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ST75MMTR

STMicroelectronics

ST75MMTR by STMicroelectronics

ST75MMTR by STMicroelectronics is a power management IC designed for industrial applications, featuring a nominal voltage of 13V and operating temperatures from -40 °C to 85 °C. It comes in a compact square package with 48 terminals. Ideal for efficient power supply management, it supports voltages b/w 8V and 18V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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EBV Elektronik

Germany . 2,500 parts In-Stock

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2,500

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Martec Srl

Italy . 23,621 parts In-Stock

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23,621

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Chip Stock

USA . 16,000 parts In-Stock

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Vyrian

USA . 4,734 parts In-Stock

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Digiode

USA . 2,555 parts In-Stock

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Anansix

USA . 976 parts In-Stock

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976

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IDEA Electronic Components Group

UK . 2,270 parts In-Stock

1+ parts

$5.275

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$4.748

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2,270

$5.275

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$4.748

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MKK Technologies

India . 1,748 parts In-Stock

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$9.920

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1,748

$9.920

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DigiPath Technology Company

USA . 1,748 parts In-Stock

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$9.920

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1,748

$9.920

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AZTECH Wire

Italy . 81 parts In-Stock

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$17.720

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81

$17.720

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Microchip USA

USA . 4,208 parts In-Stock

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$20.184

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4,208

$20.184

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Parana Technologies

USA . 2,183 parts In-Stock

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$6.307

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2,183

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$6.307

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Corphita

USA . 1,611 parts In-Stock

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1,611

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Overview

Unlock the potential of your power management solutions with the ST75MMTR from STMicroelectronics, a trusted leader in semiconductor innovation. This high-performance IC offers exceptional reliability across a wide temperature range, making it perfect for industrial applications. Designed for efficiency and compactness, it ensures optimal performance while saving valuable board space. Elevate your designs with a product that delivers unmatched quality, enabling you to stay ahead in today's competitive market.

Feature Benefit Bullets

Surface Mount: YES

Being surface mount compatible allows for a compact design and easy integration into modern electronic devices.

Package Shape: SQUARE

The square package shape facilitates better space utilization on the PCB.

Nominal Supply Voltage (Vsup): 13 V

The nominal supply voltage of 13V makes it suitable for a wide range of power supply applications.

No. of Terminals: 48

With 48 terminals, this IC offers extensive connectivity options for various configurations.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The package style ensures efficient heat dissipation while maintaining a slim profile, crucial for high-density designs.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C allows the IC to function reliably in various environmental conditions.

Minimum Operating Temperature: -40 °C

The capability to operate in temperatures as low as -40 °C makes this IC suitable for industrial and outdoor applications.

Terminal Position: QUAD

Quad terminal position enhances the layout flexibility on the PCB.

Maximum Seated Height: 1 mm

A low seated height of 1 mm allows for minimal profile in designs, which is beneficial in space-constrained applications.

Width: 7 mm

A width of 7 mm helps maintain optimal layout density on PCBs.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

Designed specifically for power supply management, making it ideal for efficiency-critical applications.

Minimum Supply Voltage (Vsup): 8 V

This product can start operating at a minimum supply voltage of 8V, making it versatile for various power sources.

Length: 7 mm

The 7 mm length complements its compact design, enhancing overall space efficiency in circuits.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature use, ensuring reliability in demanding environments.

Terminal Form: NO LEAD

No lead design improves the thermal performance and allows for a more compact layout.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch optimizes the layout for high-density applications.

Maximum Supply Voltage (Vsup): 18 V

The high maximum supply voltage of 18V expands its application potential in various power management scenarios.

Technical Specifications

Power Management ICs ST75MMTR attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

8 V

Nominal Supply Voltage (Vsup):

13 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7 mm

Trade Compliance

ST75MMTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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