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SPV1001D40

STMicroelectronics

SPV1001D40 by STMicroelectronics

SPV1001D40 by STMicroelectronics is a single rectifier diode with a max output current of 16A. It operates in temperatures ranging from -40 to 175 °C, making it suitable for various applications requiring high current rectification. The diode's small outline package and gull wing terminal form enable easy surface mount installation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,318 parts In-Stock

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Anansix

USA . 2,355 parts In-Stock

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2,355

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Digiode

USA . 1,119 parts In-Stock

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1,119

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IDEA Electronic Components Group

UK . 27 parts In-Stock

1+ parts

$0.056

100+ parts

-

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$0.051

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27

$0.056

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$0.051

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MKK Technologies

India . 1,721 parts In-Stock

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$0.106

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$0.106

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DigiPath Technology Company

USA . 1,721 parts In-Stock

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$0.106

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1,721

$0.106

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AZTECH Wire

Italy . 407 parts In-Stock

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$12.760

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407

$12.760

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Component Stockers USA

USA . 765 parts In-Stock

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$99.990

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765

$99.990

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Parana Technologies

USA . 1,674 parts In-Stock

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$0.067

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$0.067

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Corphita

USA . 1,021 parts In-Stock

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Authorized Procurement Solutions

USA . 365 parts In-Stock

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365

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Perfect Parts

USA . 347 parts In-Stock

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347

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EMSNET (Excess)

USA . 80 parts In-Stock

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Overview

Elevate your electronics projects with the SPV1001D40 diode by STMicroelectronics. Known for their top-quality components, STMicroelectronics delivers reliability and performance in every product. The SPV1001D40 is a versatile rectifier diode that can handle high output currents, making it ideal for a wide range of applications. From power supplies to automotive systems, this diode offers exceptional value and efficiency. Trust STMicroelectronics to provide the cutting-edge technology you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and protection for the diode, making it suitable for various applications.

Config: SINGLE

The single configuration simplifies the circuit design and installation process, making it easier to integrate this diode into different electronic systems.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation onto printed circuit boards, saving space and enabling efficient assembly.

Maximum Reverse Current: 1 uA

The low maximum reverse current ensures minimal power loss and improved efficiency in the circuit where this diode is used.

Package Shape: RECTANGULAR

The rectangular package shape provides a standardized form factor for easy integration and compatibility with existing circuit layouts.

No. of Terminals: 2

Having two terminals simplifies the connection process and reduces the chance of errors during installation.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, allowing for compact designs and efficient use of board real estate.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this diode can withstand elevated temperatures without compromising its performance or reliability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range ensures that this diode can function effectively even in cold environments, making it versatile for various applications.

Terminal Position: SINGLE

The single terminal position simplifies installation and reduces the risk of incorrect connections, ensuring reliable performance in the circuit.

Case Connection: CATHODE

The cathode case connection offers a standard polarity configuration, making it easier to connect and integrate this diode into the circuit.

Diode Type: RECTIFIER DIODE

As a rectifier diode, this product is designed to efficiently convert AC to DC currents, making it ideal for power supply and conversion applications.

Maximum Output Current: 16 A

The high maximum output current capability allows this diode to handle large currents, making it suitable for high-power applications where efficient rectification is required.

Terminal Form: GULL WING

The gull wing terminal form provides a strong and reliable connection, ensuring stable operation and durability in various electronic systems.

Maximum Non Repetitive Peak Forward Current: 250 A

With a high maximum non-repetitive peak forward current rating, this diode can handle surges and peak currents without damage, ensuring reliability in demanding conditions.

Diode Element Material: SILICON

Silicon is a common semiconductor material known for its efficiency and reliability in diode applications, ensuring stable performance and long-term durability.

Technical Specifications

Diodes & Rectifiers SPV1001D40 attributes and parameters. Explore more Diodes & Rectifiers devices from STMicroelectronics

Specs

Additional Features:

LOW LEAKAGE CURRENT

Application:

GENERAL PURPOSE

Case Connection:

CATHODE

Config:

SINGLE

Diode Element Material:

SILICON

Diode Type:

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

Maximum Non Repetitive Peak Forward Current:

250 A

No. of Elements:

1

No. of Phases:

1

No. of Terminals:

2

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

16 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Reverse Current:

1 uA

Surface Mount:

YES

Terminal Form:

Terminal Position:

Trade Compliance

SPV1001D40 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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