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ST202CW

STMicroelectronics

ST202CW by STMicroelectronics

ST202CW by STMicroelectronics is a dual line transceiver designed for EIA-232 interfaces, operating b/w 4.5V and 5.5V with a max supply current of 4mA. It features a max transmit delay of 3500ns and operates in temperatures up to 70 °C. Ideal for reliable data communication in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,432 parts In-Stock

1+ parts

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3,432

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Digiode

USA . 885 parts In-Stock

1+ parts

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885

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Anansix

USA . 676 parts In-Stock

1+ parts

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676

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ABC Electronics Ltd.

UK . 50 parts In-Stock

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 806 parts In-Stock

1+ parts

$2.326

100+ parts

-

1k+ parts

$2.093

10k+ parts

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806

$2.326

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$2.093

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MKK Technologies

India . 1,276 parts In-Stock

1+ parts

$4.373

100+ parts

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1,276

$4.373

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DigiPath Technology Company

USA . 1,276 parts In-Stock

1+ parts

$4.373

100+ parts

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10k+ parts

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1,276

$4.373

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A-Z Elektronik GmbH

Germany . 5,193 parts In-Stock

1+ parts

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5,193

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Corphita

USA . 1,847 parts In-Stock

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1,847

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Parana Technologies

USA . 1,561 parts In-Stock

1+ parts

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100+ parts

$2.781

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1,561

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$2.781

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Overview

Elevate your designs with the ST202CW from STMicroelectronics, a robust line driver and receiver that ensures seamless communication in various applications. Known for their commitment to quality and innovation, STMicroelectronics delivers reliability and performance, empowering engineers to create efficient solutions. With its compact package and impressive operational range, the ST202CW provides exceptional value, enhancing system reliability while simplifying integration into your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and good protection against environmental factors, ensuring reliable performance.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of PCB space, making integration easier in modern electronic applications.

Maximum Supply Voltage: 5.5 V

This relatively low maximum supply voltage makes the device suitable for a wide range of low-power applications.

No. of Functions: 2

Multiple functions increase versatility, allowing for more flexible system design without the need for additional components.

Package Shape: RECTANGULAR

The rectangular package shape contributes to enhanced space optimization on standard PCB layouts.

Maximum Transmit Delay: 3500 ns

A maximum transmit delay of 3500 ns ensures that data transmission is efficient for most communication applications.

Power Supplies (V): 5

With a nominal power supply of 5 V, this device can be easily powered in typical digital circuits and ensures compatibility.

No. of Terminals: 16

The 16 terminals provide sufficient I/O options for various applications, enhancing connectivity without requiring extensive circuit redesign.

Package Style (Meter): SMALL OUTLINE

The small outline package allows for high-density mounting on PCBs, saving space and weight in modern electronic designs.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5 V provides flexibility in power supply selection, accommodating a range of power source options.

Maximum Operating Temperature: 70 °C

The specified operating temperature range ensures reliability in various environments, making it suitable for commercial applications.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0 °C allows this device to function in a variety of conditions, adding to its application range.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This high-quality terminal finish enhances solderability and ensures reliable electrical connections, extending device lifespan.

Terminal Position: DUAL

The dual terminal position allows for easier PCB layout and design flexibility, facilitating better integration.

Maximum Seated Height: 2.65 mm

A compact height allows for more efficient stacking and layering in design configurations, which is crucial for space-constrained applications.

Width: 7.5 mm

A width of 7.5 mm means it can fit into tight layouts without sacrificing performance or functionality.

Maximum Output Low Current: 3.2 Amp

This high output low current capacity allows for driving substantial loads while maintaining efficiency and minimizing power loss.

Receiver No. of Bits: 2

With 2 bits for receiving, this device can handle a wide range of communication protocols, enhancing its usability.

Maximum Time At Peak Reflow Temperature: 30 s

30 seconds at peak reflow temperature ensures compatibility with standard soldering processes, facilitating manufacturing.

Peak Reflow Temperature: 260 °C

The high peak temperature tolerance ensures robust performance during assembly processes, hence supporting high production yields.

Length: 10.3 mm

A length of 10.3 mm makes the device easily adaptable for various applications that require compact solutions.

Minimum Out Swing: 10 V

The capability of a 10 V minimum out swing enhances signal integrity over long distances, ensuring reliable communication.

Temperature Grade: COMMERCIAL

Designed for commercial applications, this temperature grade ensures consistent performance in standard operating conditions.

Maximum Receive Delay: 500 ns

A low receive delay ensures quick response times for digital signals, making it ideal for time-sensitive applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy handling and soldering, reducing production complexity.

Interface Standard: EIA-232; TIA-232; V.28

Compatibility with common serial communication standards ensures easy integration into existing systems and legacy equipment.

Maximum Supply Current: 4 mA

The low supply current means a lower power consumption overall, which is ideal for battery-operated devices.

Input Characteristics: SCHMITT TRIGGER

Schmitt trigger input characteristics ensure clean transitions between logic states, reducing noise susceptibility and improving reliability.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 V makes this device extremely versatile and easy to use in various circuits.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch simplifies PCB design and component placement, enhancing manufacturing efficiency.

Driver No. of Bits: 2

2-bit driver capacity allows for effective communication over the selected interface, making it suitable for a wide array of applications.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this product can withstand typical handling and soldering processes, simplifying storage and assembly.

Interface IC Type: LINE TRANSCEIVER

Being a line transceiver indicates optimized performance for signal transmission and reception, particularly over longer distances.

Technical Specifications

Line Drivers & Receivers ST202CW attributes and parameters. Explore more Line Drivers & Receivers devices from STMicroelectronics

Specs

Differential Output:

NO

Driver No. of Bits:

2

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232; TIA-232; V.28

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

3.2 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

500 ns

Receiver No. of Bits:

2

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

4 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

3500 ns

Width:

7.5 mm

Trade Compliance

ST202CW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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