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ST779ACN

STMicroelectronics

ST779ACN by STMicroelectronics

ST779ACN by STMicroelectronics is a bipolar switching regulator with a voltage-mode control. It operates b/w 1.1V to 6V, delivering up to 1A output current, and features an in-line package with 8 terminals. Ideal for boosting applications, it withstands temps from 0 °C to 85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,650 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,650

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Vyrian

USA . 727 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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727

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Digiode

USA . 725 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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725

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 33 parts In-Stock

1+ parts

$17.985

100+ parts

-

1k+ parts

$16.187

10k+ parts

-

33

$17.985

-

$16.187

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MKK Technologies

India . 751 parts In-Stock

1+ parts

$33.820

100+ parts

-

1k+ parts

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10k+ parts

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751

$33.820

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DigiPath Technology Company

USA . 751 parts In-Stock

1+ parts

$33.820

100+ parts

-

1k+ parts

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10k+ parts

-

751

$33.820

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-

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Parana Technologies

USA . 735 parts In-Stock

1+ parts

-

100+ parts

$21.504

1k+ parts

-

10k+ parts

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735

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$21.504

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Corphita

USA . 484 parts In-Stock

1+ parts

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100+ parts

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484

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Overview

Elevate your designs with the ST779ACN from STMicroelectronics, a trusted leader in innovation. This high-performance switching regulator ensures efficiency and reliability, making it ideal for various applications, from consumer electronics to industrial systems. With its robust build and versatile input range, you can count on optimal performance even in challenging environments. Experience superior quality and peace of mind with a manufacturer renowned for excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and resistance to environmental factors, ensuring longer product life.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on PCBs, making it easier to design compact electronic devices.

Number of Terminals: 8

Eight terminals provide versatile connectivity options, enabling seamless integration into different circuit configurations.

Package Style (Meter): IN-LINE

In-line package style simplifies the assembly process, which can help reduce manufacturing costs and improve efficiency.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this regulator can effectively function in demanding environments without overheating.

Control Mode: VOLTAGE-MODE

Voltage-mode control offers fast transient response and high stability, making it suitable for various applications requiring precise output.

Minimum Operating Temperature: 0 °C

The ability to operate from 0 °C allows for usage in a wider range of environmental conditions, from indoors to lightly controlled outdoor settings.

Terminal Finish: Matte Tin (Sn)

Matte tin finish provides good solderability and corrosion resistance, ensuring reliable electrical connections over time.

Terminal Position: DUAL

Dual terminal positioning allows for greater flexibility in circuit layout and can facilitate better thermal management.

Maximum Seated Height: 4.8 mm

A low seated height helps in compact designs, making it easier to fit into space-constrained applications.

Width: 7.62 mm

A narrow width allows for high-density manufacturing and fitting into tighter spaces on the PCB.

Other IC Type: SWITCHING REGULATOR

As a switching regulator, this product offers high efficiency with low power losses compared to linear regulators.

Nominal Input Voltage: 2.5 V

A nominal input voltage of 2.5 V makes it ideal for battery-operated devices, extending operational longevity.

Maximum Output Current: 1 A

With a maximum output current of 1 A, it can effectively power a range of devices, from sensors to small motors.

Technology: BIPOLAR

Bipolar technology generally provides higher performance metrics and better thermal stability compared to unipolar alternatives.

Terminal Form: THROUGH-HOLE

Through-hole terminals ensure robust mechanical mounting and are easier to handle during assembly compared to surface-mount devices.

Switcher Config: BOOST

The boost configuration is ideal for applications needing higher output voltages from lower input, enhancing versatility in power management.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm is a standard size that promotes compatibility with existing layouts and ease of soldering.

Minimum Input Voltage: 1.1 V

The low minimum input voltage ensures compatibility with a variety of low-voltage power sources and battery technologies.

Maximum Input Voltage: 6 V

A maximum input voltage of 6 V allows for a wide range of input sources, making the product versatile for diverse applications.

Technical Specifications

Switching Regulators & Controllers ST779ACN attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Maximum Input Voltage:

6 V

Minimum Input Voltage:

1.1 V

Nominal Input Voltage:

2.5 V

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Current:

1 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

4.8 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

NO

Switcher Config:

BOOST

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

ST779ACN Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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