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ST3232BWR

STMicroelectronics

ST3232BWR by STMicroelectronics

ST3232BWR by STMicroelectronics is a dual line transceiver with a max supply voltage of 5.5V and operates in industrial temperatures from -40 °C to 85°C. It features CMOS technology, supporting EIA-232 standards, ideal for reliable data communication. Its compact SO package ensures efficient surface mounting in various applications.

Median Price

$0.570

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 1,000 parts In-Stock

1+ parts

-

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-

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$0.570

10k+ parts

$0.550

1,000

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$0.570

$0.550

Distributors (In-Stock)

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Vyrian

USA . 3,687 parts In-Stock

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3,687

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Digiode

USA . 3,415 parts In-Stock

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3,415

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Lakeland Logistics Inc

USA . 2,000 parts In-Stock

1+ parts

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2,000

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Bristol Electronics

USA . 1,996 parts In-Stock

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$1.529

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$1.343

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1,996

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$1.529

$1.343

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Chip Stock

USA . 1,125 parts In-Stock

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1,125

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Anansix

USA . 233 parts In-Stock

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233

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ComSIT Distribution GmbH

Germany . 25 parts In-Stock

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25

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ComSIT USA

USA . 25 parts In-Stock

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25

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,528 parts In-Stock

1+ parts

$6.549

100+ parts

-

1k+ parts

$5.894

10k+ parts

-

1,528

$6.549

-

$5.894

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AZTECH Wire

Italy . 568 parts In-Stock

1+ parts

$9.400

100+ parts

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568

$9.400

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MKK Technologies

India . 2,006 parts In-Stock

1+ parts

$12.314

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2,006

$12.314

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DigiPath Technology Company

USA . 2,006 parts In-Stock

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$12.314

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2,006

$12.314

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Microchip USA

USA . 5,533 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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Vigor

Singapore . 2,730 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,400 parts In-Stock

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2,400

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Assy Fe

Spain . 1,800 parts In-Stock

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Corphita

USA . 1,683 parts In-Stock

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1,683

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Parana Technologies

USA . 1,249 parts In-Stock

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$7.830

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1,249

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$7.830

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Perfect Parts

USA . 874 parts In-Stock

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874

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Overview

Unlock seamless communication with the ST3232BWR from STMicroelectronics, a trusted leader in reliable electronic solutions. This compact line driver and receiver excels in performance across diverse applications, delivering robust data transmission even in demanding environments. With low power consumption and wide voltage compatibility, it ensures efficiency without compromising quality. Elevate your projects with cutting-edge technology designed to enhance connectivity and reliability—all backed by STMicroelectronics' commitment to excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures longevity and reliability, making it suitable for various applications.

Surface Mount: YES

The surface mount design facilitates easy integration into modern PCB layouts with higher density.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this product can accommodate a wide range of power supply configurations.

Number of Functions: 2

Having two functions in one package saves board space and reduces component count, enhancing design efficiency.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of board space when integrated into designs.

Power Supplies (V): 3.3/5

Supports both 3.3V and 5V power supplies, increasing versatility for different system requirements.

Number of Terminals: 16

The 16 terminals provide ample connection points for reliable signal transmission and reception.

Package Style (Meter): SMALL OUTLINE

The small outline package is well-suited for compact designs where space is limited.

Minimum Supply Voltage: 3 V

With a minimum supply voltage of 3 V, it can operate effectively in low-voltage applications.

Maximum Operating Temperature: 85 °C

Rated for operation up to 85 °C, this product is reliable in high-temperature environments.

Minimum Operating Temperature: -40 °C

Can operate in extreme low temperatures down to -40 °C, making it suitable for industrial and outdoor applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish ensures excellent corrosion resistance and reliable electrical connections.

Terminal Position: DUAL

Dual terminal position enhances flexibility in routing and connection options on the PCB.

Maximum Seated Height: 2.65 mm

The low seated height assures compatibility with low-profile applications, facilitating design in compact spaces.

Width: 7.5 mm

A width of 7.5 mm supports snug placement in tighter spaces without compromising signal integrity.

Maximum Output Low Current: 1.6 Amp

This high output current can drive substantial loads directly, reducing the need for additional driver circuits.

Receiver Number of Bits: 2

The 2-bit receiver capability allows for efficient data transmission in multi-channel systems.

Maximum Time At Peak Reflow Temperature (s): 30

This specification ensures compatibility with standard reflow soldering processes, simplifying manufacturing.

Peak Reflow Temperature (°C): 260

The peak reflow temperature rating of 260 °C enables use in modern high-temperature soldering processes.

Length: 10.3 mm

Compact length aids in PCB design where space is a critical factor for performance.

Minimum Out Swing: 5 V

The 5V minimum output swing assures strong signal integrity across longer transmission lines.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product offers enhanced tolerance to harsh operating conditions.

Maximum Receive Delay: 0 ns

Instantaneous response ensures high-speed data integrity, crucial for time-sensitive applications.

Technology: CMOS

CMOS technology enhances power efficiency and allows for higher integration, leading to lower heat generation.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and reliable surface mount assembly.

Interface Standard: EIA-232; TIA-232; V.24; V.28

Support for common interface standards guarantees compatibility with a wide range of devices and systems.

Maximum Supply Current: 1 mA

Low supply current contributes to overall system efficiency, ideal for battery-powered applications.

Input Characteristics: SCHMITT TRIGGER

The Schmitt trigger input provides improved noise immunity and cleaner transitions for reliable operation.

Nominal Supply Voltage: 3.3 V

Nominal operation at 3.3V is widely used in modern electronics, making it a preferred choice for many designs.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch is a standard size that allows for compatibility with most PCB layouts.

Driver Number of Bits: 2

Two-bit driver capability enables efficient handling of dual-channel data transmission.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates reasonable moisture protection, ensuring reliability during storage and handling.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, it effectively facilitates bidirectional data transmission, essential for communication applications.

Technical Specifications

Line Drivers & Receivers ST3232BWR attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

NO

Driver No. of Bits:

2

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232; TIA-232; V.24; V.28

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

5 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

ST3232BWR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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