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STC3105IQT

STMicroelectronics

STC3105IQT by STMicroelectronics

STC3105IQT by STMicroelectronics is a Power Management IC with Vsup range of 2.7V to 5.5V, suitable for industrial applications. It has a small outline package style, dual terminals, and adjustable threshold voltage of +2V. Operating temperature ranges from -40 °C to 85°C making it ideal for various power supply support circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,713 parts In-Stock

1+ parts

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3,713

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Anansix

USA . 2,546 parts In-Stock

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2,546

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Vyrian

USA . 2,408 parts In-Stock

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2,408

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LIBRA Elektronik GmbH

Germany . 1,904 parts In-Stock

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1,904

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 596 parts In-Stock

1+ parts

$1.080

100+ parts

-

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$0.972

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596

$1.080

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$0.972

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Microchip USA

USA . 138 parts In-Stock

1+ parts

$1.798

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138

$1.798

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MKK Technologies

India . 949 parts In-Stock

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$2.031

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949

$2.031

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DigiPath Technology Company

USA . 949 parts In-Stock

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$2.031

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949

$2.031

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AZTECH Wire

Italy . 425 parts In-Stock

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$10.390

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425

$10.390

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Component Stockers USA

USA . 373 parts In-Stock

1+ parts

$99.990

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373

$99.990

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Perfect Parts

USA . 14,692 parts In-Stock

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14,692

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Corphita

USA . 3,892 parts In-Stock

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3,892

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Parana Technologies

USA . 757 parts In-Stock

1+ parts

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$1.291

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757

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$1.291

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Overview

Enhance your power management solutions with the STC3105IQT by STMicroelectronics. Crafted with precision and expertise, this Power Management IC offers reliable performance and efficiency. Ideal for a range of applications, this product brings value and convenience to your projects. Experience the benefits of advanced technology and seamless integration with the STC3105IQT. Trust in the quality and innovation of STMicroelectronics to elevate your power management experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and heat-resistant, ensuring the IC's reliability and longevity in various operating conditions.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 3.6 V

Suitable for a wide range of electronic devices, providing a stable power source for efficient performance.

No. of Terminals: 8

Provides multiple connection points for versatility in circuit design and integration.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications where heat may be a concern.

Minimum Operating Temperature: -40 °C

Capable of operating in cold environments without compromising performance.

Terminal Position: DUAL

Offers flexibility in installation and connection options, accommodating different circuit layouts.

Width (mm): 2 mm

Compact size allows for space-efficient placement on circuit boards, ideal for compact electronic devices.

Minimum Supply Voltage (Vsup): 2.7 V

Provides a reliable power source even at lower voltages, ensuring consistent operation of connected devices.

Temperature Grade: INDUSTRIAL

Designed to meet the rigorous demands of industrial environments, where temperature fluctuations and extreme conditions are common.

Maximum Supply Voltage (Vsup): 5.5 V

Offers a wide operating range, suitable for a variety of electronic applications that require higher voltage levels.

Adjustable Threshold: YES

Allows for customization of threshold voltage, enabling precise control and optimization of power management functions.

Technical Specifications

Power Management ICs STC3105IQT attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2V

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-N8

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

2 mm

Trade Compliance

STC3105IQT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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