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ST619LBD

STMicroelectronics

ST619LBD by STMicroelectronics

ST619LBD by STMicroelectronics is a compact boost regulator with a max output current of 30 mA and operates b/w -40 °C to 85°C. It features an input voltage range of 2-3.6 V and a switching frequency up to 500 kHz, ideal for industrial applications. Its small outline design ensures efficient surface mounting in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 11,362 parts In-Stock

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11,362

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Anansix

USA . 1,954 parts In-Stock

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1,954

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Digiode

USA . 1,209 parts In-Stock

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1,209

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Microchip USA

USA . 354 parts In-Stock

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$9.285

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354

$9.285

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IDEA Electronic Components Group

UK . 1,216 parts In-Stock

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$12.087

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-

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$10.878

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1,216

$12.087

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$10.878

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AZTECH Wire

Italy . 915 parts In-Stock

1+ parts

$17.610

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915

$17.610

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MKK Technologies

India . 1,257 parts In-Stock

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$22.729

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1,257

$22.729

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DigiPath Technology Company

USA . 1,257 parts In-Stock

1+ parts

$22.729

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1,257

$22.729

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Component Stockers USA

USA . 236 parts In-Stock

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$99.990

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Corphita

USA . 3,634 parts In-Stock

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3,634

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Vigor

Singapore . 1,295 parts In-Stock

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1,295

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Parana Technologies

USA . 1,208 parts In-Stock

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$14.452

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$14.452

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Kepictronics

USA . 200 parts In-Stock

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Overview

Experience unparalleled efficiency with the ST619LBD from STMicroelectronics, a leader in innovative power solutions. This robust switching regulator excels in industrial applications, delivering reliable performance even in extreme temperatures from -40 °C to 85°C. Its compact design and superior build quality ensure seamless integration into your projects, offering significant power savings. Trust STMicroelectronics for cutting-edge technology that empowers your designs with excellence and durability!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material contributes to the product's durability and longevity in various operating environments.

Surface Mount: YES

Surface mount technology allows for compact design and integration into densely populated circuit boards.

Package Shape: RECTANGULAR

The rectangular shape optimizes space efficiency on the PCB, making it suitable for tight layouts.

No. of Terminals: 8

With 8 terminals, this product is versatile and can easily connect to other components, enhancing circuit flexibility.

Package Style (Meter): SMALL OUTLINE

The small outline package style reduces the overall footprint of the circuit, ideal for portable devices.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C enables this product to function reliably in various thermal environments.

Minimum Operating Temperature: -40 °C

The product's ability to operate as low as -40 °C makes it suitable for applications in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish enhances corrosion resistance and ensures reliable electrical connections over time.

Terminal Position: DUAL

Dual terminal positioning supports improved layout options on PCBs, facilitating easier assembly.

Maximum Seated Height: 1.75 mm

A low seated height ensures compatibility with low-profile applications, enhancing design possibilities.

Width: 3.9 mm

A narrow width allows for space-saving designs, making it ideal for small electronic devices.

Other IC type: SWITCHED CAPACITOR REGULATOR

As a switched capacitor regulator, it ensures efficient voltage regulation, contributing to energy savings.

Nominal Input Voltage: 3 V

Designed for a nominal input voltage of 3V, optimizes performance for battery-powered applications.

Length: 4.9 mm

The compact length makes it suitable for small form factor designs without compromising performance.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliable performance in harsher environments, enhancing product longevity.

Maximum Switching Frequency: 500 kHz

A high maximum switching frequency improves response times and allows for better performance in dynamic applications.

Maximum Output Current: 0.03 A

Providing up to 30 mA of output current is useful for low-power applications, making it energy-efficient.

Terminal Form: GULL WING

Gull wing terminals allow for easy soldering and rework, which is beneficial in manufacturing processes.

Switcher Config: BOOST

The boost switcher configuration allows stepping up lower voltages, making it versatile for various power sources.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is standard for many applications, enhancing compatibility with existing designs.

Minimum Input Voltage: 2 V

Minimum input voltage of 2V enables operation in low-voltage scenarios, maximizing application versatility.

Nominal Output Voltage: 5 V

A nominal output voltage of 5V is standard for many electronic devices, simplifying integration into products.

Maximum Input Voltage: 3.6 V

Handles input voltages up to 3.6V, providing flexibility in power sources without compromising performance.

Technical Specifications

Switching Regulators & Controllers ST619LBD attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Maximum Input Voltage:

3.6 V

Minimum Input Voltage:

2 V

Nominal Input Voltage:

3 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.03 A

Nominal Output Voltage:

5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Analog ICs

Surface Mount:

YES

Switcher Config:

BOOST

Maximum Switching Frequency:

500 kHz

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

ST619LBD Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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