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ST7FMC1K2TCE

STMicroelectronics

ST7FMC1K2TCE by STMicroelectronics

ST7FMC1K2TCE by STMicroelectronics is an 8-bit microcontroller with a speed of 8MHz and 8KB FLASH memory, ideal for embedded applications. It features LINbus connectivity and supports motor control with PWM. Operating from -40 °C to 125 °C, it suits harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,333 parts In-Stock

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4,333

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Vyrian

USA . 2,144 parts In-Stock

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2,144

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Anansix

USA . 1,684 parts In-Stock

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1,684

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Distributors (Availability)

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Microchip USA

USA . 339 parts In-Stock

1+ parts

$6.669

100+ parts

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339

$6.669

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AZTECH Wire

Italy . 1,166 parts In-Stock

1+ parts

$19.430

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1,166

$19.430

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Corphita

USA . 3,715 parts In-Stock

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3,715

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MKK Technologies

India . 2,322 parts In-Stock

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2,322

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DigiPath Technology Company

USA . 2,322 parts In-Stock

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2,322

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IDEA Electronic Components Group

UK . 1,770 parts In-Stock

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1,770

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Vigor

Singapore . 1,218 parts In-Stock

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1,218

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Parana Technologies

USA . 1,174 parts In-Stock

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1,174

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Overview

Elevate your projects with the ST7FMC1K2TCE from STMicroelectronics, a trusted leader in cutting-edge technology. This robust 8-bit microcontroller is designed for efficiency and versatility, making it perfect for applications in automotive systems and industrial automation. With features like LINbus connectivity and advanced motor control capabilities, it ensures reliable performance even in extreme conditions. Experience unmatched quality and innovation that drives your success!

Feature Benefit Bullets

Standard Package: 250

A standard package size of 250 ensures that users can procure these ICs in bulk, which is cost-effective for manufacturers.

Category: Integrated Circuits (ICs) Embedded Microcontrollers

As an embedded microcontroller, it is suitable for dedicated control applications, enhancing system reliability and efficiency.

Series: ST7

The ST7 series is well-regarded, offering a mature ecosystem of tools and libraries, facilitating easier development.

Packaging: Tray

Tray packaging is optimal for automatic handling and placement in assembly lines, improving manufacturing efficiency.

Core Processor: ST7

The ST7 processor is designed for low-power applications, helping to extend battery life in portable devices.

Core Size: 8-Bit

The 8-bit architecture balances performance with power consumption, making it ideal for simple control tasks.

Speed: 8MHz

An 8MHz speed ensures enough processing power for basic applications without excessive energy consumption.

Connectivity: LINbus, SCI

Versatile connectivity options allow integration into various networks and systems, enhancing compatibility.

Peripherals: LVD, Motor Control PWM, POR, PWM, WDT

The inclusion of multiple peripherals facilitates diverse functionalities, reducing the need for additional components.

Number of I/O: 17

With 17 I/O pins, this microcontroller can interface with various peripherals, providing flexibility in design.

Program Memory Size: 8KB (8K x 8)

8KB of FLASH memory offers sufficient space for many applications while allowing for easy updates and modifications.

Program Memory Type: FLASH

FLASH memory is non-volatile, retaining data even without power, which is essential for embedded applications.

RAM Size: 384 x 8

The available RAM ensures that the microcontroller can handle moderate data processing needs efficiently.

Voltage - Supply (Vcc/Vdd): 3.8V ~ 5.5V

A wide voltage supply range enhances compatibility with various power sources, making it suitable for multiple applications.

Data Converters: A/D 8x10b

The presence of 8 10-bit analog-to-digital converters enables accurate data sampling for a variety of sensors.

Oscillator Type: External

An external oscillator allows customization of frequency, which can optimize performance for specific applications.

Operating Temperature: -40 °C ~ 125 °C (TA)

The wide operating temperature range ensures reliability in harsh environments, making it ideal for industrial use.

Mounting Type: Surface Mount

Surface mount technology saves PCB space and supports automated assembly, enhancing production efficiency.

Package / Case: 32-LQFP

The 32-LQFP package offers a compact footprint while providing sufficient pins for versatile applications.

Base Product Number: ST7FM

The ST7FM base product number denotes a family of devices with shared characteristics, simplifying selection for designers.

Moisture Sensitivity Level (MSL): 3 (168 Hours)

An MSL of 3 indicates the device can be handled with standard precautions and retains reliability over a reasonable timeframe.

Technical Specifications

Additional Parts ST7FMC1K2TCE attributes and parameters. Explore more Additional Parts devices from STMicroelectronics

Technical Specifications

Core Processor:

ST7

Speed:

8MHz

Operating Temperature:

-40°C ~ 125°C (TA)

Category:

Integrated Circuits (ICs)
Embedded Microcontrollers

Program Memory Type:

FLASH

RAM Size:

384 x 8

Number of I/O:

17

Peripherals:

LVD, Motor Control PWM, POR, PWM, WDT

Mounting Type:

Surface Mount

Oscillator Type:

External

Standard Package:

250

Series:

ST7

Package / Case:

32-LQFP

Core Size:

8-Bit

Packaging:

Tray

Connectivity:

LINbusSCI

Program Memory Size:

8KB (8K x 8)

Data Converters:

A/D 8x10b

Voltage - Supply (Vcc/Vdd):

3.8V ~ 5.5V

Base Product Number:

ST7FM

Moisture Sensitivity Level (MSL):

3 (168 Hours)

Trade Compliance

ST7FMC1K2TCE Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8542.31.0001

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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