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ST75MM

STMicroelectronics

ST75MM by STMicroelectronics

ST75MM by STMicroelectronics is a power management IC designed for industrial applications, featuring a nominal voltage of 13V and operating temperature range from -40 °C to 85 °C. It comes in a compact square package with 48 terminals. Ideal for efficient power supply management, it supports voltages b/w 8V and 18V.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Chip Stock

USA . 16,000 parts In-Stock

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Digiode

USA . 4,288 parts In-Stock

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Vyrian

USA . 2,617 parts In-Stock

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Anansix

USA . 2,071 parts In-Stock

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ComSIT Distribution GmbH

Germany . 95 parts In-Stock

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Cogito LLC

Ukraine . 5 parts In-Stock

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Vigor

Singapore . 1,560 parts In-Stock

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$6.320

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$6.320

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IDEA Electronic Components Group

UK . 2,127 parts In-Stock

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$7.663

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$6.896

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$6.896

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MKK Technologies

India . 138 parts In-Stock

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$14.409

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138

$14.409

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DigiPath Technology Company

USA . 138 parts In-Stock

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$14.409

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$14.409

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AZTECH Wire

Italy . 786 parts In-Stock

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$19.050

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$19.050

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Microchip USA

USA . 3,583 parts In-Stock

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$20.184

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Corphita

USA . 2,975 parts In-Stock

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Parana Technologies

USA . 1,267 parts In-Stock

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$9.162

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$9.162

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Overview

Unlock the power of efficiency with the ST75MM by STMicroelectronics, a top-tier Power Management IC designed for demanding industrial applications. Its robust performance across extreme temperatures ensures reliability in every environment. With a sleek, space-saving design and advanced energy management capabilities, this IC maximizes operational efficiency while minimizing costs. Experience unparalleled quality and innovation from a trusted leader in semiconductor solutions!

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability makes installation easier and more compact, ideal for modern PCB designs.

Package Shape: SQUARE

A square package shape provides uniform dimensions, which can simplify layout and heat dissipation.

Nominal Supply Voltage (Vsup): 13 V

The 13V nominal supply voltage is a standard value, making it suitable for a wide range of industrial applications.

No. of Terminals: 48

With 48 terminals, this IC offers a rich feature set and versatile connection options for complex designs.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile and heat sink design enhance thermal management, allowing for efficient operation in confined spaces.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC is robust enough for challenging industrial environments.

Minimum Operating Temperature: -40 °C

The -40 °C minimum operating temperature allows for use in extreme conditions, making it suitable for industrial and automotive applications.

Terminal Position: QUAD

Quad terminal positioning aids in simple layout design, improving routing for power and signal integrity.

Maximum Seated Height: 1 mm

A maximum seated height of 1mm allows for a low-profile design, enhancing space efficiency in devices.

Width: 7 mm

At a width of 7mm, this IC can fit in compact spaces while providing substantial functionality.

Other IC Type: POWER SUPPLY MANAGEMENT CIRCUIT

Being a power supply management circuit, it is essential for energy-efficient designs, extending the life of devices.

Minimum Supply Voltage (Vsup): 8 V

The 8V minimum supply voltage enables compatibility with various power sources and reliability under low-voltage conditions.

Length: 7 mm

A compact length of 7mm contributes to the overall small footprint, allowing more design flexibility.

Temperature Grade: INDUSTRIAL

This IC is classified as industrial grade, ensuring it meets rigorous standards for performance and reliability.

Terminal Form: NO LEAD

No lead terminals provide better thermal performance and reduce footprint on the PCB, which enhances layout design.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for tighter spacing, enabling more compact designs suited for high-density applications.

Maximum Supply Voltage (Vsup): 18 V

The ability to handle a maximum supply voltage of 18V provides flexibility in design, accommodating various power levels.

Technical Specifications

Power Management ICs ST75MM attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

8 V

Nominal Supply Voltage (Vsup):

13 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7 mm

Trade Compliance

ST75MM Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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