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ST619LBDR

STMicroelectronics

ST619LBDR by STMicroelectronics

ST619LBDR by STMicroelectronics is a compact boost regulator with a max output current of 30 mA and operates b/w -40 °C to 85°C. It features an input voltage range of 2-3.6 V and a switching frequency up to 500 kHz, ideal for industrial applications. Its small outline design ensures efficient surface mounting in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 11,086 parts In-Stock

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11,086

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Digiode

USA . 4,163 parts In-Stock

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4,163

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Anansix

USA . 296 parts In-Stock

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296

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Distributors (Availability)

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Microchip USA

USA . 201 parts In-Stock

1+ parts

$9.854

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201

$9.854

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AZTECH Wire

Italy . 1,133 parts In-Stock

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$16.970

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1,133

$16.970

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IDEA Electronic Components Group

UK . 661 parts In-Stock

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$19.795

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-

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$17.815

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661

$19.795

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$17.815

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MKK Technologies

India . 423 parts In-Stock

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$37.223

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423

$37.223

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DigiPath Technology Company

USA . 423 parts In-Stock

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$37.223

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423

$37.223

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Lixinc

USA . 8,468 parts In-Stock

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Vigor

Singapore . 6,484 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,736 parts In-Stock

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2,736

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Parana Technologies

USA . 2,170 parts In-Stock

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$23.668

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$23.668

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Corphita

USA . 741 parts In-Stock

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Kepictronics

USA . 380 parts In-Stock

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Overview

Unlock the power of efficiency with the ST619LBDR from STMicroelectronics, a leader in high-quality semiconductor solutions. This compact and reliable switching regulator is designed for industrial applications, offering exceptional performance across diverse environments. With its robust temperature range and surface-mount design, it enhances space-saving designs while ensuring optimal output. Trust in STMicroelectronics to deliver unparalleled quality and innovative technology that drives your projects forward seamlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body ensures durability and reliability, making it suitable for a variety of applications.

Surface Mount: YES

Being a surface mount component allows for compact designs and efficient use of space on printed circuit boards (PCBs).

Package Shape: RECTANGULAR

The rectangular shape aids in placement efficiency and helps in optimizing the layout of the PCB.

No. of Terminals: 8

Having 8 terminals provides flexibility for connections and simplifies circuit design.

Package Style (Meter): SMALL OUTLINE

A small outline package reduces the footprint on the PCB and is ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

This high operating temperature limit makes it suitable for industrial applications where heat dissipation is a concern.

Minimum Operating Temperature: -40 °C

Operating at low temperatures means this regulator can function effectively in harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish enhances solderability and provides excellent corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal positioning aids in effective heat dissipation and improved electrical performance.

Maximum Seated Height: 1.75 mm

A low seated height contributes to a lower profile on the PCB, making it an excellent choice for compact devices.

Width: 3.9 mm

This width strikes a balance between size and performance, allowing it to be utilized in a variety of applications.

Other IC type: SWITCHED CAPACITOR REGULATOR

Switched capacitor regulators provide excellent efficiency and are ideal for maintaining voltage levels in compact circuits.

Nominal Input Voltage: 3 V

The nominal input voltage makes it well-suited for battery-operated devices, maximizing efficiency and energy conservation.

Maximum Time At Peak Reflow Temperature: 40 s

A manageable peak reflow time ensures compatibility with mass production soldering processes.

Peak Reflow Temperature: 260 °C

This high reflow temperature tolerance allows it to withstand typical soldering processes without damage.

Length: 4.9 mm

Compact length is advantageous for applications where space is a premium, such as portable electronics.

Temperature Grade: INDUSTRIAL

Industrial temperature grading guarantees performance stability in a variety of challenging environments.

Maximum Switching Frequency: 500 kHz

A high switching frequency contributes to better efficiency and compactness, reducing the size of associated components.

Maximum Output Current: 0.03 A

This output current capacity is suitable for low-power applications, making it efficient for powering small devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve mechanical stability on the PCB.

Switcher Config: BOOST

The boost configuration allows for stepping up voltage levels, making this product ideal for powering higher voltage requirements from lower voltage sources.

Terminal Pitch: 1.27 mm

A standard terminal pitch simplifies PCB layout and soldering processes, ensuring compatibility with existing designs.

Minimum Input Voltage: 2 V

This low minimum input voltage expands its usability in various battery-powered applications.

Nominal Output Voltage: 5 V

The nominal output voltage of 5 V is a common requirement for many devices, facilitating easy integration.

Maximum Input Voltage: 3.6 V

With a maximum input voltage of 3.6 V, this regulator can effectively handle a wide range of input scenarios while ensuring stability.

Technical Specifications

Switching Regulators & Controllers ST619LBDR attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Maximum Input Voltage:

3.6 V

Minimum Input Voltage:

2 V

Nominal Input Voltage:

3 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.03 A

Nominal Output Voltage:

5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Analog ICs

Surface Mount:

YES

Switcher Config:

BOOST

Maximum Switching Frequency:

500 kHz

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3.9 mm

Trade Compliance

ST619LBDR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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