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ST72T141K2M6

STMicroelectronics

ST72T141K2M6 by STMicroelectronics

ST72T141K2M6 by STMicroelectronics is an 8-bit microcontroller with a speed of 8MHz and 8KB OTP memory. It features SPI connectivity, supports motor control PWM, and operates in -40 °C to 85 °C. Ideal for embedded applications requiring efficient processing and I/O management.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Digiode

USA . 4,965 parts In-Stock

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Vyrian

USA . 3,324 parts In-Stock

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Anansix

USA . 2,534 parts In-Stock

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Microchip USA

USA . 171 parts In-Stock

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AZTECH Wire

Italy . 1,031 parts In-Stock

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Corphita

USA . 2,352 parts In-Stock

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Parana Technologies

USA . 2,074 parts In-Stock

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IDEA Electronic Components Group

UK . 1,552 parts In-Stock

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Vigor

Singapore . 1,185 parts In-Stock

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MKK Technologies

India . 505 parts In-Stock

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DigiPath Technology Company

USA . 505 parts In-Stock

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Assy Fe

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Overview

Unlock the potential of your next project with the ST72T141K2M6 from STMicroelectronics. Renowned for excellence, STMicroelectronics delivers top-tier integrated circuits that empower innovation across various applications, from motor control to embedded systems. With its reliable performance and robust design, this 8-bit microcontroller ensures seamless connectivity and efficient operation, making it the ideal choice for engineers seeking quality and versatility. Elevate your designs today!

Feature Benefit Bullets

Other Names: 497-2117-5, 497-2117-5-NDR

Multiple naming conventions allow for easy identification and interchangeability in various applications.

Standard Package: 28

The standard package size ensures compatibility with widely used boards and socket designs.

Category: Integrated Circuits (ICs), Embedded Microcontrollers

Belongs to a trusted category, suitable for various embedded applications, increasing versatility.

Series: ST7

Part of the ST7 series, known for reliability and performance in microcontroller applications.

Packaging: Tube

Tube packaging helps to maintain the integrity of each unit and facilitates easy handling.

Core Processor: ST7

The ST7 core processor provides efficient processing capabilities for embedded applications.

Core Size: 8-Bit

8-bit architecture is suitable for cost-sensitive applications while still delivering adequate performance.

Speed: 8MHz

Operating at 8MHz allows for efficient processing and quick response times in various applications.

Connectivity: SPI

SPI connectivity allows for high-speed communication between the microcontroller and other devices.

Peripherals: LVD, Motor Control PWM, POR, PWM, WDT

A rich set of peripherals enhances functionality, making this chip suitable for various control applications.

Number of I/O: 14

With 14 I/O pins, this microcontroller can handle multiple inputs and outputs, making it versatile for different projects.

Program Memory Size: 8KB (8K x 8)

8KB program memory provides adequate space for embedded applications, allowing for moderate levels of functionality.

Program Memory Type: OTP

One-Time Programmable (OTP) memory enables permanent program storage, ideal for embedded applications.

RAM Size: 256 x 8

Sufficient RAM size supports data manipulation needs during program execution, enabling efficient operations.

Voltage - Supply (Vcc/Vdd): 4V ~ 5.5V

Wide voltage supply range offers flexibility in power supply options, accommodating various applications.

Data Converters: A/D 8x8b

An 8-channel 8-bit ADC enables efficient analog to digital conversions, enhancing its usability in diverse applications.

Oscillator Type: Internal

An internal oscillator simplifies circuit design by reducing the need for external components.

Operating Temperature: -40 °C ~ 85 °C (TA)

Wide operating temperature range ensures reliability in extreme environments, making it suitable for industrial uses.

Mounting Type: Surface Mount

Surface mount technology allows for compact design and improved performance in electronics.

Package / Case: 34-BSOP (0.295", 7.50mm Width)

The 34-BSOP package is compact yet versatile, suitable for space-constrained applications.

Base Product Number: ST72T

Indicates the base product number, providing ease of reference in specifying and ordering.

Moisture Sensitivity Level (MSL): 3 (168 Hours)

MSL 3 rating ensures that the product can withstand reasonable handling before usage without special precautions.

Technical Specifications

Additional Parts ST72T141K2M6 attributes and parameters. Explore more Additional Parts devices from STMicroelectronics

Technical Specifications

Core Processor:

ST7

Other Names:

497-2117-5
497-2117-5-NDR

Speed:

8MHz

Operating Temperature:

-40°C ~ 85°C (TA)

Category:

Integrated Circuits (ICs)
Embedded Microcontrollers

Program Memory Type:

OTP

RAM Size:

256 x 8

Number of I/O:

14

Peripherals:

LVD, Motor Control PWM, POR, PWM, WDT

Mounting Type:

Surface Mount

Oscillator Type:

Internal

Standard Package:

28

Series:

ST7

Package / Case:

34-BSOP (0.295", 7.50mm Width)

Core Size:

8-Bit

Packaging:

Tube

Connectivity:

SPI

Program Memory Size:

8KB (8K x 8)

Data Converters:

A/D 8x8b

Voltage - Supply (Vcc/Vdd):

4V ~ 5.5V

Base Product Number:

ST72T

Moisture Sensitivity Level (MSL):

3 (168 Hours)

Trade Compliance

ST72T141K2M6 Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8542.31.0001

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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