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ST1S03PM

STMicroelectronics

ST1S03PM by STMicroelectronics

ST1S03PM by STMicroelectronics is a compact switching regulator with a max output current of 1.5 A and operates at a peak frequency of 1800 kHz. It supports input voltages from 3 V to 16 V, making it ideal for efficient power management in space-constrained applications. Its small outline and dual terminal design enhance versatility in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,538 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,538

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Vyrian

USA . 942 parts In-Stock

1+ parts

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-

1k+ parts

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942

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Anansix

USA . 718 parts In-Stock

1+ parts

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718

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,164 parts In-Stock

1+ parts

$16.847

100+ parts

-

1k+ parts

$15.162

10k+ parts

-

2,164

$16.847

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$15.162

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MKK Technologies

India . 2,043 parts In-Stock

1+ parts

$31.680

100+ parts

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2,043

$31.680

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DigiPath Technology Company

USA . 2,043 parts In-Stock

1+ parts

$31.680

100+ parts

-

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10k+ parts

-

2,043

$31.680

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-

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Parana Technologies

USA . 2,220 parts In-Stock

1+ parts

-

100+ parts

$20.143

1k+ parts

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2,220

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$20.143

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Corphita

USA . 317 parts In-Stock

1+ parts

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317

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Overview

Unlock superior efficiency and compact design with the ST1S03PM from STMicroelectronics! This top-tier switching regulator excels in performance, delivering up to 1.5 A while fitting seamlessly into your designs with its slim profile. Ideal for a variety of applications, from consumer electronics to industrial systems, it ensures reliable power management without compromising space. Trust in STMicroelectronics' legacy of innovation and quality to elevate your projects!

Feature Benefit Bullets

Surface Mount: YES

This product's surface mount capability ensures easy integration into compact designs, making it suitable for modern electronics.

Package Shape: SQUARE

The square package shape optimizes space utilization on PCBs, allowing for efficient layout and design.

No. of Terminals: 6

With 6 terminals, this regulator provides the necessary connections for enhanced functionality and easy implementation.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline and thin profile make this product ideal for applications with space constraints, while the heat sink ensures efficient thermal management.

Control Mode: CURRENT-MODE

Current-mode control enhances stability and transient response, making this device reliable in various operating conditions.

Terminal Position: DUAL

Dual terminal positions allow flexible routing on the PCB, providing design versatility and ease of integration.

Maximum Seated Height: 1 mm

With a maximum seated height of just 1 mm, this product is perfect for low-profile applications, which require compact components.

Width: 3 mm

The compact width enables high-density layouts, making it suitable for miniaturized electronic devices.

Other IC Type: SWITCHING REGULATOR

As a switching regulator, it efficiently converts power with minimal losses, contributing to energy savings in the final application.

Nominal Input Voltage: 5 V

The nominal input voltage of 5 V aligns with common supply voltages, simplifying integration into existing designs.

Peak Reflow Temperature: 260 °C

The high peak reflow temperature ensures compatibility with standard soldering processes, improving manufacturing flexibility.

Length: 3 mm

The short length complements its width, making the overall footprint very compact, enabling high-density device designs.

Maximum Switching Frequency: 1800 kHz

A maximum switching frequency of 1800 kHz allows for smaller inductors and capacitors, further reducing overall size.

Maximum Output Current: 1.5 A

This product can deliver up to 1.5 A output current, making it robust enough for a variety of applications requiring higher power.

Terminal Form: NO LEAD

No-lead terminal form provides a cleaner finish and is more environmentally friendly, adhering to modern manufacturing practices.

Control Technique: PULSE WIDTH MODULATION

Using pulse width modulation enables precise control of output voltage, improving efficiency and performance in various loads.

Switcher Config: BUCK

As a buck converter, it efficiently steps down voltage while maintaining high performance, ideal for applications needing lower voltage levels.

Terminal Pitch: 0.95 mm

The 0.95 mm terminal pitch allows for denser packing on PCBs while still maintaining ease of soldering and assembly.

Minimum Input Voltage: 3 V

A minimum input voltage of 3 V provides flexibility for various battery-operated or low-voltage systems.

Maximum Input Voltage: 16 V

A maximum input voltage of 16 V ensures compatibility with a wide range of power sources, increasing versatility in applications.

Technical Specifications

Switching Regulators & Controllers ST1S03PM attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

16 V

Minimum Input Voltage:

3 V

Nominal Input Voltage:

5 V

JESD-30 Code:

S-XDSO-N6

Length:

3 mm

No. of Functions:

1

No. of Terminals:

6

Maximum Output Current:

1.5 A

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

1800 kHz

Terminal Form:

NO LEAD

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3 mm

Trade Compliance

ST1S03PM Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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