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SRI512-A3S/1GE

STMicroelectronics

SRI512-A3S/1GE by STMicroelectronics

SRI512-A3S/1GE by STMicroelectronics is a surface-mount RFID transponder operating at 13.56MHz, compliant with ISO 14443 and ISO 15693 standards. It supports a supply voltage of 2.5V to 3.5V and functions in temperatures from -20 °C to 85 °C. Ideal for RF access and monitoring applications, it comes packaged in tape & reel format for easy integration.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,444 parts In-Stock

1+ parts

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7,444

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Digiode

USA . 3,410 parts In-Stock

1+ parts

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3,410

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Anansix

USA . 1,601 parts In-Stock

1+ parts

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1,601

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 261 parts In-Stock

1+ parts

$17.710

100+ parts

-

1k+ parts

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10k+ parts

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261

$17.710

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Corphita

USA . 4,285 parts In-Stock

1+ parts

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4,285

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MKK Technologies

India . 1,803 parts In-Stock

1+ parts

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1,803

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DigiPath Technology Company

USA . 1,803 parts In-Stock

1+ parts

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1,803

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Parana Technologies

USA . 916 parts In-Stock

1+ parts

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916

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IDEA Electronic Components Group

UK . 329 parts In-Stock

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329

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Overview

Experience unmatched reliability and innovation with the SRI512-A3S/1GE RFID Transponder from STMicroelectronics. Renowned for their commitment to quality, STMicroelectronics delivers cutting-edge solutions that enhance security and efficiency in diverse applications like access control, inventory management, and monitoring systems. With its robust performance across varying conditions, the SRI512-A3S/1GE empowers your projects with seamless connectivity, ensuring you stay ahead in a competitive landscape. Elevate your designs with trusted technology today!

Feature Benefit Bullets

Other Names: 497-5535-6, 497-5535-1, 497-5535-2, SRI512A3S1GE

The multiple identifiers ensure compatibility with various systems and ease of integration into existing setups.

Standard Package: 3,000

A high standard package quantity makes it suitable for high-volume manufacturing and cost-effective supply.

Category: RF and Wireless, RFID, RF Access, Monitoring ICs

Being part of the RF and Wireless category positions it well for applications in modern communication and access control systems.

Packaging: Tape & Reel (TR)

The tape and reel packaging facilitates automated assembly processes, making it ideal for mass production.

Type: RFID Transponder

As an RFID transponder, it provides enhanced tracking and identification capabilities which are essential for inventory management and security.

Frequency: 13.56MHz

The 13.56MHz frequency is widely used in various RFID applications, ensuring broad compatibility and reliable performance.

Standards: ISO 14443, ISO 15693

Compliance with industry standards ensures interoperability with existing systems and enhances security.

Voltage - Supply: 2.5V ~ 3.5V

The flexible supply voltage range allows the product to be used in various electronic designs, reducing design constraints.

Operating Temperature: -20 °C ~ 85 °C

A wide operating temperature range ensures reliability in diverse environments, making it suitable for both indoor and outdoor applications.

Mounting Type: Surface Mount

Surface mount technology facilitates compact design construction, making it easier to integrate into small devices.

Package / Case: Die

The die package allows for efficient usage in custom designs, improving the integration possibilities in specialized applications.

Base Product Number: SRI512

Established product number simplifies sourcing and ensures continuity in supply for long-term projects.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

An unlimited moisture sensitivity level indicates ease of handling and storage, reducing the risk of damage during manufacturing.

Technical Specifications

Additional Parts SRI512-A3S/1GE attributes and parameters. Explore more Additional Parts devices from STMicroelectronics

Technical Specifications

Other Names:

497-5535-6
497-5535-1
497-5535-2
SRI512A3S1GE

Operating Temperature:

-20°C ~ 85°C

Category:

RF and Wireless
RFID, RF Access, Monitoring ICs

Mounting Type:

Surface Mount

Standards:

ISO 14443, ISO 15693

Standard Package:

3,000

Type:

RFID Transponder

Package / Case:

Die

Voltage - Supply:

2.5V ~ 3.5V

Packaging:

Tape & Reel (TR)

Frequency:

13.56MHz

Base Product Number:

SRI512

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

SRI512-A3S/1GE Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8542.32.0071

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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