual terminal positioning facilitates easier access for connections, simplifying PCB layout and design.

Technical Specifications

Power Field Effect Transistors (FET) STC6NF30V attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

LOW THRESHOLD

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

6 A

Maximum Drain Current (ID):

6 A

Maximum Drain-Source On Resistance:

.03 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

24 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STC6NF30V Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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